This one day short course is intended for those who wish to understand the technology, science, and components required to operate high vacuum pumping systems. Mechanical pumps covered include rotary vane, lobe, claw, multistage lobe, dry piston, scroll, and screw. High vacuum pump and systems reviewed include diffusion, turbo, and cryo pump. We describe how materials are chosen for use in vacuum environments, and how they are used in valves, O-ring seals, and feedthroughs.

Water vapor is traditionally difficult to remove during the roughing cycle, and we provide effective methods for minimizing its effect on pumping time.

Modern vacuum systems are designed for diverse applications; a major distinction is their unique crossover pressure ranges in which pumping switches from rough to high vacuum operation—a concept that is not well appreciated. We describe how to calculate the correct crossover pressure range for each major pump type.

Practical advice is offered for operators, engineers, and maintenance personnel. The course highlights useful and informative “Best Practices” for operating complex vacuum systems, e.g., guidance that would have been acquired historically through mentoring by experienced colleagues. Rapid technical developments and frequent career changes or added responsibilities, have left both experienced and new technologists in need of a reliable and concise information source.

The material in this short course is designed to replace the historic mentoring that is necessary to understand and operate modern vacuum deposition systems.

Optional text: J.F. O’Hanlon, and T.A. Gessert, A User’s Guide to Vacuum Technology, Fourth Edition, John Wiley, New York (2023). Its cost is not included in the course registration; however, participants who wish to purchase a copy may do so via: https://www.wiley.com/en-us/A+Users+Guide+to+Vacuum+Technology%2C+4th+Edition-p-9781394174133

Course Outline:

1. Working in the Vacuum Environment
We begin by describing commonly used vacuum technology terms and concepts.

• Useful terms and definitions
• Pump operating systems

2. Mechanical Pumps
The construction, characteristics, operating principles, and applications of the several mechanical pumps are reviewed here.

• Rotary vane
• Roots, claw, and multi-stage
• Dry piston, scroll, and screw
• Best Practices: Mechanical pumps

3. Diffusion Pump Systems
This section covers the construction and operating principles of the diffusion pump, and the operation of a typical diffusion pumped system.

• Construction and operating principle
• Backstreaming, baffles and traps
• Starting, cycling and stopping
• Best Practices: Diffusion pump systems

4. Turbo Pump Systems
The construction, characteristics, and operating principle of the turbo pump, and the operation of a typical turbo pump system.

• Turbo pump construction and operating principle
• Turbo drag pumps
• Starting, cycling, and removing power
• Best Practices: Turbo pump systems

5. Cryo Pump Systems
Construction, characteristics, and the operating principle of the helium-gas-refrigerated cryo pump, and operation of a typical cryo pump system are described here.

• Cryo pump construction and operation
• Cryo-condensation and cryo-sorption pumping
• Starting, cycling, and removing power
• Regeneration and maintenance
• Best Practices: Cryo pump systems

6. Selecting Vacuum Materials
Materials are carefully chosen for their compatibility with environment. This section reviews properties and compatibility of materials chosen for use in chambers, valves, seals, and feedthroughs.

• Metals, glasses and ceramics
• Elastomers and polymers in gaskets and seals
• Effects of outgassing and cleaning
• Best Practices: Vacuum materials/systems

7. Rough Pumping Large Systems
Production systems are designed for specific applications; therefore, roughing systems no longer look like, or are operated like, those described in historically dated books. This section describes roughing techniques for diffusion-, turbo-, and cryo-pump systems.

• Minimizing water vapor accumulation
• Preventing aerosol formation and deposition
• Best Practices: Reducing water vapor
• High-vacuum pump crossover pressures (diffusion, turbo, cryo, sputter-ion, TSP)
• Best Practices: Crossover pressure ranges

Instructor: John F. O'Hanlon, Professor Emeritus of Electrical and Computer Engineering, University of Arizona

This one-day short course is intended for those who wish to understand and operate a residual gas analyzer (RGA), and a helium mass spectrometer leak detector (MSLD). The course will focus on operation, use, data analysis and interpretation, process control, leak detection, and problem solving using the RGA.

The construction and operation of each component part: ionizer, mass filter, and detector is explained. Decoding a real mass spectrum is not always easy. Here we discuss individual ionization processes and how they combine to form signatures (cracking patterns) for gases and vapors of practical interest. Numerous cracking patterns for useful gases, vapors, lubricants, pump fluids, and elastomers are described, as well as practical methods for identifying these sources when they are hidden within the mass analysis of real environments.

We describe how the RGA can be used as a leak detector with a range of tracer gases to test both small and very large chambers.

The description, operation, and practical aspects of using an MSLD are covered in detail, including an extensive compilation of Best Practices for both MSLD and RGA that have been collected from decades of personal use. Commercial software will not be covered; however, this course will give technologists the understanding and practical knowledge they need to operate commercial equipment, to solve problems, and to communicate and explain their results with assurance and confidence.

Optional Text: J.F. O’Hanlon, and T.A. Gessert, A User’s Guide to Vacuum Technology, Fourth Edition, John Wiley, New York (2023). Its cost is not included in the course registration, but may be purchased via: https://www.wiley.com/en-us/A+Users+Guide+to+Vacuum+Technology%2C+4th+Edition-p-9781394174133

Course Outline:

1. Background Concepts
This section reviews the basic gas laws and gas flow concepts that are needed to understand the behavior of residual gas analyzers and leak detectors. Common terms, components, and system concepts that all participants should understand are defined and explained.

• Gas laws
• Gas flow
• Distinguishing between a mass spectrometer, a residual gas analyzer, and a helium leak detector

2. Residual Gas Analyzer: Instrument and Component Parts
The two main types of mass filters: magnetic, and electric separation are described along with common types of ionizers and ion counters.

• Instrument description
• Ionization methods
• Closed and open ionization sources
• Magnetic sector mass analyzer
• Quadrupole mass analyzer
• Detection methods

3. Analyzing Mass Spectra
Bombard of gases by energetic electrons creates numerous ion fragments. These fragments can confuse spectral analysis. This section describes the ways in which fragments are created and explains the advantages and limits of using an RGA to understand a vacuum environment. Numerous useful practical examples of ion fragment patterns (cracking patterns) of typical materials used in a vacuum environment are described and explained.

• Dissociative, multiple, and isotopic ion fragments
• Quantitative versus qualitative analysis
• Cracking patterns of commonly used gases, fluids, and solids
• Practical Examples

4. Additional RGA Techniques
This section discusses additional RGA concepts. Where a sensor is located and what it sees in the chamber affect its response. Gasket materials, nearby hot filaments, and nearby cryogenic and heated surfaces all contribute to the observed spectra, and sometimes confuse the analysis. These effects must be understood in order to accurately describe the gas environment. RGAs can also be excellent leak detectors.

• Sampling background gases
• Sampling high pressure process environments
• Permeation and outgassing of materials
• Using an RGA to detect leaks
• Outgassing from hot filaments
• Atmospheric pressure ionization mass spectroscopy, a specialized technique

5. Leak Detectors
A leak detector is either a bench mounted, or portable, self-contained residual gas analyzer that is optimized for use with helium or perhaps hydrogen-containing sampling gas. Leak detectors can be configured to find leaks in one of several ways that best depend on the system being tested. Methods for detecting leaks will be described followed by a detailed discussion of instrument types, connection methods, and response limits. This section concludes with an extensive list of Best Practices for leak detection.

• Need for a leak detector
• Leak detector connection methods
• Classical and counter-flow leak detectors
• Leak sensing response time and sensitivity
• Permeation of gaskets and probe time constants
• Sampling pressurized containers
• Safety: high voltage, helium, and Paschen's Law
• Leak testing very large chambers
• Hydrogen-based leak detection
• Best Practices for using leak detectors

6. Case Studies
Residual gas analyzers are capable of solving complex production and development problems quickly and efficiently. This concluding section describes five case studies that illustrate the utility and speed with which the RGA can solve production problems.

• Leaking supply gas valve
• Leaking external gasket
• Oil contamination from mechanical roughing and oil diffusion pumps
• Background residue from an improperly cleaned system
• Leak testing a very large thermal vacuum chamber

Instructor: John F. O'Hanlon, Professor Emeritus of Electrical and Computer Engineering, University of Arizona

This short course intended as a guide for the researcher or production specialist that has a requirement for a vacuum/thin film deposition system. It will cover topics including: turning an idea for a system into a pertinent RFQ; major price points of a system; how to get more system for less; and how to get effective support and training. Upon completion of the course, participants should know how to specify a system to cover the intended purpose(s), understand common options in terms of process requirements, price control strategies, how to set acceptance criteria to cover the purpose and still stay within budget, and how to make sure the vendor stays interested in keeping the system healthy.

Topical Outline:

• From concept to RFQ
• Vendor interactions and final pricing
• Getting facilities and labs in place
• Installation, training, acceptance
• Continued Support

Attendees in this tutorial receive course notes.

1. Introduction
Stages of a systems purchase from concept, to RFQ, to delivery and final acceptance.

• Define a budget minimum and maximum
• Outline as precise as possible all process requirements
• Vendor response to RFQ and further negotiations
• Site and facilities preparation
• Acceptance, payment, and continued training and support

2. Definition of Purpose
The hardest aspect of any capital equipment purchase is to properly define the purpose, current proposed use, and forseeable future use requirements.

• Defining the basic vacuum system in terms of base pressure – materials of construction and pumping system

• Define film deposition techniques
• List thin film requirements
• List required options: substrate heating; in-situ cleaning, ion assist, etc.
• List wanted options (not required but would be nice to have)
• List Acceptance Test Criteria

3. New versus Rebuilt Used Systems
This section covers weighing the options of a used/repurposed piece of equipment versus a new, built specifically for purpose system.

• Cost Savings versus possible performance limitations
• Possible cross-contamination issues
• Delivery Considerations
• Writing out performance specs and acceptance criteria
• Warranty, maintenance, support, and training

4. Writing the RFQ
The RFQ is a working document that allows interaction with vendors and a 1^st order of magnitude to be assigned to this system.

• System’s scope should be clearly defined
• Performance criteria need to be clearly stated
• “Must Have” components identified
• General guidelines for system construction
• Special Considerations (UL, NRTL, CA, CE, etc.)
• Required Delivery, penalty clauses, storage fees, cancelation of order fees
• Consider Working with a Consultant

5. Choosing Appropriate Vendors
Lining the RFQ up with an appropriate vendor is vital for successful fabrication of the system.

• Colleagues recommendations – the good and the bad
• Vendor interviews and asking tough questions

• Compare the proposed value of the system to the financial size of the company manufacturing the system
• Get the Lab/Cleanroom ready and facilities in place. Triple check.

6. Vendors Standard Products – do they work for your idea?
Often the system concept needs revised to fit into a standard design the vendor already has. Price and delivery are much more palatable but does that compromise the intended purpose/use of the system?

• Price and delivery impact on custom versus standard
• Putting your idea into a vendor’s standard “box” pro’s and con’s
• Review software and GUI details – compare between vendors
• Access vendor’s technical experts – do they understand what you need?
• Changing the RFQ without changing the purpose of the system
• Consider having a consultant review before awarding order

7. Training/Support/Maintenance/Warranty
The key to implementing and reaping the benefits of a new system is to understand what needs to be in place to make the system work in your facility with your personnel.

• The case for systems acceptance at the vendor’s facility
• Training – quantity and quality
• Planning for proper maintenance
• What’s covered under the warranty – what is not covered?
• How to make the vendor interested in keeping this system healthy and operational

Instructor: Rob Belan, Kurt J. Lesker Company - Pittsburgh, PA

This one-day class is recommended for Engineers, Technicians, and Scientists interact with vacuum processing in their professional endeavors. Maintenances of vacuum hygiene is essential for process control and repeatability. The development of leaks is an everyday occurrence and the ability to quickly locate them and affect a repair is critical.

Beginners as well as experienced users of leak testing equipment will benefit from this course as the material presented will give them a good understanding of basic vacuum and leak testing. Different leak testing methods available and useful tools will be described and compared. Further, attendees will learn how to select the right leak testing method as well as the correct leak testing equipment to meet their application requirement. Throughout the class participants will have the opportunity to do practical exercises to get the maximum out of the training.

Topical Outline:

• Leaks: Defects
• Calibrated Leaks
• Introduction to Vacuum
• Surface and Other Effects in Vacuum
• Gas Flow in Vacuum
• Vacuum Equipment and Components
• Introduction to Helium Leak Detection
• Leak Rate Establishment
• Leak Detection Application Examples and Solution: Vacuum Coater

Attendees in this tutorial receive course notes.

1. Leaks: Defects
   1. Is there such thing as “NO LEAK”?
   2. Physical leak and definition.
   3. Types of leaks and potential impacts.
   4. Leak flow definition.
   5. Equivalent leak hole sizes.
   6. Micro scale objects
   7. Contaminants size and potential impact.
2. Calibrated leaks:
   1. Overview and purposes
   2. Open style and reservoir technology.
   3. Examples of calibrated leaks.
   4. Calibrated leaks depletion rate.
3. Introduction to vacuum:
   1. Vacuum definition.
   2. Gas density
   3. Vacuum level and description.
   4. Temperature effects on vacuum/pressure levels.
   5. Power of ten and logarithmic scales.
   6. Vacuum scale, absolute versus relative pressure.
   7. Vacuum measurements.
   8. Pressure conversion chart.
   9. Elevation versus pressure.
   10. Vacuum in space.
4. Surface and other effects in vacuum:
   1. Virtual leaks and solutions to address them (threads, welds, and seals).
   2. Vapor pressure graph.
   3. Water phase diagram.
   4. Water vapor facts.
   5. Outgassing principle.
   6. Permeation.
   7. Gas loads (or sources) in a vacuum system.
   8. Minimizing outgassing.
   9. The pump down process in a vacuum chamber.
   10. Is it a leak or outgassing?
   11. What happens when a gas molecule hit a fixed wall versus a moving surface?
5. Gas flow in vacuum:
   1. What is the purpose of a vacuum system?
   2. Gas flow terminology.
   3. Vacuum flow regimes.
   4. Flow characteristics.
   5. Pumping speed.
   6. Air conductance of a vacuum line.
   7. Air and helium conductance relationship.
   8. Impact of conductance on pumping speed.
6. Vacuum equipment and components:
   1. Main difference between rough vacuum and high vacuum pumping methods.
      1. Dual state rotary vane pump oil lubricated mechanical pump.
      2. Scroll dry pump.
      3. Multi-state dry roots vacuum pump.
      4. Typical roughing pump characteristics.
   2. High vacuum pump technologies.
      
      1. Hybrid turbomolecular drag pump concept.
      2. Typical hybrid turbo molecular drag vacuum pump characteristics.
      3. Example of a pump down graph of a high vacuum pumping system.
      4. Magnetic levitation (Maglev) hybrid turbomolecular pump.
      5. Potential catastrophic air-in rush turbopump crash.
7. Introduction to helium leak detection:
   1. Why helium?
   2. Where does helium come from?
   3. Where is helium produced?
   4. Helium gas applications.
   5. Some helium leak detection applications.
   6. Helium mass spectrometer leak detector benefits.
   7. Helium leak detector wide range capability.
   8. Helium leak detector main components.
   9. Dual filament analyzer cell 180-degree deflection.
   10. Analyzer cell 180-degree deflection - Mass separation
   11. Filament technologies (pros and cons).
   12. Preamplifier technologies comparison.
   13. Typical benchtop helium leak detector vacuum diagram description.
   14. Typical benchtop helium leak detector start-up and test sequences.
   15. Calibration of a helium leak detector and its frequency.
   16. Helium leak testing methods:
       1. Manual sniffing.
       2. Accumulation sniffing.
       3. Direct hard vacuum, outside-in and inside-out.
       4. Bombing.
       5. Split flow configuration and alternatives.
   17. Response time and appearance time.
   18. Disappearance time.
   19. High helium background root causes.
   20. Helium background calculation and management.
   21. Nitrogen venting and purging, hard vacuum.
   22. High helium background situation, how to handle it?
   23. Floating auto-zero - zoom function.
   24. Helium percentage and impact on leak rate.
   25. Typical HLD commercial published specifications.
   26. Top 10 guidelines for helium leak detection.
8. Leak rate establishment:
   1. Meeting specific standards.
   2. Defining leak rate criteria.
   3. Different ways to express a leak rate.
   4. Leak flow overview - flow regimes.
   5. Viscous and molecular flow leak.
   6. Converting gas leak rates in viscous and molecular flows.
9. Leak Detection Application Examples and Solutions:
   1. Leak testing in a vacuum coater.
      1. Best location to connect the helium leak detector.
      2. Best location to connect the helium calibrated leak.
      3. How to measure the leak detector response and disappearance time.

Instructor: Jean-Pierre Deluca, BDL Redwood - Boston, MA

This one-day tutorial course will provide students with an understanding of a vacuum system through hands-on activities and demonstrations on a High Vacuum Equipment Trainer (HVET). This tutorial is intended for operators, process engineers and technicians who work with vacuum equipment but wish to possess a deeper understanding of how a system is configured and operated. The course will address the structure of a typical high vacuum system, the role of the key system components and how the components work together to form a functional process system. We will also investigate how to establish the baseline performance of a high vacuum system and the techniques used to troubleshoot problems typically encountered.

Topical Outline:

Rough vs. high vacuum

• High vacuum system structure and schematics
• Manual operation of a high vacuum system
• Vacuum pumps, gauges, valves and mass flow controllers
• Baseline testing: pumpdown and rate of rise
• Calculation of gas load, conductance, effective pumping speed and system base pressure
• Conductance testing: mass flow controller

Instructor: Tom Johnson, Normandale Community College - Bloomington, MN

This tutorial is intended for those who wish to understand how to analyze the performance of a vacuum system. Basic vacuum gauges that measure pressure in the low vacuum and in the high vacuum region will be described. Residual gas analyzers provide a useful method of analyzing the performance of a system and how various components are operating by looking at the partial pressures of individual gases. The class concludes with a discussion of leak detection: when it should be attempted and how to detect leaks with a pressure gauge, an RGA, and a mass spectrometer leak detector.

Topical Outline:

Gas laws

• Gas flow
• Vacuum gauges
• Residual gas analyzers
• Leak detection

Gas Laws

The important laws that describe the behavior of gas in a vacuum system are described in this module. These laws and concepts explain how vacuum systems behave.

• The laws of Boyle, Charles and Dalton describe the relationship between pressure, volume and temperature.
• The Ideal Gas Law simplifies these laws in one relationship.
• The average velocity of a gas and the mean free path between gas collisions are two most important ideas that help define how gas behaves in real situations.
• Review questions and summary of answers

Gas Flow

How gas flows in pipes and through chambers is most important. It is the basis of how pumps and pipe sizes are chosen. This module describes the important flow regions and how they apply to a vacuum system.

• Viscous, intermediate, and rarefied gas states
• Turbulent flow
• Choked turbulent flow
• Molecular flow
• Describing molecular flow with transmission probability
• Calculating the transmission probability of a pipe or component.
• Why traps collect condensable vapors but not non-condensable gases
• Review questions and summary of answers

Vacuum Gauges

Although there are dozens of pressure measuring techniques, this module is limited to describing only the most common commercial gauges used today.

• Thermocouple gauge
• Pirani gauge
• Capacitance manometer
• Direct versus indirect pressure measurement
• Bayard-Alpert ionization gauge
• Pressure measurement errors
• Review questions and summary of answers

Residual Gas Analyzers

A residual gas analyzer—often called a mass spectrometer—is an instrument that can measure a signal proportional to the quantity of individual gas and vapor components. This module is limited to describing the analyzer—the equipment—used to separate and identify individual components in a vacuum atmosphere

• Ionization stage
• Magnetic sector mass sorting stage
• Radio frequency mass sorting stage
• Detection stages
• Examining a typical analysis pattern
• Sampling a system background gas
• Sampling a gas in a sputtering system by means of a pressure reduction stage
• Review questions and summary of answers

Residual Gas Analysis

The analysis of the measured analysis pattern is often not so complex as first thought. In this module we break the observed spectrum into many small parts and examine each separately. Then, we put these together and learn characteristic shapes of spectra for typical situations such as a clean vacuum system, a leaky vacuum system, an oil-contaminated system, synthetic fluids, greases, O-rings, a gas line leak, a water line leak, and so on.

• Gas dissociation
• Gas isotopes
• Multiply ionized gases
• Typical spectra of clean and leaky systems
• Spectra from mineral oils, silicone and other synthetic pump fluids
• Spectra from elastomer gaskets
• Spectra from cleaning fluids
• Why residual gas analyzers cannot measure partial gas pressures very accurately.
• Review questions and summary of answers

Leak Detection

Detecting leaks is a most important application that uses pressure gauges or residual gas analyzers. This module describes when and how to check for leaks in components and systems. It also provides many nuts-and-bolts tricks to leak check difficult locations and components

• How gas flows through leaks
• When to leak detect and when not to leak detect
• Using pressure gauges to detect leaks
• Using sound and hearing to detect leaks
• Using a helium mass spectrometer to detect leaks
• Using a residual gas analyzer to detect leaks
• Where to connect a leak detector: sensitivity versus response time
• Practical hints for detecting leaks
• Review questions and summary of answers

Instructor: John F. O'Hanlon, Professor Emeritus of Electrical and Computer Engineering, University of Arizona

This tutorial course is intended for those who wish to learn how diffusion and cryo pump systems operate, how to choose materials for vacuum use, and how to pump water vapor properly during the rough pumping cycle. At the end of this tutorial, a participant should be able to explain the operation of diffusion, and cryo pumped systems; understand how materials are chosen for use in vacuum, and how to rough pump water vapor without producing condensation.

Topical Outline:

Introduction

• Rotary mechanical pumps
• Diffusion pumps and systems
• Cryogenic pumps and systems
• Materials suitable for vacuum use
• Methods for rough pumping water vapor.

Introduction

This module is designed to ensure that all participants have the same starting knowledge, basic definitions, and descriptive terms used in vacuum technology.

• Define a gas
• Define pressure
• Describe components of an atmospheric and a vacuum gas
• Describe basic vacuum applications
• Outline the functions of each component in a system
• Review questions and summary of answers

Rotary Mechanical Pumps

This module covers the construction, characteristics, operating principles, and applications of the following low-rotational speed mechanical pumps:

• Rotary vane pumps and gas ballast
• Piston pump
• Roots and Claw pumps
• Claw pump
• Screw. Scroll, and Diaphragm pumps
• Review and Summary

Diffusion Pump Systems

This module first covers the construction, characteristics and operating principles of the diffusion pump. After these concepts are described, the construction and operating principles of a typical diffusion pumped system are covered.

• Diffusion pump construction and operating principle
• Backstreaming, Baffles and Traps
• Starting, cycling and stopping a diffusion pump system
• Preventing contamination from oil migrating from pumps to chamber
• Preventive maintenance issues
• Review and Summary

Cryopump Systems

This module first covers the construction, characteristics and operating principles of the cryo pump. After these concepts are described, the construction and operating principles of a typical cryo pumped system are covered.

• Pump Construction
• Cryocondensation and Cryosorption Pumping
• Pumping Arrays
• Refrigerator Operation
• Starting, Cycling, and Stopping a Helium Cryo Pump
• Regeneration and Maintenance
• Review and Summary

Materials in Vacuum

The properties of the materials used within vacuum environments are central to the proper construction and performance of large systems. This module describes fundamental, important properties of common materials used in a vacuum environment.

• Metals
• Glasses and Ceramics
• Polymers and Elastomers
• Cleaning and Outgassing
• Review and Summary

Rough Pumping Large Systems

Most practical production systems today are designed for a specific application. Because of their size, roughing systems are no longer simple. This module describes roughing techniques for several kinds of vacuum pumping systems and applications.

• Preventing water aerosol formation
• Preventing particle formation
• Crossover to a Diffusion Pump
• Crossover to a Turbo Pump
• Crossover to a Cryo Pump
• Review and Summary

Instructor: John F. O'Hanlon, Professor Emeritus of Electrical and Computer Engineering, University of Arizona

Developed mainly for technicians and process engineers, the main objectives of this course are to impart enough knowledge to the student to analyze spectra, use that analysis to determine what problems may exist in their process chamber, and thereby help in trying to solve these problems.

This course deals with analysis of Mass Spectrometer (RGA) data. It begins at an elementary level, first describing atoms, then atomic electronic structure, followed by a description of the filling of electronic shells and sub shells. Using information about how atoms are formed, we move to molecule formation and discuss the different types of molecular bonds. Understanding molecular formation is essential to understanding and interpreting mass spectra. The operation of a mass spectrometer is next described, especially phenomena that occur in the ion source. Using all this information we begin discussion regarding the interpretation of the spectra from a mass spectrometer. Typical mass spectrometer spectra are shown and analysis of the spectra is demonstrated.

The course begins with elementary nuclear physics, followed by atomic and molecular physics and continues with the study of the chemistry of molecules. A few pertinent examples, e.g. water and methane, are presented and used to demonstrate how one analyzes more complicated molecules.

We briefly discuss mass spectrometer operation because one needs to understand how the operation affects spectral analysis. Probably the most important effect is the interactions of molecular ions in the ion source to form new/different molecular ions. Other areas addressed are molecular breakup in the ion source and nuclear isotope effects.

Various data presentation types are described along with suggestions for their preferred order for different types of analyses. Additionally many relevant tables, graphs, and references are presented.

Topical Outline:

• Basic nuclear physics knowledge presentation
• Basic atomic electronic structure presentation
  - Atomic physics
  - Filling order of electronic shells and sub shells
  - Use of the periodic table in mastering molecular formation

• Discussion of the formation and chemistry of molecules which is essential to understanding and interpreting mass spectra

• Discussion of the operation of a mass spectrometer especially phenomena which occur in the ion source, i.e. molecular formation and breakup

• Typical mass spectrometer spectra are shown for representative molecules and analysis of the spectra are demonstrated

• Vacuum chamber leak checking and correction using a mass spectrometer

Instructor: Robert (Bob) A. Langley, Oak Ridge Scientific Consultants

This one-day course is designed to provide a foundation necessary to understand general scientific concepts of vacuum technology, and expands into a discussion of the design of use of vacuum gauges. A time for lunch generally separates these two content areas. The course can be customized somewhat to focus on content that may be of particular importance to a group of students.

The morning content begins with a brief history of vacuum technology, starting at about the time of Galileo. The course proceeds with a description of the differences between the development of the physical properties of pressure, volume, temperature, and amount of gas - as described in the historic “Gas Laws,” and continues with a description of the difference and importance of what is now known as the “Kinetic Theory” of gases. The discussion continues describing how gas molecules move from one place to another in a vacuum system, the parameters of molecular vs. viscous flow, finally describing the parameters of conductance and pumping speed. With these parameters established, the foundations of an equation to calculate the pump-down time are presented and examples given. The limitations of this simple equation are presented, which leads into a discussion of the critical importance that outgassing – from within the chamber - has on the ability of a chamber to attain a desired vacuum pressure within a desired time.

The afternoon content describes typical gauges used in vacuum technology. This content begins with a discussion of the importance of understanding the concept of precision of pressure measurements, and the importance of knowing when high-precision vs. low-precision measurements are required. This is compared to other situations when when a simple, yet accurate, trend analysis may be appropriate and/or preferred. Discussion continues with review of the difference between measuring an actual pressure (in force per unit area) and measuring some other parameter - and relating it back to a force per unit area. The first category of vacuum gauges discussed are manometers (Hg-type, diaphragm, Bourdon, capacitive, and piezoresistive manometers). The second category of gauges includes thermal gauges (thermocouple- and Pirani-type gauges). The final gauge category is ionization gauges (hot-filament and cold-cathode types). The course concludes with a discussion of partial-pressure gauges, with the majority of the discussion being an introduction to the instrumentation and use of residual-gas analyzers, primarily of the quadrupole type.

Instructor: Timothy Gessert, Gessert Consulting, LLC

This one-day course is designed to overview pumps typically used in the main stream of vacuum technology. Although the content of the course is most optimally presented when preceded by the one-day course on Fundamentals of Vacuum Technology and Vacuum Gauges, it can often be customized to provide necessary framework and/or background for the concepts and discussion presented.

Course presents an overview of the 3 basic types of physical pumping mechanisms (Positive Displacement, Momentum Transfer, and Capture). Vacuum pumps used in typical vacuum applications are discussed as examples of each pumping mechanism. Discussion also provides a baseline description of the types of maintenance activities that can be expected when using each specific type of vacuum pump. The section on positive-displacement pumps begins with a detailed discussion of the historic oil-sealed, rotary-vane pump. This pump is often familiar to most of the students, it remains widely used in may industry applications, and therefore its description provides a useful baseline for many of the terms that will be used to describe the other types of pumps. The discussion on oil-sealed pumps also describes development and use of modern vacuum-pump fluids and greases, and their proper selection and use. Discussion then moves to positive-displacement dry pumps (blower pumps, claw compressors, screw pumps, piston pumps, diaphragm pumps), with particular emphasis placed on the development, applications, and maintenance of the design, use, and maintenance of modern scroll pumps. The next category of pump discussed are momentum transfer pumps, including the historic diffusion pump, as well as the modern turbomolecular, drag, and regenerative pumps. The final category of pumps is capture pumps. This discussion includes a quick review of the historic bulk-getter pumps (e.g., Titanium sublimation) as well as modern non-evaporating getter (NEG) pumps. Sputter-ion pumps are next discussed, but the detail level of this discussion is gauged to the student’s needs. The final pump discussion relates to cryogenic-type pumps, with a brief review of cryosorption and cryocondensation pumps, and a much more detail detailed discussion of cryogenic pumps. The section on cryogenic pumps also includes detailed discussion of the development, operation, and typical maintenance issues related to cryogenic closed-cycle helium refrigeration systems.

Instructor: Timothy Gessert, Gessert Consulting, LLC

This one-day course is designed to overview materials and processes typically used in vacuum technology, including equipment and processes used for basic vacuum Leak Detection. Although the content of the course is most optimally presented if the course is preceded by appropriate content from other courses, such as Fundamentals of Vacuum Technology, Vacuum Gauges, and Vacuum Pumps, it can often be customized to provide necessary framework/background for the concepts and discussion presented. The course is typically divided into Vacuum Hardware in the morning, and Vacuum Leak Detection in the afternoon, separated by a time for lunch.

The course begins with a general discussion of the many types of material or process parameters that need to be considered with regard to the design of specific vacuum hardware. These parameters include not only well-established physical parameters, (e.g., structural, electrical, optical, thermal, vapor pressure) but also less-well-defined, yet very important practical parameters (e.g., machinability, formability, vapor pressure, absorption/outgassing rate, etc.). With these foundation in place, the course proceeds into three main areas of examples and discussions: (1) Materials used in vacuum systems and components - including detailed discussions of particular metals, elastomers, glasses, and ceramics; (2) Procedures used in joining and forming vacuum materials - including both non-demountable (e.g., welding) and demountable (e.g., flanges) designs and procedures; (3) Components used in vacuum systems - including various types of valves (e.g., butterfly, poppet, gate, throttle, etc.), gas-flow components, feedthroughs, viewports, and filtration equipment. In all cases, the influence that important operational concerns, such as desired vacuum pressure and operational temperature, will have on component selection are discussed.

Content on Vacuum Leak Detection includes: (1) A foundation of various types of products that require low or very-low leakage; (2) An explanation of various units of leak rate, and; (3) Discussion of situations that lead to real vs. perceived leaks. Different types of leak-detection options are presented including dye-penetrant, radioisotope exposure, and high- or low-pressure methods. The remainder of the course focuses on the most typical leak detection techniques in vacuum technology - “low-pressure methods.” This discussion begins with examples of why an understanding “standard system performance” is essential to effective leak detection procedures. While most discussion focuses on the theory and operation of the Helium Mass Spectrometer (HMSLD), other “low-pressure” techniques are also presented (e.g., methanol penetration). The discussion of the HMSLD begins with its historical development, maintenance issues, and typical methods of using any HMSLD (e.g., Bagging, Probing, Sniffing, and Bombing). With an understanding of HMSLD use established, guidance on various hook-up configurations are presented, followed by key mathematical parameters (i.e., Rate of Pressure Rise, Ultimate Pressure Increase, and Time Constant of the Response Time). The course concludes with guidance of various typical options available to fix a leak when one is found.

Instructor: Timothy Gessert, Gessert Consulting, LLC

This one-day course is designed to expose the student to design procedures and tools needed for undertake effective planning for procurement of either standard or advanced vacuum systems. Although the content of the course is most optimally presented if the course is preceded by appropriate content from other courses, such as Fundamentals of Vacuum Technology, Vacuum Gauges, and Vacuum Pumps, it can often be customized to provide necessary framework/background for the concepts and discussion presented. The course is typically divided into discussion of Design Considerations and Ramifications in the morning, discussion related to Chamber Design and System Performance in the afternoon, separated by a time for lunch.

The course begins with a brief overview of the physical environment within a vacuum system, and the related mathematical formulations that need to be appreciated when designing a vacuum system for optimum performance. The course next introduces the concept of major design Considerations including: (A) the Purpose of the system, (B) the Work Size and/or Processing Time constraints, and (C) Ambient. The course then describes how these Considerations related to hardware Ramifications including: (A) Dimensions and Layout, (B) Chambers and Valves, and (C) Vacuum Pumps and Traps. In all cases, the influence that important operational concerns, such as desired vacuum pressure, gas mixtures, and operational temperature, will have on selection of components that comprise the system are discussed.

Once the basic operational criterial of the to-be designed system are established, the course progresses to discuss material and design criterial for vacuum chamber and overall layout considerations for locations within the chamber for specific vacuum processes and monitoring. The course proceeds with some simple calculations of pump-down time for various chamber/pump combinations, as well as how to appropriately size both low and high vacuum pumps, using both single and multiple chamber design assumptions. The course concludes with some comments on pre- and post-assembly cleaning of vacuum system components, and design considerations for reduction of particles during vacuum processing. Concluding comments also discuss important design considerations related to (higher) conductance of vacuum lines when these are at pressures consistent with viscous flow.

Instructor: Timothy Gessert, Gessert Consulting, LLC

(The course is a revised and updated version of V-207)

This tutorial is designed to teach the basic fundamentals of vacuum technology to technicians, equipment operators, line process operators, and maintenance personnel. This tutorial will address how to use and maintain an existing vacuum effectively, not how to design a system. The introduction will consist of a very basic explanation of what a vacuum is and how it is attained and proceeds to an explanation of the three gas flow regimes (i.e., viscous, transition, and molecular flow). This is followed by a description of the types of pumps used in the viscous flow region (e.g., mechanical displacement pumps, venturi/suction pumps, and sorption pumps). Types of high vacuum pumps are next discussed; these include diffusion pumps, turbopumps, and cryopumps. Presented next is a guide for selecting a pressure gauge which includes a description of various types of gauges and details their useful pressure range and measurement precision.
Topical Outline:

• Introduction to vacuum
• Explanation of the three gas flow regimes
• Viscous flow pumps
• High vacuum pumps
• Guide for selecting a pressure gauge
• Care and maintenance of pumps and vacuum systems, including both compressible “rubber” gasket and metal gasket systems
• Evaluating system performance: pumpdown rate and leak-up rate
• Leak detection and correction
• Cleaning and conditioning of vacuum components and system
• Operation of vacuum systems: crossover pressure, interlocks, and safety
• Applications of vacuum systems for vacuum coating
• Pumpdown and outgassing
• Descriptions of other vacuum related tutorials presented by SVC

Tutorial Description

This tutorial is designed to teach the basic fundamentals of vacuum technology to technicians, equipment operators, line process operators, and maintenance personnel. This tutorial addresses how to use and maintain an existing vacuum system effectively, not how to design a system.  The introduction consists of a basic explanation of what a vacuum is and how it is attained and proceeds to an explanation of the three gas flow regimes, i.e. viscous, transition, and molecular flow. The many variations of units of pressure and flow are discussed.

This is followed by a description of the types of pumps used in the viscous flow region, e.g., mechanical displacement pumps, venturi/suction pumps, and sorption pumps. Types of high vacuum pumps are next discussed; these include diffusion pumps, turbopumps, and cryopumps.

The following section deals with selecting the best type of pressure gauge for your application. This includes descriptions, limitations and advantages of the following gauges: thermocouple gauge, Pirani gauge, ionization gauge, radioactive pressure gauge, spinning rotor gauge, capacitance manometer, and McLeod gauge.

The next section deals with the care and maintenance of pumps and vacuum systems including both compressible ‘rubber’ gasket and metal gasket systems.  Included in this section is a review of vacuum pump fluids and greases, their uses and how to make effective choices for pump fluids for the many various applications.  Continuous filtering and treatment of pump fluids is presented along with techniques to determine when pump fluid should be changed.

Cleaning and conditioning of vacuum components and system is discussed with emphasis on metal and insulator materials.  The unique role that water plays in both pumpdown from atmosphere and in outgassing is addressed and techniques to ameliorate its harmful effects are presented.  The effects of other unique gases, i.e. bad actors, are discussed.

In addition system pumpdown from air is discussed and techniques to evaluate system performance, i.e. pumpdown rate and leak-up rate, are presented.  Techniques for detection of system leaks and their correction are discussed as well as outgassing and permeation.

Finally operation of vacuum systems is discussed with emphasis on determining crossover pressure, interlocks, safety, and documentation. 

Many useful charts and tables are presented and their use explained.

Participants are requested to present any problems or difficulty that they may be experiencing with their vacuum systems to the tutorial instructor and fellow students for discussion. This makes for very interesting examples and who knows, the problem might actually get solved.

This tutorial will conclude with short descriptions of the other pertinent vacuum related tutorials presented by SVC.

Instructor: Robert (Bob) A. Langley, Oak Ridge Scientific Consultants

This tutorial is on the use of kinetic simulation methods to describe low-pressure gas flows and plasma processes. These methods include the Direct Simulation Monte Carlo (DSMC) – method for rarefied gas flows as well as the Particle-in-Cell Monte-Carlo (PIC-MC) – method for low-density, non-equilibrium plasmas. For gas flow simulation, the different flow regimes – i.e. molecular flow, continuous flow and transition flow – and their implications on the modelling method are discussed. Shown practical examples include flow conductance determination for vacuum components, evaporation and deposition profile in PVD processes as a function of total pressure. Additionally, the meaning of non-local effects at very low pressure as well as collective effects on the transition between molecular and continuous flow are illustrated.

Reactions between gas phase and surfaces can have significance influence on the global process dynamics. This is demonstrated in a model for reactive sputtering, where the surfaces can be either oxidized or metallic. A 2D model with spatially resolved, dynamic surface coverages illustrates the hysteresis effect in reactive magnetron sputtering.

In the field of plasma simulation, the role of the magnetic confinement in magnetron sputtering is shown together with dynamic plasma features such as rotating spokes, that can be observed in simulation and experiments. Another topic will be the impact of pulse sputtering on the plasma potential and ion energy distribution function at the substrate.

Kinetic simulation of processes in deposition reactors yield the detailed growth conditions at the substrate consisting of the energy and angular distribution functions of ions and neutrals. This tutorial shows how kinetic simulation methods can be connected with atomic film growth simulation models in order to predict not only process dynamics and deposition uniformity but also intrinsic film properties.

Finally – based on the angularly resolved particle flux near the substrate – a fast, ray-tracing based algorithm is shown for prediction of the film thickness profile on curved substrates as a function of uniformity masks and substrate movement trajectory. Such an algorithm can be tuned to certain deposition process conditions and be used to realize a specified film thickness profile by iterative optimization.

Instructor: Dennis Barton, Fraunhofer Institute for Surface Engineering and Thin Films IST - Braunschweig, Germany

Ellipsometry is an important characterization technique for optical coatings. This tutorial will build an understanding of ellipsometry fundamentals. We start with basic theory behind optical measurements and discuss how ellipsometry extracts thin film properties such as single and multi-layer film thickness, complex refractive index, porosity, conductivity, and composition. A wide range of ellipsometry applications will be surveyed, with emphasis toward optical coatings.

The level of this tutorial is suitable for those new to the field of optical characterization but also contains worth-while information for current ellipsometry users. It will benefit anyone interested in exploring the potential of ellipsometry measurements.

Topical Outline:

• Principles of ellipsometry
• Optical constants and light-matter interaction
• Using Ellipsometry to measure material properties
  • Film thickness, complex refractive index, …
• Survey of applications:
  • What can Ellipsometry measure?
  • Ex-situ, in-situ, and in-line examples.

I. Principles of Ellipsometry
• Light and Polarization
• Optical constants and light-matter interaction
• Model-based Analysis

II. Using Ellipsometry to Measure Material Properties
• Film Thickness
• Complex Refractive Index
• Surface and Interfacial Regions
• Optical Gradients
• Composition
• Crystallinity
• Conductivity

III. Survey of Applications: ex-situ, in-situ, and in-line
• Optical Coatings
• Transparent Conductive Oxides
• Thin Film Photovoltaics
• In-situ and In-Line Monitoring and Control

Instructor: James N. Hilfiker, J.A. Woollam

This introductory course covers the fundamentals of X-ray photoelectron spectroscopy (XPS), which is the most widely used and important method for chemically analyzing surfaces. This class is intended for scientists, engineers, and technicians who would like both a basic, working knowledge of the technique and the ability to understand and interpret XPS data, including survey and narrow scans. XPS is an important tool for understanding surfaces in many areas of technology, including in semiconductor manufacturing, failure analysis, thin film deposition, tribology, wetting, biosensors, coatings, catalysis, and electrochemistry. After taking this course, the student should understand the basic physics of XPS and how an XPS instrument works, including how X-rays are generated, why XPS is surface sensitive, the fundamental equation of XPS, how spin-orbit splitting dictates the type of peaks that are present in a spectrum, and the nomenclature of XPS (and Auger) lines. The student should also be able to identify/calculate the elements that are present at a surface, their concentrations (with appropriate caveats), and be able to understand some basic peak fitting.

Topical Outline:

• Why XPS?
• Introduction to XPS
• XPS Basics
  • Simple schematic of an XPS instrument
  • X-ray generation
  • XPS as a high vacuum technique
  • The fundamental equation of XPS
  • Why XPS is surface sensitive
  • Nomenclature of XPS and Auger Lines
  • Components of an XPS instrument (generating X-rays, Bremsstrahlung, X-ray monochromators, etc.)
  • Charge neutralization
• XPS survey spectra
  • Photoelectron peaks
  • Auger signals
  • Baseline rises
  • Phonon loss signals
  • The valence band

• Spectral interpretation
  • Peak shapes
  • Baselines
  • Chemical shifts
  • Shake-up peaks
  • Peak asymmetry
  • Baseline rises (buried layers)
  • C 1s peak fitting
  • Uniqueness plots
  • Bad examples of spectral interpretation

• Quantitation
• Reference signals (e.g., C 1s)

Instructor: Matthew Linford, Brigham Young University

This course emphasizes issues of practical importance to those who use Design of Experiment (DOE) methodologies in the R&D or production environment. It is intended for scientists, engineers, and technicians who would like an understanding of DOE concepts and the practical challenges that can arise when incorporating them into one’s experimental practices. The basic introduction to DOE and discussion of fundamental assumptions will be useful to those unfamiliar with DOE concepts. The discussion of complications and examples of how they can be addressed will be useful to those who are experienced with DOE and are interested in achieving better results from applying DOE principles. Managers of groups involved in R&D and production will find the material helpful in their efforts to support the work in their groups.

This Webinar will be equally useful for students, engineers and technicians who are working with any thin film deposition process or are planning to work in related areas.

Topical Outline:

• Underlying assumptions of DOE
• DOE designs for screening factors
• DOE designs for modeling responses
• Response surface forms - the twisted plane, saddles, and domes
• Complications that arise - when is a factor not really a factor?
• More complications - dealing with non-linear responses
• Simulated experimental examples
  • screening factors
  • modeling responses
• Plasma web treatment example
• determining a suitable process factor space
• redefining the factor space using plasma diagnostics
• applying a physical model of the modification process

Instructor: Jeremy M. Grace, IDEX Health & Science

Revolutionary new capabilities for monitoring physical health of humans, machinery, and the processes governing the climate and condition of our entire planet are currently in development. Low cost flexible electronic devices play a critical role in these endeavors. This course will trace the evolution of reliable, large-area, flexible electronics and associated technologies, and will cover fabrication approaches such as chip attachment, thin-film devices, and nanoscale self-assembled and printed device based coatings. Additionally, fundamentals of state of the art fabrication techniques including vapor phase processing and direct fabrication approaches such as printing with aerosols and particle-based inks featuring advanced electronic materials to enable flexible electronic devices will be presented.

Topical Outline:

• Flexible electronics overview
  • General concepts
  • Applications

• Evolution of synthesis and fabrication methods optimized for flexible electronics
  • Flexible silicon
  • Organic electronics
  • Ultra-thin, or 2D materials

• Synthesis and processing methods for flexible electronics
  • Substrate considerations and preparation
  • Vapor phase processing
  • Printing
  • Photonic annealing

• Mechanical and electronic properties of flexible electronic devices
  • Limitations on flex – performance vs. strain
  • Lifetime dependence on strain

• Characterization and device integration
  • State of the art approaches for flex characterization
  • Challenges unique to flexible platforms

• The future of flex
  • Performance potential
  • Market/application projections

Instructor: Christopher Muratore, University of Dayton - Dayton, OH

This tutorial covers the basic information needed to produce state-of-the-art ophthalmic coatings ranging from the coating characteristics to the production of coatings and process trouble shooting. The course is intended for technicians, floor shop managers and senior operators working in the ophthalmic industry dealing with the day to day traps of operating coating equipment, running processes, and the infrastructure that supports both.

The tutorial begins with the fundamentals of Ophthalmic coating and discusses the issues associated with selecting the best coating processes in terms of coating quality, process management and process performance on a day to day basis. An overview of the main processes for producing ophthalmic coatings is given, which includes hard coating by dip or spin methods, anti-reflective coatings by vacuum deposition processes, and ion assisted PVD. Test methods as leak rate determination are used to evaluate processing equipment and coatings are also overviewed, which covers tests for physical, chemical and mechanical properties for lifetime performance expectancy. Finally, functional coatings that have been developed and utilized for some specific applications will be discussed as well as troubleshooting for typical errors and how to recognize and prevent them.

Topical Outline:

• Coatings on ophthalmic lenses – Why use them and what are the characteristics
• Machines used in ophthalmic and the necessary infrastructure to operate them successfully
• Coating processes used and their application
• Benefits and risks of specific machine types and related processes
• The sampling method as measured standard and its consequences for batch processes
• The need for consistency, stable robust processes, high FPY and strict maintenance
• Testing methods in-house; per batch, per machine
• Testing methods at test facilities as COLTs for independent benchmarking of quality
• The Do´s and Dont’s of day-to-day production – Why pessimists are the best coating practitioners
• State-of-the-art coatings, properties, and applications

Instructor: Georg Mayer, Rodenstock GmbH - Munich, Germany

The half-day tutorial is designed to introduce the concept of solid-state thin film batteries to designers and component fabricators who are looking for a micro-sized energy storage device that can be permanently integrated into small electronic and energy harvesting systems. A review of the currently available deposition techniques will be presented as well as some of the benefits and limitations of this novel battery. Future directions to improve energy density through alternative materials combinations and 3-dimensional device designs will be discussed. Recommendations for deposition system design based on the issues associated with solid state thin film battery fabrication, including cross contamination and encapsulation, will also be presented.

Topical Outline:

1. Resources for Physical Vapor Deposition
   1. Books on PVD
   2. Reference tables
   3. Formulas
2. What is a solid-state thin film battery (SSTFB)
   1. How traditional batteries work
   2. How solid-state thin film batteries work
   3. Features, ionic motion, flexibility
   4. Discharge performance
3. History of (Modern) SSTFBs
   1. Oak Ridge National Lab and the invention of LiPON
   2. Patent history since 1993
   3. Patents by geography and company
   4. Summary of the manufacturing process
4. Applications of SSTFBs
   1. Sensors
   2. Mobile electronics
   3. Micro-energy harvesting systems
5. Environmental conditions
   1. The atmosphere
   2. Molecular speeds
   3. Pollution
   4. Molecular density and pressure
   5. Mean free path
6. PVD conditions
   1. Deposition system design
   2. Process parameters
   3. Fundamental parameters
   4. Substrate preparation
   5. Film microstructure and composition
   6. Film properties
7. The Sputter Process
   1. Basic schematic
   2. Effect of electrical biasing
   3. Example of LiCoO₂ cathode film
   4. Example of LiPON electrolyte film
   5. Sputter system designs: for research, for production
   6. Magnetron sputtering
   7. Sputtering yields
   8. Sputtering electrical insulators
8. Thermal evaporation
   1. Lithium metal anode films
   2. Basic thermal evaporation system design
   3. Equilibrium vapor pressure
   4. Materials utilization
   5. Thickness uniformity
9. Thin film growth models
   1. Structure zone models
      1. Impact of pressure
      2. Influence of substrate temperature
      3. Other factors effecting thin film morphology
   2. Thin film growth models
      1. Layered growth: Frank–Van de Merwe
      2. Island growth: Volmer-Weber
      3. Layered and island growth: Stranski–Krastanov
      4. Hybrid models – random growth models
10. Impact of stoichiometry on device performance
    1. The problem with LiCO₂ – impact of Li content on energy density and electrical conductivity
    2. Sputter yields – preferential sputtering
    3. Target geometry during sputtering – changing race track angles changes adatom flux directions
    4. Changing magnetron effects during sputtering
    5. Stress in thin films, effect of pressure, intrinsic stress, thermal stress
11. The need for smooth, particulate free films
    1. Impacts on making pinhole free electrolyte layers
    2. How particulates are generated
    3. Generation of localized hot spots
12. Post deposition processing
    1. Flexible substrates
    2. Rigid substrates
    3. Crystallization step to improve ionic conductivity
13. The need for encapsulation and approaches to protect the battery from moisture
    1. Short term encapsulation
    2. Long term encapsulation
       1. Hermetically sealed chip packaging
       2. Multi-layered coatings
14. Example deposition systems for SSTFBs
    1. Single chamber system
    2. Multi-chamber system with load lock
    3. Glove box integrated systems
15. SSTBs in 2D – approaches to increase capacity in a small footprint
    1. Cathode/Electrolyte combinations for higher voltage
    2. Thin substrates, flexible, temperature limitations
    3. Hunt for new materials
16. SSTBs in 3D – approaches to increase capacity in a 3D and small footprint
    1. 3D substrates,
       1. waves
       2. vias
       3. rods
       4. Gels or foams?
    2. Alternative deposition techniques (ALD, plasma assisted ALD (PEALD))
17. Characterization of SSTFBs
    1. Impact of discharge rates on performance
    2. Charge discharge examples
    3. Target materials
    4. As-deposited films
    5. Post deposition processes
    6. Half cells
    7. Full cells
18. Conclusions

Instructor: J.R. Gaines, Kurt J. Lesker Company - Pittsburgh, PA

High Temperature Superconductors (HTS) are beginning to impact a large potential market in diverse applications such as energy, health, military, telecommunication, transportation and research. The challenge has been in developing these brittle ceramic materials in lengths of over a kilometer on flexible substrates with properties similar to that of high quality epitaxial thin films. Novel materials processing has been developed to fabricate superconducting tapes with excellent critical current performance by manipulation of grain orientations and nanoscale defects. HTS tapes are now being manufactured in quantities of few hundred kilometers annually with current carrying capacity of about 400 times that of copper wire of the same cross section. This tutorial delves into the details of RE-Ba-Cu-O (REBCO, RE = rare earth) HTS materials, challenges faced in utilizing these materials, innovative solutions developed to overcome these challenges, thin film vacuum deposition technologies to fabricate REBCO tapes, industrial-scale manufacturing, ongoing R&D activities and applications. This course is intended for students, scientists and engineers who are interested in new opportunities in the rapidly-growing field of thin film superconductor manufacturing or in applying innovative materials, process and roll-to-roll manufacturing technologies developed for superconductors in their own fields.

Topical Outline:

• Superconductors; Historical Overview:
  • Cryogenics
  • Discovery of superconductivity
  • Low temperature superconductors
• High temperature superconductors (HTS):
  • HTS materials including RE-Ba-Cu-O (REBCO)
  • Structure and properties
  • HTS tape fabrication
• Critical currents in HTS:
  • Challenges with anisotropy and grain boundaries
  • Solutions to address weak-link problems to increase critical current
  • Flux pinning
  • Nanoscale defects to improve flux pinning to increase critical current
• Biaxially-textured thin film templates to fabricate high-current REBCO tapes:
  • Ion Beam Assisted Deposition (IBAD)
  • Rolling Assisted Biaxially-Textured Substrates (RABiTS)
  • Inclined Substrate Deposition (ISD)
• REBCO thin film superconductor tapes using biaxially-textured templates:
  • Deposition methods – Pros and Cons
  • Engineering nanoscale defects in REBCO thin film tapes
  • Complete REBCO tape architecture
• Current status of thin film superconductor tapes:
  • Industry-scale roll-to-roll manufacturing
  • Ongoing R&D
  • Applications of thin film superconductor tapes

Instructor: Venkat Selvamanickam, University of Houston - Houston, TX

Heat management in thin films and coatings has always been an important consideration in applications including optics, tribological coatings, flexible substrates, and a broad range of electronic devices. The modern drive for smaller scaling and higher power or heat loads demands both technological innovations and a better understanding of heat transfer. Modern technology and materials are commonly progressing to sub-micron characteristic length scales. In this regime, classical laws of heat transfer no longer apply, and the energy of the individual energy carriers (electrons, phonons, and photons) and how they interact on the time and length scales associated with their scattering events must be considered (i.e., nanometers and picoseconds). This leads to phenomena such as reduced thermal conductivity of thin films compared to their bulk counterparts, thermal resistances of thin film heterosystems that are dominated by interfacial processes, and novel heat transfer processes that are driven by the coupling of energy carriers across interfaces of solids, liquids, gases and plasmas. In this full-day course, we will review the fundamentals of heat transfer from a nanoscale, or atomic perspective. From considering heat transfer properties of materials from this “bottom-up” perspective, we will overview the critical length and time scales that dictate changes in thermal conductivity of thin films that arise due to growth conditions, material processing, manufacturing, and heterogeneous integration. This course, which is designed for a technical community with little to no background in heat transfer, will cover the following topics:

Topical Outline:

1. What makes a high and low thermal conductivity material – an electron and phonon nanoscale perspective
2. Thermal conductivity measurements: thin film methods
3. Thermal conductivity of thin films: how film dimensional and growth conditions can lead to interfaces and defects that scatter electrons and phonons, thus reducing the thermal conductivity of materials
4. Thermal boundary resistance: coherent and incoherent heat transfer across interfaces in nanostructures
5. Coupled nonequilibrium heat transfer: Energy coupling among electron, phonons and photons including ultrafast laser pulse effects
6. Heat transfer in materials during synthesis and manufacturing, including plasma-material interactions during deposition and laser-based manufacturing

Instructor: Patrick E. Hopkins, Laser Thermal, Inc. - Charlottesville, VA

The use of electron beams in cathode ray tubes, electron microscopy, and similar applications is widely known. Beyond this and despite of several advantages, the application of electron beams directly in the manufacturing process is less prominent. Thin and thick layers can be produced in vacuum with electron beams by evaporation and high-purity materials by melting. Furthermore, electron beam technology provides solutions for welding, thermal microprocessing and electron beam lithography, heat treatment, and beam assisted chemical techniques at both vacuum and atmospheric pressure. Current developments from all over the world are presented. The tutorial describes new technologies that are characterized by high productivity, low specific energy expenditure, improved economy of materials, and improved environmental design.

This comprehensive lecture of electron beam technology dedicated to teachers, students, and specialists in all related fields will demonstrate how electron beams can be used to solve problems in production engineering. Fundamental aspects, process characteristics and limitations, information on plant equipment and actual application are covered. A deeper insight into the coating technology by electron beam physical vapor deposition is given.

Topical Outline:

• History of electron beam technology
• Characterization of the electron beam
• Principles of beam generation and beam guidance
• Construction of electron beam systems for industrial use
• Use of the thermal effects when the electron beam impinges materials
  (welding, hardening, drilling, additive manufacturing, melting, vaporizing, ...)
• Use of the non-thermal effects when the electron beam impinges materials
   (polymer modification, sterilization, crosslinking, conversion of gases in atmospheric electron beam plasmas)

Instructor: Stefan Saager, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP

This tutorial is designed to provide participants with a comprehensive understanding of mass flow controllers (MFCs) and their application in thin film deposition processes. Participants will learn about the principles of MFC operation, different types of MFCs, and techniques for optimizing MFC performance in thin film deposition applications.

Course Objectives:

1. Gain a fundamental understanding of mass flow controllers and their role in thin film deposition processes.
2. Learn about the various types of MFCs and their unique characteristics.
3. Understand the principles of MFC operation and the factors that influence their performance.
4. Explore techniques for optimizing MFC performance in thin film deposition applications.
5. Troubleshoot common issues and challenges related to MFC usage in thin film deposition.

Course Outline:

1. Introduction to Mass Flow Controllers (1 hour)
1. Definition and purpose of mass flow controllers
2. Importance of MFCs in thin film deposition processes
3. Overview of the key components of an MFC
4. Different types of MFCs: thermal, coriolis, pressure-based, etc.
5. Advantages and limitations of different MFC types
2. Principles of MFC Operation (1 hour)
1. Working principles of mass flow controllers
2. Gas flow measurement techniques
3. Sensor technologies: thermal, sonic, pressure-based, etc.
4. Calibration and accuracy considerations
5. Response time and flow range limitations
3. Optimizing MFC Performance for Thin Film Deposition (1.5 hours)
1. Factors affecting MFC performance in thin film deposition
2. Flow control strategies for different deposition techniques (sputtering, CVD, etc.)
3. Gas compatibility and purity considerations
4. Proper selection and sizing of MFCs for specific applications
5. Methods for minimizing flow disturbances and ensuring stable operation
4. Troubleshooting and Maintenance (0.5 hours)
1. Common issues and challenges related to MFC usage
2. Diagnosing and resolving MFC-related problems
3. Cleaning, maintenance, and long-term care for MFCs
4. Overview of safety precautions and best practices

Note: The course outline can be customized based on the specific needs and requirements of the participants. Additional topics or practical demonstrations can be included to enhance the learning experience.

By the end of this tutorial, participants will have a strong foundation in mass flow controllers and their optimization for thin film deposition applications, enabling them to make informed decisions while setting up and maintaining such systems.

Instructor: Wayne Lewey, Teledyne Hastings Instruments – Hampton, VA

A scanning electron microscope (SEM) is a technique to image and characterize materials. SEM's use a beam of electrons to bombard a sample that is placed in a vacuum. Considering the various interactions that can occur between the incident electron beam and the sample that is studied, topographical (surface imaging) and chemical compositional data is routinely obtained.

Surface preparation of samples is an extremely important consideration, especially in biological and non-conducting (dielectric) specimens. Charge buildup on the surface of the sample will affect the deflection of the incident electron beam as well as increasing the scattering of secondary electrons; degrading image quality and introducing artifacts in the imaging.

This course is designed for the scientist, engineer, and technician that will working with Scanning Electron Microscopy (SEM) and who has in interest in understanding the complex factors of sample preparation and microscope operation that control image quality and compositional data. This course will present techniques and information that will be invaluable in optimizing the utility of this powerful and widely available nondestructive characterization technique. The following topics will be explored in detail:

Topical Outline:

VACUUM

• 1.1 What is vacuum and the history
  • 1.1.1 Applications
• 1.2 Pressure ranges
  • 1.2.1 Time to form a monolayer
• 1.3 How do we create vacuum
  • 1.3.1 Different pumps in a SEM
    • 1.3.1.1 Pumps for rough vacuum
    • 1.3.1.2 Pumps for high vacuum
    • 1.3.1.3 Pumps for ultra-high vacuum
  • 1.3.2 Vacuum gauges for SEM
• 1.4 Gas load
  • 1.4.1 Sample considerations
• 1.5 Helpful tips

SAMPLE PREPARATION

• 2.1 How to start
  • 2.1.1 Sample as small as possible
• 2.2 Preparation of bulk - HARD
  • 2.2.1 Surface observations
  • 2.2.2 Inner surface
  • 2.2.3 Cross-sections
• 2.3 Preparation of bulk - SOFT
  • 2.3.1 Biological samples
• 2.4 Preparation of powders
  • 2.4.1 Diameter d > 3 mm
  • 2.4.2 Diameter 3 µm < d < 3 mm
  • 2.4.3 Diameter d < 3 µm
  • 2.4.4 Cross-sections
• 2.5 Mounting: holders and adhesives 2.6 Coating: sputtering and evaporation
• 2.7 Thin film growth
• 2.8 Helpful tips

SCANNING ELECTRON MICROSCOPY (SEM)

• 3.1. The basic principle?
• 3.2. Parts of the SEM
  • 3.2.1 Electron gun
  • 3.2.2 Optics:
    • 3.2.2.1 Lenses
    • 3.2.2.2 Apertures
    • 3.2.2.3 Deflectors
  • 3.2.3 Scanning system
  • 3.2.4 Detectors
• 3.3 Secondary (SE) and backscattered electrons (BSE)
• 3.4 SEM settings
• 3.5 Helpful tips

MICROANALYSIS: EDS, WDS, EBSD

• 4.1 What is microanalysis?
• 4.2 Electrons and their interactions
  • 4.2.1 X-ray (Bremsstrahlung)
  • 4.2.1 X-ray (Characteristic)
• 4.3 X-ray spectroscopy in SEM
  • 4.3.1 How does it work?
    • 4.3.1.1 Detector for EDS
    • 4.3.1.2 Counters for WDS
  • 4.3.3 Sample considerations
  • 4.3.4 Proper SEM and EDS parameters
• 4.4 EBSD
  • 4.4.1 Structure
  • 4.4.2 How it works
  • 4.4.3. Pattern formation mechanisms
  • 4.4.4. Some examples

ELECTRON MICROSCOPY SOFTWARE

• 5.1 Data analysis
• 5.2. Some examples
• 5.3 Image manipulation
  • 5.3.1 ImageJ
  • 5.3.2 Gatan DM
  • 5.3.3 Smile View
• 5.4 Spectrum manipulation
• 5.5 Monte Carlo simulations
  • 5.5.1 CASINO
  • 5.5.2 Win X-Ray
  • 5.5.3 pyPENELOPE

Instructor: Maja Koblar, Jozef Stefan Institute - Ljubljana, Slovenia

This full day course on materials for PVD applications will introduce PVD users to the different manufacturing methods used to produce their coating source materials. 

The tutorial will start with an in-depth exploration of the diverse methods used in the production of circular, planar, and rotatable targets. This foundational segment is designed to provide you with a comprehensive understanding of the techniques and technologies essential for creating these crucial components. You will learn about the various processes involved, such as vacuum melting, powder metallurgy, and hot isostatic pressing, each tailored to achieve the highest purity and performance standards required for thin film applications. This knowledge is vitally important.  In purchasing coating source materials for PVD applications the selection process must always consider the manufacturing methods as the nuances of fabrication often show up in film performance and properties.  We will address purity, geometrical and dimensional aspects as well limitations of producing coating materials.  We will go through the different methods of bonding coating material on backing plates. 

In the second part of the course, the different PVD methods that utilizes solid coating source materials will be detailed. The tutorial will also encompass information about the properties that characterizes a thin film material, how these properties are determined, and how can they be altered in a PVD process. Properties covered will include hardness, wear resistance, corrosion resistance, crystal orientation and residual stresses. This will procure the skill to alter  thin films or coatings to meet the demand of applications requiring corrosion resistance and enhanced mechanical properties. 

Who should attend this course?  Coating engineers, coating equipment manufacturers, project managers and purchasing managers should participate in this course to gain critical knowledge and skills that directly impact their work and the success of their operations.

Instructor: Anas Ghailane, Avaluxe Coating Technology GmbH & Co. KG - Furth, Germany

Instructor: Christos Pernagidis, Avaluxe Coating Technology GmbH & Co. KG - Furth, Germany

With recent technological advances and aging populations, there has been an increased emphasis on implantable biomedical devices with increased useful lifetimes, patient compatibility, and performance. Within this realm, there are many applications for vacuum deposited coatings on active devices which can suffer from the challenges of infection which result in degraded performance of the device, often requiring resection and replacement of the device, and can develop into fatal septic infections.  There are also needs for antimicrobial coatings on “simple” or inactive medical devices such as intermedullary nails, fixation screws, stabilizing plates, artificial joints, and others.  These suffer from the same challenges from infection and are often more likely sites of infection if the initial wound is from an accident or trauma incident.

In this half-day course, a broad overview of biomedically relevant coatings will be introduced for general groups of antimicrobial coatings. There will be a review of existing coatings and surface treatments for antimicrobial application including outlined common physical characteristics, an introduction to microbial challenges in the medical device area, and detailed descriptions of approaches to evaluate coatings for antimicrobial activity.  This course is designed to provide an overview of biomedical coatings for those new to this area of research as well as a “primer” of microbiological approaches and methods for non-biologists.

Topical Outline:

• Description of Biomedical Applications
• Hard Coatings (orthopedic/joint replacement)
• Bactericidal/Drug Eluting Coatings(nanoparticle/contact/eluting)
• Electrode Coatings
• Other Coatings for Biomedical Applications
• Deposition Techniques
• Microbiology intro for non-microbiologists
• Microbial challenges and evaluation of typical causative agents of infection
• Challenges of biofilms
• Antimicrobial Activity Assessment methods
• Surface contamination/remediation
• Solution growth/inhibition
• Microbial growth dynamics
• Biofilm analysis
• Biocompatibility
• Mechanism determination
• Translational Path for Coatings/New Devices

 Instructor: Gregory Caputo, Rowan University - Glassboro, NJ

Instructor: Jeffrey D. Hettinger, Rowan University - Glassboro, NJ

This course is suitable for all seeking an introduction to Physical Vapor Deposition (PVD) processes and includes detailed descriptions of the hardware, systems, theory, and experimental details related to evaporation, sputtering, arc deposition, laser ablation, etc. This course also includes an introduction to the vacuum technology as relevant to PVD. Thus, it includes an introduction to vacuum science, pumps, vacuum measurement and control instruments, plasma and plasma characterization, etc. This course does not have any pre-requisite but some previous experience with any deposition technology or equipment is helpful.

Physical vapor deposition (PVD) processes are atomistic deposition processes in which material vaporized from a source is transported in the form of a vapor through a vacuum or low-pressure gaseous environment to the substrate, where it condenses and film growth takes place. PVD processes can be used to deposit films of compound materials by the reaction of depositing material with the ambient gas environment or with a co-deposited material. This tutorial will discuss and compare the basic PVD techniques including vacuum evaporation, sputter deposition, arc vapor deposition, pulsed laser deposition, ion beam sputtering and ion plating. Vacuum evaporation uses thermal vaporization as a source of depositing atoms; sputter deposition uses physical sputtering as the vaporizing source; arc vapor deposition uses a high-current, low-voltage arc for vaporization; and ion plating uses concurrent or periodic energetic particle bombardment to modify the film growth. The parameters used for each technique will be discussed along with their advantages, disadvantages, and applications. This is an entry-level tutorial to acquaint the students with various PVD processes used for “surface engineering.”

The day-long tutorial will be conducted in two sessions with the first session primarily dedicated to vacuum technology and instrumentation and the second session focusing on individual PVD processes.

After the completion of this tutorial, the participant will have acquired:
a. Working knowledge of a vacuum system, as pertinent to PVD processes.
b. Understanding of the technology that creates and measures vacuum.
c. Understanding of the various processes that lead to the formation of vapors
d. Understanding of the growth of thin films
e. Understanding of the surfaces involved in thin film growth and how to prepare these surfaces for a successful deposition run.

Topical Outline:

• Introduction: deposition environments (vacuum and plasma), film formation, film structures, reactive deposition, factors affecting film properties
• Vacuum evaporation and vaporization, evaporation and sublimation, deposition chambers, vaporization sources (resistive and e-beam), evaporation materials, fixture design, process parameters, monitoring and control, advantages and disadvantages, applications
• Sputter deposition and physical sputtering, plasmas (dc, rf, magnetron, and pulsed dc), sputtering target configurations, reactive sputter deposition, sputtering materials, process parameters, monitoring and control, advantages and disadvantages, applications
• Arc vapor deposition and vacuum and plasma arcs, properties of arcs, generation and “steering” of arcs, arc sources, reactive arc deposition, process parameters, monitoring and control, advantages and disadvantages, applications
• Ion plating and bombardment effects, bombardment configurations, reactive ion plating, ion plating vaporization sources and evaporation, sputtering and arc process parameters, monitoring and control, advantages and disadvantages, applications
• Ion beam sputtering – role of ions in the overall PVD processes, ion generation and use specifically in the ion beam systems, process geometries and systems.
• Laser ablation – Advantages and disadvantages of using a laser system for ablation and subsequent deposition of materials, process variables, system geometry.
• PVD deposition systems and configurations (batch, load-lock, and in-line), pumping options.

The tutorial fee includes the text, Handbook of Physical Vapor Deposition (PVD) Processing, 2nd edition, Donald M. Mattox (Elsevier Publishing, 2010).

Instructor: Patrick Morse, Arizona Thin Films

Optical interference coatings are essential and enabling components in sensors, display devices, biomedical instrumentation, aerospace systems, and numerous other applications. It is hard to think of an optical instrument or system that does not benefit from their use and many systems would simply not be possible without them. This one-day course provides an introduction to optical coatings and essential design methods.

The course begins with some relevant fundamentals of optics and important properties of optical materials. The basic principles of interference coatings are described and useful insight is gained through the use of simple formulas and diagrams. These tools are applied to understanding the most important and exemplary design types, such as antireflection coatings, edge filters, narrowband filters, and high reflecting coatings. The combination of simpler design types to create more complex functionalities and the use of computer-optimization to improve on the performance of simpler “starting designs” are considered.

The level of the course is geared towards engineers and scientists who are new to the field and need to understand optical coatings and design fundamentals. It is also a suitable course for technical managers, technicians, and experienced practitioners seeking a brush-up. An advanced background in mathematics or physics is not required.

Topical Outline:

• Introduction to light and optical materials
• Survey of optical coatings
• Optics of interfaces and interference fundamentals
• Graphical tools for understanding and designing coatings
• Antireflection coatings
• Quarterwave stacks and all-dielectric reflecting coatings
• Narrowband filters, wideband filters, and edge filters
• Coatings incorporating metal layers
• Coatings at oblique angles of incidence
• Design synthesis and optimization

Instructor: Robert Sargent, Viavi Solutions

Evaporation is a technology used widely to produce thin films in vacuum. The tutorial describes the basics of evaporation and its utilization in various technological processes. The tutorial provides the conceptional basis for a wide range of evaporation techniques. It is designed to meet the needs of both a newcomer to the field and the experienced professional. Experienced scientists and engineers will have an opportunity to broaden their view of this field and deepen their understanding of evaporation processes.

Topical Outline:

• Thin film deposition in vacuum
• Evaporation mechanism—Thermodynamic of evaporation, evaporation rate, vapor pressure of elements, evaporation of compounds, evaporation of alloys
• Film thickness uniformity and purity—Deposition geometry, film thickness uniformity, conformal coverage, film purity, deposition rate monitoring and process control
• Evaporation sources—General considerations, resistance heated sources, sublimation sources, induction heated sources, electron beam heated sources, arc evaporation, laser ablation
• Reactive evaporation—Reactive and activated reactive evaporation
• Ion-assisted evaporation—Ion plating, enhanced ion plating, plasma-assisted deposition, ion-beam-assisted deposition
• Microstructure of evaporated thin films—Film growth mechanisms, structural zones, ion-assisted growth
• Deposition systems for thin film deposition by evaporation—Major parts of the system, web coatings systems, vacuum batch systems
• When should we use evaporation as a deposition process

Evaporation is a technology used widely to produce thin films in vacuum. The tutorial describes the basics of evaporation and its utilization in various technological processes. The tutorial provides the conceptional basis for a wide range of evaporation techniques. It is designed to meet the needs of both a newcomer to the field and the experienced professional. Experienced scientists and engineers will have an opportunity to broaden their view of this field and deepen their understanding of evaporation processes.

The tutorial is divided into fourth parts and conclusion: mechanism of evaporation and various evaporation sources, thin film growth mechanism and its

variation by ion-bombardment, deposition process that is using evaporation, various deposition arrangements based on evaporation sources, and, in conclusion, general requirements to a deposition system with evaporation sources.

The first part of the tutorial starts with description of atomistic deposition in vacuum as a three step process including material vaporizing, atom and molecule transportation from the source to the substrate, and atom and molecule deposition. All three steps are discussed and their influences on the thin film properties are considered.

The mechanism of evaporation is described in details using high-school basics of physics and chemistry, and thermodynamics. Consideration of evaporation sources include traditional ones (resistance heated, sublimation, inductive heated, and electron beam sources) and widely introduced in the last decade sources based on arc evaporation and laser ablation.

The second part of the tutorial is dedicated to the formation of thin film microstructure discussed in the sense of growing most desirable dense structures that posses high refractive index, superb mechanical properties, high chemical and environmental stability, etc. Thin film growth is a sequential of steps that include adsorption, surface diffusion, island formation and coalescence. Possible influence on all of these steps during deposition is main motive of this analysis that is illustrated using experimental and modeling data. Necessity of ion-bombardment of the growing films to get high quality structures is a well proved conclusion. Various structural zone diagrams are presented for thin films of elemental and compound compositions.

The third part of the tutorial is committed to thin film deposition process that is using evaporation. It starts with reactive evaporation that is used to deposit thin films of stoichiometric compounds. Activated reactive evaporation is based on additional generation of radicals and is the most widely used today way of compound deposition. Ion bombardment of a thin film and stimulated processes in it are described in dependence of ion energy and the nature of the thin film. The description is widely supported by experimental and computational data. Variation of thin film density, grain size, microstructure, surface morphology, and others is illustrated.  Possible co-evaporation from two independent sources is illustrated.

The fourth part of the tutorial describes various deposition arrangements based on evaporation sources. Activated reactive evaporation arrangement is usually including a plasma radical source. Ion-bombardment of the growing film is provided in the arrangements that are known as ion and enhanced ion plating, and plasma and ion-beam ion-assisted deposition. Parameters of various ion-beam sources are described,

The tutorial conclusion gives a general overview of deposition system with evaporation sources. General requirements for the evaporation and ion-beam sources, substrates holders, vacuum chamber, pumping system, and process control are discussed for vacuum systems to make web, large-area, and optical coatings.

Instructor: Abe Belkind, Abe Belkind and Associates

This tutorial is intended for vacuum web coating system operators, maintenance personnel, technicians, engineers, scientists, supervisors, and others who would benefit from an introduction to issues related to roll-to-roll vacuum coating onto flexible substrates. An overview of all the systems in a vacuum web coating tool is presented, with special focus on substrates, pretreatment, and deposition techniques.

Topical Outline:

• Markets and applications for coated web products
• Overview of vacuum web coating systems
• Vacuum system
• Web handling & winding system
• Substrates, pretreatment, web cooling
• Deposition techniques
• Process and product monitoring
• System maintenance
• Sources of information about web coating

Instructor: Michael Simmons, Intellivation - Loveland, CO

The goal of the tutorial is to show the link and provide understanding of relations between coating application, coating (or modified surface) properties, selection criteria on process characteristics, selection criteria on plasma parameters, and method design. It is possible to predict how the process parameters will be reflected in the coating and in the opposite direction, requirements on the coating properties can imply how the process should be designed.

Topical Outline:

• Plasma-assisted technologies, general attributes
• Useful criteria, basic relations and limits for plasma, classification of plasmas
• Generation of gas discharge plasma, plasma diagnostics
• Generation of vapor species, transport through medium, diffusion, condensation at the surface
• Consequences of the deposition process on film properties
• Fundamentals of radical and ion-assisted plasma chemistry
• Homogeneous and heterogeneous plasma-assisted reaction in deposition of films
• Examples of novel plasma processes
• Limits and new trends
• Hybrid plasma processes

Instructor: Hana Baránková, Uppsala University - Uppsala, Sweden

Instructor: Ladislav Bárdos, Uppsala University - Uppsala, Sweden

The tutorial is designed for process engineers and technicians, quality control personnel, thin film designers, and maintenance staff.

Vacuum deposited thin films are used for optical coatings, electrically-conductive coatings, semiconductor wafer fabrication, and a wide variety of other uses. They may be deposited on glass, plastic, semiconductors, and other materials. Usually, a vacuum deposition process produces durable, adherant films of good quality. But what do you do when things go wrong? Not all films can be deposited on all substrate materials. Sometimes films peel off or crack. Other times they are cloudy, absorbing, scattering, or have other unacceptable properties. 

This tutorial will teach you about techniques and tools that can be used to identify the source of the problems, correct the process, and get back into production. It will also help in learning how to develop new processes and products.

Topical Outline:

• Mechanical, electrical, and optical properties of thin films
• Process parameters that affect film properties
• Gauge and instrument calibration
• Properties of substrate surfaces
• Measurement of film stress
• Detection of contamination
• Introduction to surface analysis techniques (Auger, ESCA, SIMS, FTIR)
• Substrate preparation and cleaning

Tutorial Description

Vacuum deposited thin films are used for optical coatings, electrically-conductive coatings, semiconductor wafer fabrication, and a wide variety of other uses.  They may be deposited on glass, plastic, semiconductors, and other materials.  Usually, a vacuum deposition process produces durable, adherent films of good quality.  But what do you do when things go wrong?  Not all films can be deposited on all substrate materials.  Sometimes films peel off or crack.  Other times they are cloudy, absorbing, scattering, or have other unacceptable properties. 

This survey tutorial will teach you about techniques and tools that can be used identify the source of the problems, correct the process, and get back into production.  It will also help in learning how to develop new processes and products.  Many types of deposition processes will be discussed, although the focus is not on in-depth comparison of deposition processes.  Techniques and tools are described for making a variety of measurements for quantifying the properties of thin films, both at the “cheap-and-quick” level and for precision analysis.  By drawing on methods used in a variety of industries, examples are given that can introduce new approaches to solving problems.  The tutorial is designed for process engineers and technicians, quality control personnel, thin film designers, and maintenance staff.

Some of the topics to be covered:

• Mechanical, electrical, and optical properties of thin films
  • adhesion, abrasion, humidity, salt spray, hardness, bending
  • scratch and indenter tests
  • transmission, reflection, conductivity
  • index of refraction, absorption, scatter, haze
• Process parameters that affect film properties
  • temperature, rate, pressure, angle
  • effects of water vapor
  • stoichiometry control
• Gauge and instrument calibration
  • pressure (thermocouple, ion, capacitance manaometer gauges)
  • mass flow (thermal, laminar flow, displacement types)
  • helium leak checking
• Properties of substrate surfaces
  • smoothness, chemistry
  • results of polishing processes
• Measurement of film thickness and stress
  • use of thin optical flats for stress
  • thickness measurement devices
• Detection of contamination
  • UV light
  • water sheeting
  • residual gas analyzers, partial pressure measurements
  • contaminant “fingerprinting” using RGAs
• Introduction to surface analysis techniques
  • Auger, ESCA, SIMS, FTIR
  • RGA, GC/MS
  • Use of outside services and labs
  • Value vs. costs for capital equipment
• Substrate preparation and cleaning
  • use of solvents and detergents
  • ultrasonic cleaning
  • contact angle measurements for detecting contaminants
  • glow discharge cleaning in vacuum
• Statistical Process Control (SPC)
  • Use of SPC
  • Run charts
  • Design of Experiments (DOE)
• Problem solving within organizational structures
  • Getting support
  • Finding resources
  • Identifying risks
  • Communicating clearly

Instructor: Mike Miller, Angstrom Engineering - Kitchener, ON

As a preliminary, in the first half of the session, background of some process factors which can cause problems will be reviewed. Thin film growth properties such as nucleation and percolation/coalescence are reviewed along with conductivity in metallic films. Examples of thin film growth with columns and/or dendrites will be shown. The process factors which may cause stress and delamination will be presented. The importance of the quality of the vacuum and the control of process temperature and particle energy and flux level will be demonstrated.

Stability and reproducibility are critical to any production process. We want to get the same product today as we did yesterday and get the same result tomorrow. Setting control parameters optimally is one key to these results, but often found to be done less desirably in practice. This is addressed first for thickness and temperature control before more complex things. Design of Experiments Methodology (DOE) will then be addressed with history, principles, and examples.

Vacuum coating processes typically have many variables which influence the properties of the results. Although there may be dozens of variables which have some influence on the results, it is frequently possible to determine which three or four variables are most influential and ignore the rest as being only noise factors. It is desirable to find the optimal values for each influential variable where the results of the overall process meet the best compromise between all of the process goals.

One general methodology to accomplish this efficiently evolved approximately one century ago in the agricultural industry for developing new strains of plants and animals. The experimental/evolutional cycle times for these developments are typically long. Therefore, it is highly desirable to minimize the number of experiments needed, and to maximize the amount of data acquired from those experiments. This is generally referred to as DOE.

This course will show how the set up and carry out a DOE for various simple and complex example processes. The user should be able to become well acquainted with using DOE to debug ailing processes and/or optimize new processes.

Topical Outline:

• Effects of errors in deposition rate and temperature
• Constant/steady deposition rate and temperature
• Tuning-in control parameter settings
• History of Design of Experiments Methodology
• A non-mathematical view of the data gathering and processing
• Simple example of aluminum coating deposition process development
• Example of an ion assisted TiO₂ deposition process development
• Example of an ambient temperature MgF₂ deposition process
• Example of initial strategy in a complex process refinement
• A successful process problem solution

Instructor: Ronald R. Willey, Willey Optical

This course is intended to be valuable to coating engineers, scientists, technicians, and technical managers as well as seasoned thin film scientists who are involved in the development, and production of optical thin films. Basic principles are reviewed in the beginning to insure that all are using the same nomenclature, but the evolution of the topics then moves into material and techniques useful to even the more experienced practitioners. No extensive background in mathematics or physics is required; extensive graphical illustrations are used. This course deals with optical thin film coating production. It is a companion to, but not a requirement for, the course on optical thin film coating design with another book by the author. Advanced optical thin films are being used increasingly in communications, optical systems, and light control and collection applications. The sophistication of the optical coating industry is advancing rapidly to meet ever increasing demands for performance and production capability. New viewpoints, equipment, and processes are available to support advanced capability and efficiency. Objectives of this course include: to provide increased knowledge and understanding of the many practical aspects of optical coating production, to discuss the techniques and principles, and to elucidate techniques and processes that are commonly successful in meeting optical coating needs.

Topical Outline:

• Select appropriate optical coating equipment to support the needed processes.
• Be aware of the importance of pumping effects and measurement accuracy and how to avoid pitfalls.
• Be familiar with the properties and process know-how for common optical coating materials.
• Further understand the use of energetic processes such as sputtering, plasma, and ion assist.
• Understand various monitoring and control strategies and their advantages and limitations.

TYPICAL EQUIPMENT FOR OPTICAL COATING PRODUCTION
1.1. INTRODUCTION
1.2. GENERAL REQUIREMENTS
   1.2.1. The Vacuum
   1.2.2. Deposition Sources
   1.2.3. Fixturing and Uniformity
   1.2.4. Temperature Control
   1.2.5. Process Control
1.3. TYPICAL EQUIPMENT
1.4. ALTERNATIVE APPROACHES
1.5. UTILITIES

MEASUREMENTS
2.4. INDEX & THICKNESS DETERMINATION
   2.4.1. Index of Refraction Determination
   2.4.2. Fitting Values for High Index Materials
   2.4.3. Fitting Values for Low Index Materials
   2.4.4. Using a Software Package for Index Fitting
   2.4.5. Tuning-In the Thickness of a Four-Layer AR
   2.4.6. Another Index Test Method

MATERIALS AND PROCESSES
3.1. PROCESS KNOW-HOW
3.1.1. Film Growth Models and Observations
   3.1.2. Chiral and Sculptured Coatings
   3.1.3. Stress in Coatings
   3.1.4. Laser Damage in Coatings
   3.1.5. Rain Erosion of Coatings
3.2. MATERIALS
   3.2.1. Silicon Compounds
   3.2.2. Titanium Oxides, TiO through TiO2
   3.2.3. Magnesium Compounds
3.3. MIXED MATERIALS and TERNARY OXIDES
3.4. CRYSTAL MONITOR CONTROLLER SETUP
   3.4.1 The Problem
   3.4.2 The Solution
   3.4.3 Setting Ramp and Soak Times
   3.4.5 Soak Level Before Shutter Opens
   3.4.6 Control Delay After Shutter Opens
3.5. IONS AND ION SOURCES
   3.5.1. Ion to Atom Arrival Ratio (IAAR) and Its Implications
   3.5.2. Kaufman Gridded Source
   3.5.3. Cold Cathode Source
   3.5.4. End-Hall Source
   3.5.5. IS1000/PS1500 Plasma/Ion Source
   3.5.6. Behavior of Three Types of Plasma/Ion Sources
   3.5.7. Ion/Plasma Sources with Fluoride Coatings

THIN FILM MONITORING AND CONTROL
4.1 OVERVIEW
4.2 SIMPLE MONITORS
   4.2.1. "Eyeball" and Measured Charge
   4.2.2. Optical Thickness Monitors
   4.2.3. Automation versus Manual Monitoring
4.3 CRYSTAL MONITORS
   4.3.1. Crystal Thickness Controllers
   4.3.2. Crystal Control of Eyeglass Coatings
   4.3.3. Calibrations and Variations
   4.3.4. Tooling Factors
   4.3.5. Variations
4.4 DIRECT VERSUS INDIRECT
4.5 CHIP CHANGERS
4.6 SENSITIVITY TO ERRORS
   4.6.1. Geometrical Factors
   4.6.2. Spectral Requirement Factors
4.7 ERROR COMPENSATION AND DEGREE OF CONTROL
   4.7.1. Narrow Bandpass Filter Monitoring
   4.7.2. Broad Band AR Coating Monitoring
4.8 ERROR ACCUMULATION
4.9 NBP FILTER MONITORING
   4.9.1. Signal to Noise in Monitoring
   4.9.2. Special Layers in NBP Monitoring
4.10 LAST TWO LAYERS OF NBP FILTERS
   4.10.1 Types of Final Layer Monitoring Techniques
   4.10.2 Basis of Predicted Thickness
   4.10.3 Summary of the Last Two Layers of a NBP Filter
4.11 MORE ON SENSITIVITY
   4.11.1 Effects of Errors on the Average Transmission
   4.11.2 Sensitivity of Turning Points in Monitoring
   4.11.3 Total Error Sensitivity of the Average Transmission
   4.11.4 Error Compensation in the Monitoring
4.12 OTHER EFFECTS ON OPTICAL MONITORS
   4.12.1 Error Due to Drift in the Monitoring Wavelength
   4.12.2. Effects of Thin Film Wedge on the Monitor Chip
   4.12.3. Error Due to Width of the Monitoring Passband
4.13 TURNING POINT DETECTION
   4.13.1. Precision versus Accuracy
   4.13.2. Optical Monitor with the Method of Schroedter
   4.13.3. Suggestion for Monitoring of DWDM Filters, Etc.
   4.13.4. More on Turning Point Detection
   4.13.5. Terminations by the Last Maximum and Minimum
4.14 CONSTANT LEVEL MONITORING
4.15 SENSITIVITY AND CORRECTION STRATEGIES
   4.15.1. Sensitivity versus Layer Termination Point
   4.15.2. Sensitivity Versus g-Value
   4.15.3. Constant Level Monitoring Strategies
4.16 PASSIVE VERSUS ACTIVE, STEERING
   4.16.1. Passive Versus Active Optical Monitoring
   4.16.2. Steering the Monitoring Signal Result
4.17 PRECOATED MONITOR CHIPS
   4.17.1. Eliminating the Precoated Chip
4.17.2. General Design Procedure
4.17.3. Specific Design Procedure
4.17.4. Results of the Procedure
4.18 DESENSITIZING FOR %T/%R ERRORS
4.19 OVERCOMING ABSORPTION
4.20 REVERSE & FORWARD ENGINEERING
4.20.1. A Narrow Bandpass Filter
4.20.2. A Special "Multichroic" Beamsplitter
4.20.3. A Very Broadband Antireflection Coating
4.20.4. The Rest of the Story
4.21 FENCEPOST MONITORING
4.21.1 Monitoring in General Cases
4.21.2 Monitoring Non-QWOT NBP Filters
4.21.3 New Approach to NBP Monitoring and Control
4.21.4 Preliminary Conclusions on Fencepost Monitoring
4.21.5 Simulation of Error Effects in FP Monitoring
4.22 DIRECT DOUBLE BEAM MONITORING
4.22.1 Single Beam versus Double Beam Optical Monitors
4.22.2. Intermittent Monitoring
4.23 ELLIPSOMETRIC MONITORING
4.24 BROAD BAND OPTICAL MONITORING

Instructor: Ronald R. Willey, Willey Optical

The course is intended to be valuable to coating engineers, scientists, technicians, and technical managers as well as seasoned thin film scientists who are involved in design, development, and production of optical thin films. Basic principles are reviewed in the beginning to insure that all are using the same nomenclature, but the evolution of the topics then moves into material and techniques useful to even the more experienced practitioners. No extensive background in mathematics or physics is required; extensive graphical illustrations are used. This course deals with optical thin film coating design. It is a companion to, but not a requirement for, the course on optical thin film coating production with another book by the author. Advanced optical thin films are being used increasingly in communications, optical systems, and light control and collection applications. The sophistication of the optical coating industry is advancing rapidly to meet ever increasing demands for performance and production capability. New viewpoints, equipment, and processes are available to support advanced capability and efficiency. Objectives of this course include: to provide increased knowledge and understanding of the many practical aspects of optical coating design, to discuss the techniques and principles discussed, and to elucidate techniques and processes that are commonly successful in meeting optical coating needs.

Topical Outline:

• Review Fundamentals of Thin Film Optics.
• Firmly grasp, visualize, and use optical thin film design principles.
• Discuss a variety of Applications.
• Designing with Absorbing Materials.
• Advanced Design Concepts.
• Estimate what can be achieved before starting a design.
• Obtaining good indexes from processes before final designs by good measurement techniques.
• Solving Practical Coating Design Problems.

Instructor: Ronald R. Willey, Willey Optical

Two dimensional (2D) materials are an expanding family of atomically thin materials with unique and unexpected optical and electronic properties that we continue discover each day. These materials are of particular interest because they offer the ultimate in layer-by-layer tailorablity to achieve the desired properties of materials. Moreover, electronic and optical devices produced from 2D materials demonstrate extreme mechanical flexibility, giving rise to new possibilities for technological developments with broad and impactful applications. This class will describe in detail the fundamental properties of this unique class of materials, typical approaches to making and characterizing them, and their applications.

Topical Outline:

• Properties
  • Fundamentals of physics associated with 2D materials resulting in unique combinations of electronic, optical, and mechanical properties.
  • Characteristics of two dimensional material families, including graphene, transition metal dichalcogenides, and group IV monochalcogenides.

• Processing
  • Approaches for synthesis of 2D materials including mechanical and chemical exfoliation, chemical vapor deposition, physical vapor deposition, additive manufacturing, as well as the associated challenges of processing low dimensional materials
  • Practical discussions on how to get started synthesizing new materials and fabricating 2D devices

• Characterization
  • Common chemical and structural characterization approaches for two-dimensional materials including Raman, XPS, TEM
  • Novel, in situ characterization techniques

• Applications
  • Transistors
  • Light sources
  • Photodetectors
  • Molecular sensors

Instructor: Christopher Muratore, University of Dayton - Dayton, OH

Thousands of PVD coating systems are installed around the world applying reflective, decorative, electronic shielding and tribological coatings on 3-dimensional polymer substrates including: automotive lighting and trim, toys, white goods (kitchen and bath appliances), sanitary (plumbing components), and electrical enclosures. These films are predominantly created using PVD thermal evaporation, or sputtering, and PE/CVD technologies. The industry is always looking for innovative thin film solutions, whether it be a new material, color or physical property. Today’s technologists must be versed in the basic PVD technologies in order to prepare for these innovation challenges. This course will review the technologies of thermal evaporation and sputtering as it applies to the various applications, as well as the ongoing maintenance required to ensure coating quality and where to look when the process goes astray.

Individuals who will benefit from this course will include: a.) technicians and engineers responsible for the setup, operation and maintenance of the equipment, b.) technologists who are responsible to develop new application, c.) Purchasing managers/executives responsible for capital expenditures, d.) supervisors responsible for production, quality and throughput, and finally e.) companies that are investigating getting into PVD processing.

The following topics will be reviewed:

1. Brief history of the integration of PVD coatings used in industry
2. Review of thermal evaporation, sputtering and arc vapor deposition techniques
   1. Comparisons and selection considerations
      1. Thermal deposition
      2. Sputtering
         1. Metal deposition
         2. Reactive deposition
      3. Arc vapor deposition
   2. Process sequence
      1. Plasma cleaning
      2. Metal deposition
      3. Plasma polymerization
      4. Surface energy control
   3. Setting up the process for coating uniformity and coverage
      1. Substrate to source distance and orientation considerations
      2. Calculating current and evaporant loads
   4. Technique strengths and weaknesses
      1. Process complexity
      2. Personnel required
      3. General operating costs and configuration considerations
         1. Small batch
         2. large batch
         3. inline
3. Substrate selection
   1. Material character, uses and issues
4. Molding process issues: impact on the coating performance and what can be specified to the molder
   1. Substrate appearance for as molded PVD processing, versus paint base-coating
   2. Residual stresses
   3. Gating and substrate geometries
      1. Mold operating conditions
      2. Knit lines
      3. Blush
5. Paint base and top coating
   1. Use and selection
   2. Application methods
      1. Spraying
      2. Flow coating
   3. Discussion of equipment costs and scrap rate
   4. International suppliers
6. Fixturing and masking
   1. Methods and techniques used
   2. Coating uniformity modeling: Tin Model and Uniformity Pro
   3. Mask cleaning
      1. Frequency
      2. Safety
7. When a process goes rogue
   1. Identifying the problem (thermal evaporation and sputtering)
      1. Coating quality issues
      2. Cycle time problems
      3. Coating system issues
8. Inspection techniques and equipment
   1. Reflectivity
      1. Integrating sphere
      2. Spectrometry
   2. Corrosion resistance
      1. Caustic testing
      2. Weatherization
   3. Film thickness
      1. Profilometry
   4. Adhesion
      1. Tape test
   5. Color measurement
      1. LAB
   6. Intrinsic stress
      1. Coated silicon wafer and profilometry examinations
9. Disruptive technologies
   1. Reflective paint
   2. In-mold decorating

Instructor: Gary Vergason, Vergason Technology - Van Etten, NY

Instructor: Josh Soper, Vergason Technology - Van Etten, NY

This is a one-day class on Ion Beam Sputtering, designed to be an in-depth introduction to the process of ion beam deposition. The information presented will be appropriate for both process and equipment engineers, line management, sales, supply chain management, and anyone else who is interested in the use of ion beam in thin film coatings.

Some of the most advanced low-loss optics in the world are coated using ion beam deposition. This class will cover in detail the equipment of ion beam technology, ion sources, fixturing, and monitoring, how ion beam deposition works, and how all these pieces fit together to produce the highest performance coatings in the world. We will end with a brief discussion of the wide variety of applications that utilize ion beam technology.

Topical Outline:

1. Ion Source Theory: From Space to Factory
   1. A History of Ion Sources
   2. End-Hall (Gridless) Ion Sources
   3. Gridded Ion Sources
      1. Principles of Operation
      2. Generating a Plasma
      3. RF vs. DC
      4. Grids
      5. The Ion Beam
      6. Neutralizers and Neutralization
2. Ion Beam Systems
   1. Geometry
   2. Design Considerations
   3. Gas and Pumping
   4. Contamination Sources
   5. Uniformity Optimization
3. Sputtering
   1. Fundamentals of Sputtering
   2. Ion Energy and Incidence Angle
   3. Deposition Plume
   4. Sputtering vs. Assisting
4. Applications
   1. Ion Beam vs. Evaporation and Magnetron
      1. Process Speed
      2. Film Structure
      3. Film Quality: Defects, Stress, and Contamination
   2. Process Control: Time/Power, QCM, and OMS
   3. Ion-Assisted Ion Beam Deposition (IBAD)
   4. When is Ion Beam a good choice?

Instructor: Brett Buchholtz, Plasma Process Group - Windsor, CO

Pulsed Laser Deposition was a little-known deposition process until 1987. The discovery of High Temperature Superconductors (HTS) in 1986 and the subsequent growth of HTS thin films by Pulsed Laser Deposition (PLD) in 1987 sparked the growth of this unique physical vapor deposition process in materials research. PLD is now on the cusp to enter production in several MEMS and HTS Coated Conductor applications. This course will cover the basics of Pulsed Laser Deposition, variations of the process, and compare them to alternatives such as magnetron sputtering, MBE, and evaporation. No prior background in PLD is required.

Topical Outline:

• Brief history of PLD prior to and after 1987
• The fundamental nature of the PLD process
• Unique characteristics of the PLD plume and the process over that of alternative PVD techniques
• Typical PLD equipment for R&D and large area applications
• Film composition and compositional uniformity
• Multi-layer film growth via PLD or a combination of PLD and sputtering
• In-situ diagnostics for PLD
• Combinatorial deposition via PLD
• Variations of PLD such as Matrix Assisted Pulsed Laser Evaporation and Resonant IR Pulsed Laser Evaporation
• Issues still facing the PLD process
• Examples of large-area PLD for production applications

Instructor: James A. Greer, PVD Products

This course is intended to give a practical approach to the audience on the fabrication of organic electronic and optoelectronic devices and emphasize on key parameters to consider during the design and building steps. The invention of low voltage and efficient thin film light emitting diode three decades ago, opened the door to organic thin films as a foundation for new generation electronics and optoelectronics. Since then, a wide range of possibilities using small organic molecules and conjugated polymers have been explored in a wide range of applications. Not only organic electronics have been proven in research, they have for a while now found space in consumer market. Organic light emitting device, or OLED as we all know it, is the most successful example along with organic solar cells and organic thin film transistors. In addition to screen displays, solar panels and transistors, these materials have recently emerged in intelligent wearable textiles, biomedical and bio-implantable devices, laser applications and found broader applications as sensors for non-invasive diagnostics or treatments. Organic electronics have become ubiquitous in society and the future of this industry is looking very bright.

Understanding the principle of operation and knowing how to build systems for fabrication of organic thin films is only the beginning of the adventure; after taking this course the only remaining question will be "When will you take part in building the future of organic electronics?”

Topical Outline:

1. Introduction to the organic electronics – brief history on discovery of electrical conductance through small molecules
2. Importance and prevalence of organic electronics
3. Progress in technology and future opportunities
4. Overview of applications – OLEDs, OPVs, OTFTs, OFET, Organic Sensors, etc.
5. Principle of operation of organic electronics
6. Fabrication of organic electronic devices
7. Thin film technology - Techniques and methodology
8. Thin film characterization methods for organic device analysis
9. Thin film properties in device layers – interfacial properties
10. Electrical performance and environmental stability of organic electronics:
    1. Considerations for device efficiencies
    2. PVD system design considerations and specifications – what works for organics!
    3. Challenges and failure modes - methods to overcome them!
    4. Consideration and optimization of Important parameters and variables (tools to get devices with high efficiencies and long lifetimes)

Instructor: Akhil Vohra, Angstrom Engineering Inc - Kitchener, ON, Canada

With recent technological advances, there has been an increased emphasis on implantable biomedical devices with increased useful lifetimes, patient compatibility and performance. The BRAIN Initiative, launched in 2013 as the result of many advances in the understanding of neurological systems, has continued to improve our understanding of the human brain. The knowledge gained now allows the restoration of some physical functions after catastrophic injury. Within this realm, there are many applications for vacuum deposited coatings on electrodes. In general, coatings at the interface between an implanted medical device and the hosting biological system can improve device biocompatibility, performance and longevity. Example applications include hard coatings for artificial joints, x-ray opaque coatings to assist in device positioning, bactericidal coatings, and coatings on diagnostic devices.

In this half-day course, a broad overview of biomedically relevant coatings will be introduced including the market outlook for general groups of coatings. Coatings for specific applications will be discussed emphasizing the property that is exploited and the deposition conditions that are known to be important for best performing materials. This course is designed to provide an overview of biomedical coatings for those new to this area of research while providing a background intended to stimulate new ideas for devices.

Topical Outline:

• Description of Biomedical Applications
• Market Needs/Growth
• Hard Coatings (orthopedic/joint replacement)
• Bactericidal/Drug Eluting Coatings(nanoparticle/contact/eluting)
• Electrode Coatings
• Other Coatings for Biomedical Applications
• Deposition Techniques
• Alloying
• Combinatorial Approaches
• Characterization Techniques
  • Electrochemical
  • Microstructural
  • Biocompatibility
  • Mechanical
• Needed Coating Improvements
• Translational Path for Coatings/New Devices

Instructor: Jeffrey D. Hettinger, Rowan University - Glassboro, NJ

Instructor: Gregory V. Taylor, Los Alamos National Laboratory - Los Alamos, NM

Thermal spray technology and coatings solve critical problems in demanding environments. They provide “solutions” to engineering needs involving wear, high temperature and aqueous corrosion, and thermal regulation and degradation. Thermal spray is being increasingly used to manufacture net shapes, advanced sensors, and materials for the biomedical and energy/environmental marketing sectors. These and a vast array of emerging applications take advantage of the rapid and cost-effective capabilities of thermal spray technology in the OEM and repair industries.

Thermal spray processes; including twin wire-arc, combustion, high velocity oxyfuel (HVOF), cold spray and plasma spray, as well as associated technologies, can deposit virtually any material as a surface coating onto a wide range of other materials. Coating reliability and effectiveness necessitates that these overlay coatings be selected, engineered and applied correctly.

Topical Outline:

The masterclass will provide the participants with a thorough and holistic review of the evolution of the thermal spray process. Participants will also gain insights on the fundamentals of the different thermal spray processes and in the process, enhance their ability to solve complex thermal spray issues in a systematic and practical manner. In addition, the course will also expose them to the emerging markets which the technology can be applied, thus challenging the participants to explore potential business opportunities in the various industries.

The masterclass is customized for professionals who are keen to enhance their knowledge and skills in the thermal spray industry. This course provides trainees with deep insights on the latest technologies and solutions. The masterclass focuses on:

• a thorough understanding of the thermal spray processes,
• depiction of the quite complex scientific concepts in terms of simple physical models, and
• integration of this knowledge to practical engineering applications and commonly accepted thermal spray practices.

Instructor: Christopher Berndt, Swinburne University of Technology - Melbourne, Australia

This tutorial is intended for scientists, engineers, technicians, and others, interested in understanding the deposition and properties of transparent conductive coatings (TCCs). The major topic of the tutorial is indium tin oxide, ITO. Deposition by dc magnetron sputtering is emphasized although all common deposition processes are described. Specific examples of the ITO properties achieved with evaporation, reactive and ceramic target sputtering deposition processes are shown. Post-deposition processing also is discussed. A methodology is described for developing an ITO (or any TCC) deposition process in your own equipment. Typical ITO properties are compared with those achieved by optically enhanced metals TCC (alternative TCO to ITO are mentioned but not discussed in detail – see C-321). The selection and design of a TCC to meet the requirements of a particular application are presented. Some knowledge of basic thin film coatings and interference optics is assumed, although key basics will be reviewed. The tutorial will briefly cover the basic physics and fundamentals of conductivity. A prior introductory solid state physics tutorial would be helpful but is not required. Time will be available for questions concerning your process problems.

Topical Outline:

• Basic physics of transparent conductive coatings (TCCs)
• Major deposition methods for TCCs
• Control of TCC Film Properties
• Selection of deposition method and process conditions
• TCC performance in applications
• Manufacturing issues
• Optional topics
  

   — Thin film optics, Metal Nitride TCC

This tutorial is intended for scientists, engineers, technicians, and others, interested in understanding the deposition and properties of Transparent Conductive Coatings (TCC). The major topic of the tutorial is indium tin oxide, ITO, the most common of Transparent Conductive Oxides (TCO). Deposition by DC magnetron sputtering is emphasized although all common deposition processes are described. Specific examples of ITO properties achieved with evaporation, reactive and ceramic target sputter deposition processes are shown. Post-deposition processing also is discussed.

A methodology is described for developing an ITO (or any TCC) deposition process in your own equipment. Developing a “Resistivity Well” and process control of the ITO film properties are explained. Typical ITO properties on glass (high temperature substrates) and plastics (low temperature substrates) are compared with those achieved by TCC using optically enhanced noble metals. The selection and design of a TCC to meet the requirements of a particular application are presented. Alternative Transparent Conductive Oxides (TCO) to ITO are mentioned but ot discussed in detail (see tutorial C-321).

Introduction

• Tutorial Overview
• Class Background and Interests
• Brief History of TCC Developments

Basic Physics of Transparent Conductive Coatings (TCC)

• Fundamentals of Conductivity
• Conductivity of Thin Films
• Optical Properties Related to Conductivity

Major Deposition Methods for TCC

• Evaporation
• Sputtering
• Pyrolysis and CVD

Control of TCC Film Properties

• Starting Material
• Deposition Process
• Post Deposition Processing

Selection of Deposition Method and Process Conditions

• Important Process Parameter
• Process Examples and Associated Coating Properties
• Developing a TCO Deposition Process

TCC Performance in Applications

• Application Examples
• TCC Function
• Strategy for Matching Application Requirements

Manufacturing Issues

• Sputtering Targets
• Etching
• Defects
• Indium Cost

Optional Topics

• Thin Film Optics
• Metal Nitride TCC

Some knowledge of basic thin film coatings and interference optics is assumed, although key basics will be reviewed. The tutorial will briefly cover the basic physics and fundamentals of conductivity. A prior introductory solid state physics tutorial would be helpful but is not required.

Not all of the topics listed above will be discussed in detail due to Tutorial time limitations. However, all of the topics will be included in the provided Tutorial Notes. The Instructor will select topics from the Tutorial Outline based on class background and interests. Time will be available for questions concerning your process problems.

Instructor: Clark Bright, Bright Thin Film Solutions, LLC (retired 3M)

This tutorial is a new edition of a well-established annual tutorial started in 1997. It is intended for anyone using or planning to use plasma processing technology, including cold atmospheric plasma sources and applications. Extensive applications of plasma processing are accompanied by an intense development of different new plasma sources and methods (e.g., afterglow and downstream plasmas, pulsed plasmas, inductively coupled plasmas and helicons, dc and rf hollow cathode plasmas, atmospheric plasmas, etc.). The tutorial covers both the explanation of basic physical and technical principles of conventional and non-conventional systems and typical examples of their applications. This is very important not only for adopting new plasma technologies and easier orientation in a new market, but also for better understanding of conventional commercialized systems.

Topical Outline:

• Gas discharge plasma - definition, characterization and generation principles.
• Fundamentals of plasma processing, conventional plasma sources and systems.
• Decaying plasmas and afterglows, time and space resolved afterglows, pulsed plasmas, hybrid plasma systems and processing.
• Microwave plasmas, ECR plasma, surfatron and surfaguide afterglows for PCVD of films.
• Novel radio frequency (rf) plasma systems, inductively coupled plasma (ICP) and helicons.
• Hollow cathode plasma sources (principles and basic applications), dc- and rf-generated hollow cathodes, linear hollow cathodes for large area processing.
• Classification of arcs, arc evaporation of films from rf hollow cathodes, vacuum arcs, metastable-assisted regimes in hollow cathodes.
• High density plasma sputtering.
• Magnets-in-motion concept in plasma sources, linear magnetized hollow cathodes.
• Cold atmospheric and subatmospheric plasma sources, corona and dielectric barrier discharges (DBD), microwave atmospheric plasma, fused hollow cathode discharge.
• Advantages and limits of the atmospheric plasma sources and applications.

Instructor: Hana Baránková, Uppsala University - Uppsala, Sweden

Instructor: Ladislav Bárdos, Uppsala University - Uppsala, Sweden

This tutorial is intended for engineers, technicians, and others interested in understanding deposition equipment, the deposition process, and film properties of cathodic arc deposition. The tutorial covers the basic physics and fundamental science of cathodic vacuum arc discharges, proper equipment design, and the particulars of arc coatings applications. Cathodic arc plasma parameters and their consequences for film properties are discussed. Cathodic arc deposition equipment is described and compared to other coatings equipment such as sputter and evaporation systems. The properties of cathodic arc-deposited coatings are reviewed and compared to coatings obtained by other deposition methods. Industrial aspects are discussed with emphasis on industrial applications and production processing. New fields of application and emerging cathodic arc applications are mentioned. Time will be available for questions concerning the applicability of cathodic arc films to specific problems such as the design and operation of cathodic arc deposition systems.

Topical Outline:

• The cathodic arc discharge
  — Physics of cathodic arc discharge
  — Explosive emission and fractal nature of cathode spot
  — triggering
  — macroparticle generation
  — steered arcs
  — plasma guiding in filters
• Vacuum arc deposition equipment
  — Historical overview
  — Arc source integration
  — Macroparticle filters
  — System design
• Deposition of films
  — Film growth mechanisms
  — energetic condensation
  — Nitrides, Oxides, ta-C (DLC)
• Industrial aspects
  — Substrate cleaning, fixturing, inspection
  — Emerging applications

Instructor: Gary Vergason, Vergason Technology - Van Etten, NY

This tutorial is intended for design engineers, materials scientists, and coatings developers who have a need to specify and develop coatings for tribological applications (i.e., those in which wear must be reduced or prevented and/or friction minimized). The coatings also may need to have corrosion-resistant properties to operate in arduous conditions. The tutorial begins with a description of the mechanics of wear and discusses the problems of selecting coatings for optimal tribological performance. An overview of the main processes for producing tribological coatings is given, emphasizing vacuum deposition methods. Tribological test methods also are over-viewed, including tests for adhesion and mechanical properties. Coatings developed for enhanced tribological properties are described, and information is provided on some applications for these coatings.

Topical Outline:

• Wear mechanisms and theories (adhesion, abrasion, erosion, fatigue, corrosion, etc.)
• Tribological and mechanical test methods (e.g., pin on disc, abrasive wheel, scratch adhesion, microhardness, etc.)
• Coating processes and selection
• Benefits of ceramic coatings by PVD methods
• Information on tribological coatings (e.g., metal nitrides, carbides, oxides, superlattices, multilayers, nanocomposites, DLC, etc., plus hybrid and duplex processes)
• Applications information (e.g., metal cutting and forming, molding, bearings, pumps, auto parts, etc.)

Understanding the effect of the deposition process is very important for producing high quality tribological films, and this understanding starts with how vacuum plasma processes work. Plasma process fundamentals are presented to give the student a better understanding of the effects of the process parameters on the generation of the sputtered or evaporated species and how the energy of these vaporized species plays an important role in the nucleation and growth of the deposited films. Important vacuum tribological coating processes such as triode electron beam evaporation, sputtering, reactive sputtering, and cathodic arc deposition are reviewed in detail, and similarities and differences in the processes are discussed with the goal of giving the student a better understanding of where to use one process over another. All successful tribological coating processes today use ion-assisted deposition (IAD), and how IAD works with the different deposition techniques is reviewed.

Once a tribological coating is deposited, it is important to be able to determine that a good coating has been produced. Common characterization tests for hardness and adhesion are presented, and the advantages and disadvantages are discussed. For example, the scratch adhesion test is routinely used to test the adhesion of a hard coating on a hard substrate. However one must be aware that the results from this test depend on many factors such as coating thickness and hardness, substrate hardness, and the condition of the test instrument. There are many tests for measuring the wear resistance of the coatings such as the pin-on-disc or abrasive wheel tests, and the pros and cons of these different tests are reviewed.

Common tribological coatings in use today are metal nitrides, carbides, oxides, and diamond like carbon (DLC) films. These different coatings can be deposited as single layer films, or they can be deposited as multi-layer or superlattice coatings. DLC films cover a wide variety of coatings that are carbon based, but which may include the incorporation of hydrogen or nitrogen to enhance their properties. Coatings can also be produced as nanocomposite compound films. These can be carbon-based or may (for example) contain ceramic/ceramic, ceramic/metal or metal/metal combinations. The use of nano-layered and nanocomposite coatings allows the mechanical properties to be tailored to optimize both hardness (H) and elastic modulus (E)- to obtain a high H/E ratio, and thereby ensure that the coating can accommodate substrate deformations without yielding.

Depositing a coating is thus only part of the solution for a well performing tribological coating. How the coating interacts with the substrate is an important part of the equation, and how the substrate supports the coating is equally important. Surface engineering where both the coating and the substrate are designed to work together to provide an enhanced performance that neither is capable of producing by itself is the basic building block for a successful tribological coating.

Many tribological coatings applications are discussed to give the student an awareness of the many successful applications for the different coatings. Coatings for metal cutting and forming, molding, bearings, pumps, and automotive parts are but a few of the successful applications in production today.

Instructor: Allan Matthews, University of Manchester - United Kingdom

This course addresses scientists, engineers, technicians, and students that are interested in sputtering. This course will start with fundamentals on plasma discharges. General aspects of process parameters and resulting film properties will be addressed. Different sputtering configurations will be addressed from diode, hollow cathode to magnetrons. Course will cover both, non-reactive and reactive sputtering. It will address DC, pulse-DC, RF magnetron sputtering as well as high power impulse magnetron sputtering HIPIMS. Non-reactive and reactive sputtering will be discussed.

Topical Outline:

• Plasma
• Interactions of process parameters and coating properties
  • Structure zone models
  • Energetic particles
  • Thermalization
  • Stress
• Fundamentals of sputtering
• Hollow cathode sputtering
• Magnetron sputtering
  • Sputtering cathodes
  • DC-, pulse-DC-, RF-excitation
  • Reactive Sputtering
• High power impulse sputtering HIPIMS
  • Fundamental aspects
  • Self sputtering runaway
  • Generalized Recycling Model
  • Reactive sputtering
  • Examples

Instructor: Ralf Bandorf, Fraunhofer IST - Braunschweig, Germany

Plasma treatments are used in the web coating and roll conversion industries to tailor polymer surfaces while preserving their bulk properties. This tutorial is intended for engineers, scientists, and technicians who would like to gain a better understanding of the influence of plasma process factors on treatment performance, as well as the practical issues related to process robustness, process speed, and ease of scale-up. While much of the tutorial deals with treatment of polymer webs, the key concepts presented are applicable to polymer surfaces in general and plasma treatment of materials in general.

Topical Outline:

• A basic introduction to plasmas including discussion of species distributions, the structure of glow-discharge plasmas, electrical breakdown of gases, and mechanisms of sustaining a plasma.
• Discussion of industrial applications of plasmas for polymer surface modification including wettability control & printing, bonding & adhesion, nucleation of films, control of biointeraction with surfaces, and control of gas-film interactions.
• Description of a variety of plasma treatment technologies and the importance of controlling the industrial treatment environment.
• The interaction of plasmas with polymer surfaces.
• The basics of polymer surface analysis along with examples of surface analytical techniques applied to plasma treated polymers including X-ray photoelectron spectroscopy, static secondary ion mass spectrometry, and high-resolution electron energy loss spectroscopy. Also included is discussion of adhesion, wetability, etc.
• Practical aspects of plasma web treatment including treatment dose, process factors and their roles, practical treatment efficiency, process verification, and process stability issues.
• Mechanisms of surface modification in the context of a site balance model.

Plasma treatments are used in the web coating and roll conversion industries to tailor polymer surfaces while preserving their bulk properties.  This tutorial is intended for engineers, scientists, and technicians who would like to gain a better understanding of the influence of plasma web treatment process factors on treatment performance, as well as the practical issues related to process robustness, process speed, and ease of scale-up.

The tutorial begins with a discussion of industrial applications of plasmas for polymer surface modification including wettability control & printing, bonding & adhesion, nucleation of films, control of biointeraction with surfaces, and  control gas-film interactions.  A variety of plasma treatment technologies are described, and the importance of controlling the industrial treatment environment is discussed.

A basic introduction to plasmas is presented, including discussion of species distributions, the structure of glow-discharge plasmas, electrical breakdown of gases, and mechanisms of sustaining a plasma.  Atmospheric pressure discharges are also discussed.  The basic concepts of plasmas are applied to strategies for process scale-up, the object of such strategies being to preserve the relevant species fluxes and energy distributions.  Scale-up with respect to geometry and line speed are discussed.  Process maintenance issues and plasma diagnostic techniques are also discussed.

The interaction of plasmas with polymer surfaces is a central component of this tutorial.  The basics of polymer surface analysis are presented along with examples of surface analytical techniques applied to plasma treated polymers.  X-ray photoelectron spectroscopy, static secondary ion mass spectrometry, and high-resolution electron energy loss spectroscopy are described with examples presented from nitrogen-plasma-treatment of some polyesters.  The variety of chemical and physical changes produced by plasmas are discussed.

Another major component of this tutorial deals with practical aspects of plasma web treatment.  Practical issues addressed include treatment dose, process factors and their roles, practical treatment efficiency, process verification, and process stability issues.  An approach to identifying promising treatment chemistries is presented with examples from applications to adhesion of vapor deposited silver to a polyester and adhesion of aqueous gelatin-containing coatings to a polyester. 

Practical testing of plasma-treated surfaces and interfaces is also given considerable attention, including a discussion of the inherent non-linearity of typical treatment responses.  Practical adhesion and fundamental adhesion are discussed and compared.  The importance of employing or developing quantitative test methods, even for practical purposes, is emphasized.  Types of measurements described include wettability/coatability, adhesion and fracture toughness, and chemical stability.

The final portion of the tutorial discusses mechanisms of surface modification in the context of a site balance model.  The simple site balance approach is presented and applied to analysis of the kinetics of polymer surface modification.  A lumped kinetic approach is introduced as a simple means for comparing treatment processes.  This approach is further developed by combination with plasma diagnostic techniques to suggest specific models for modification of polyesters by capacitively coupled low-radio-frequency nitrogen plasmas. 

Instructor: Jeremy M. Grace, IDEX Health & Science

This course is intended for senior technicians, scientists, engineers or graduate students.

Atomic Layer Deposition (ALD) is a powerful and enabling thin film deposition technology with a growing range of applications including semiconductors, energy, catalysis, thin film encapsulation, and emerging areas of nanotechnology. ALD fills a unique niche in thin film deposition technology where exceptional control is required for thickness, stoichiometry, and other film properties at an industrially relevant scale. New chemistries specifically designed for ALD are enhancing the repertoire of materials that can be grown, encompassing the whole range from insulating to conductive layers. New developments in the area of in situ tools for monitoring ALD growth are also enhancing the properties of films grown with ALD. Although generally limited to relatively thin layers, there is a growing interest in spatial ALD to scale to larger size substrates and thicker layers for new and emerging applications, and the field will continue to grow in size and application while demanding new solutions specific to ALD.

This introductory course will cover the essentials of ALD including discussion of practical issues such as reactor design, precursor choice, in-situ growth monitoring, and scale-up, as well as providing insight into the molecular scale phenomena that dictate the final product. We will also cover new developments in materials applications and ALD chemistries, as well as emerging applications in non-traditional thin film areas. This full day course allows sufficient time to cover both the fundamentals of ALD and more recent approaches including plasma ALD and spatial ALD. Potential students are encouraged to contact the instructor to highlight their background and specific goals.

Topical Outline:

• Introduction: basic concepts & fundamentals of Atomic Layer Deposition, ideal and non-ideal aspects.
• Overview of materials and chemistries for ALD
• Specific examples & case studies
• ALD reactor designs & operation
• In situ analytical tools for ALD
• Plasma ALD
• Spatial ALD
• Non-traditional applications and emerging areas of ALD

1. ALD basics and fundamentals: idealities and non-idealities
    - historical perspective
    - distinguishing features of ALD
    - ideal ALD
    - non-ideal ALD
    - thermal vs. non-thermal ALD
    - basic mechanisms of ALD

2. Overview of Materials & Chemistries for ALD
    - metals & conductors, oxides & insulators, semiconductors
    - desirable precursor properties
    - overview of precursor chemistries & precursor design

3. Specific examples and case studies
    - Al₂O₃
    - HfO₂
    - SrTiO₃
    - Pt, Ru

4. ALD reactor design & operation
    - general design & considerations
    - specific commercial reactor examples
   - intuitive models: reactor scale, growth per cycle, feature scale, molecular scale

5. In situ analysis
    - general thin film characterization
    - in situ analysis tools for ALD (ellipsometry)

6. Plasma ALD
    - reactor designs, chemistries, and applications

7. Spatial ALD
    - reactor designs, chemistries, and applications

8. Non-traditional application & emerging areas of ALD
    - Semiconductors
    - Energy
    - Catalysis
    - Nanotechnology

9. Literature reviews, patent reviews, & further information
 

Instructor: Necmi Biyikli, University of Connecticut - Storrs, CT

This tutorial is recommended for engineers and R&D staff members, who are involved in specifying new designs and surface treatments for components and tools. The application of Diamond Like Carbon, often in combination with pre-treatments like plasma nitriding and polishing, allows much improved wear resistance (abrasive, adhesive, fatigue) and to reduction of friction forces. Under the umbrella name of DLC, various classes of coatings have been developed, where each class of coatings has its own deposition technology and coating characteristics.

The industrial applications are presently mainly in components for e.g. automotive, aerospace, general machine building.

Topical Outline:

• Basics and standardization
  • Classification of different DLC’s
  • DLC’s in comparison to diamond films
  • Structure of hydrogen free and hydrogenated DLC’s
  • Mechanical properties of DLC’s
  • Tribological behaviour of DLC’s
  • Carbon based coating systems
• Technology and processes
  • PVD processes for deposition of hydrogen free DLC films
  • Plasma assisted CVD processes for preparation of a-C:H and modified a-C:H:X coatings
  • Hybrid processes
  • Duplex processes
  • Sputter deposition of metal containing a-C:H:Me coatings
  • Sputter deposition of metal free a-C:H coatings
  • Improved coating adhesion by interlayer systems
• Industrial applications
  • Contact modes and wear mechanisms
  • Coating design for specific wear mechanisms
  • Industrial DLC applications
  • Industrial deposition methods
  • Representative industrial examples
  • Near future expectations

Instructor: Martin Keunecke, Fraunhofer IST - Braunschweig, Germany
Instructor: George Savva, Ionbond North America
Instructor: Lars Haubold, Fraunhofer USA

Instructor: Christian Stein, Fraunhofer IST - Braunschweig, Germany

This course is intended for people with a basic background in thin films who need to understand the broad range of techniques available to characterize films. The course is appropriate for technicians, engineers, and managers who perform or specify characterization work as well as students seeking a broad understanding of the field.

This tutorial examines the broad range of techniques available to characterize thin film materials. We examine the range of properties of interest and how thin film properties may differ from bulk properties. Generic differences between counting and spectroscopic techniques are presented. Available “probes” are identified.

The main emphasis of the tutorial is an overview of a wide range of characterization techniques. We examine imaging techniques such as Optical microscopy, Scanning electron microscopy (SEM), Transmission electron microscopy (TEM), and Scanning probe microscopies (STM, AFM …). We also explore techniques, which provide information about structural properties including X-ray diffraction (XRD), Stylus profilometry, Quartz crystal monitors (QCM) and density measurements.

The tutorial examines techniques, which explore chemical properties such as Auger electron spectroscopy (AES), Energy Dispersive Analysis of X-rays (EDAX), X-ray Photoelectron Spectroscopy (XPS, ESCA), Secondary Ion Mass Spectrometry (SIMS), and Rutherford Backscattering (RBS). AES is used as a prototype to examine quantitative analysis of spectroscopic data. Characterization techniques for optical properties such as ellipsometry and optical scattering are also considered. Many of these chemical and optical techniques can also provide information about structural properties.

Techniques for determining electrical and magnetic properties are also discussed. These include resistance / four point probe, Hall effect, magneto-optical Kerr effect and ferromagnetic resonance. The emphasis here is on materials characterization as opposed to device characterization.

The tutorial concludes with an examination of techniques used to explore mechanical properties such as stress-curvature measurements, friction testing, micro/nano indentation and adhesion tests.

Topical Outline:

Overview of wide range of characterization techniques for thin films including:

• Mechanical properties (stress, friction, micro/nano indentation, adhesion…)
• Imaging (microscopies: optical, SEM, TEM, AFM …)
• Structural properties (XRD, profilometry, QCM …)
• Chemical properties (AES, EDAX, XPS, SIMS, …)
• Electrical/magnetic properties (resistance, Hall effect, Kerr effect …)

• Overview of thin film characterization
  • What do we want to know?
  • How could we find this out?
    • Available probes
    • Counting techniques
    • Spectroscopic techniques
  • Why are thin films different from bulk?
• Imaging techniques
  • Optical microscopy
  • Scanning electron microscopy (SEM)
    • Electrons in solids
  • Transmission electron microscopy (TEM)
  • Scanning probe microscopies
    • Overview: near field effects
    • Scanning tunneling microscopy (STM)
    • Atomic force microscopy  (AFM)
• Structural properties
  • X-ray diffraction (XRD)
  • Stylus profilometry
  • Quartz crystal monitors (QCM)
  • density
• Chemical / structural properties
  • Auger electron spectroscopy (AES)
    • Quantitative data analysis in spectroscopies
    • Instrumental sensitivity factors
    • Depth profiling by inert gas sputtering
  • Energy Dispersive Analysis of X-rays (EDAX)
  • Wavelength Dispersive X-ray Analysis (WDX, electron microprobe)
  • X-ray Photoelectron Spectroscopy (XPS, ESCA)
    • Depth profiling by angle-resolved XPS
  • Secondary Ion Mass Spectrometry (SIMS)
  • Rutherford Backscattering (RBS)
• Optical / structural properties
  • Ellipsometry
    • Single wavelength vs. multiple angle vs. spectroscopic
    • Ellipsometry models
  • Optical scattering
• Electrical properties
  • Resistance/resistivity
    • four point probe
    • Van der Pauw
  • Hall effect
• Magnetic properties
  • Magneto-optical Kerr effect
  • Ferromagnetic resonance
• Mechanical properties
  • Stress-curvature measurements
    • Tensile vs. compressive stress
  • Friction testing
    • Pin on flat
    • Pin on disk
  • Micro/nano indentation
  • Adhesion tests

Instructor: Tom Christensen, University of Colorado - Colorado Springs, CO

This course is intended for engineers, technicians, students, and others interested in using high power impulse magnetron sputtering (HIPIMS) for deposition. Some basic understanding or experience with plasmas and materials is desirable but not required. The course starts with a brief introduction to plasma and sheath physics in general, as it is relevant for coatings and films. We will explain the operation and physical processes of DC magnetrons to provide the foundation for the understanding of the time-dependent processes in pulsed systems. To appreciate the effects of pulsed plasmas on coatings, we provide first a brief overview on film growth modes and the effects obtained by ion bombardment. Attention will also be paid to substrate surface modification by very energetic ions (etching) where sputtering and shallow ion implantation occur.

Equipped with these basics, we move on to the central topic of this course, high power impulse magnetron sputtering (HIPIMS). With HIPIMS we mean a pulsed sputtering process where the power density on the sputtering target is greatly enhanced (about two orders of magnitude) over the average power density. Hence, the word “impulse” is adopted to signify a low duty cycle. We will compare HIPIMS with the more conventional medium-frequency pulsed sputtering.

We will explain how the time-dependent HIPIMS discharge differs from conventional magnetron discharges. The resulting plasma is compared to plasmas of other magnetron and arc discharges.

A central part is the physics and engineering aspects of pulsed plasmas, pulsed sheaths, and pulsed substrate bias. We move on to see what kind of effects one can obtain by using pulsed plasma systems. Such effects include the increase of the degree of ionization, dissociation of the reactive gas, interface tailoring, and control of film stress and microstructure. Examples of applications of high power impulse magnetron sputtering are given.

Topical Outline:

• HIPIMS - An Introduction
• Stationary plasmas, sheaths, discharge
• DC magnetron, and comparison to DC arc
• Ion surface modification: etching and film growth, energetic condensation
• Pulsed plasmas and sheaths
• High Power Impulse Magnetron Sputtering: the discharge
• Plasma characterization and plasma diagnostics
• Substrate biasing: etching / growth assist
• Interface engineering by using HIPIMS plasmas
• Deposition and coatings by HIPIMS
• Microstructure and Texture tailoring by HIPIMS
• Deposition rates
• Hardware
• Applications

Instructor: Arutiun P. Ehiasarian, Sheffield Hallam University, United Kingdom

Atmospheric plasma technologies is a rapidly growing area in plasma-assisted technologies. However, the atmospheric plasma requires a special design of plasma sources to ensure non-equilibrium, i.e. non-thermal plasma in a number of applications in coating and surface treatment. Technologies using the atmospheric pressure plasma sources bring about fast processes, but it is important to be aware of limits given by atmospheric plasma properties and plasma chemical reactions. This introduction tutorial course addresses the most important principles and applications of non-thermal atmospheric plasma.

Topical Outline:

• Cold atmospheric plasma sources - principles, problems to solve
• Corona and Dielectric Barrier Discharges (DBD)
• Atmospheric pressure plasma jets
• Fused Hollow cathodes
• Microwave atmospheric plasmas
• Atmospheric plasma with/in liquids
• Applications of the atmospheric plasma
• Advantages and limits of the atmospheric plasma sources

Instructor: Hana Baránková, Uppsala University - Uppsala, Sweden

Instructor: Ladislav Bárdos, Uppsala University - Uppsala, Sweden

This tutorial provides detailed information on how to establish and improve evaporated coating processes for precision optical coatings. Design considerations for coating chambers, such as source placement, substrate fixturing, control of film thickness uniformity, and thickness monitors will be discussed. Trade-offs in the selection of source materials, means of controlling film structure, and the influence on the performance of the coated component will be considered. Process details will be approached with a focus on practicality; film properties must be measurable and system designs must be practical and cost-effective. Measurement techniques will be discussed to identify the influence of the coating process, understanding film performance as well as characterizing shortcomings of process methods. These process concepts are readily implemented in standard evaporation systems, providing significant improvements in existing coating facilities.

1. Chamber Components
   1. Pumping
      1. Types of pumps and gauges
      2. Cleanliness
      3. Mean-free path
   2. Heating
      1. Influence on film structure
      2. Types of heaters and output spectra
      3. Risks in heating/cooling profiles (breakage)
   3. Gas Control
      1. Pressure control
      2. Flow control
   4. Evaporant Sources
      1. Electron-beam guns (sweeps, material form, comparisons of different configurations)
      2. Resistance sources (boats, filaments, material form)

1. Thin-film Monitoring
   1. Optical monitoring
      1. Single-wavelength (reflection, transmission, addressing limitations of each)
      2. Broad-spectrum (data fitting, understanding of complexity in implementation)
   2. Quartz crystal monitoring
      1. Stability and control with a single monitor
      2. Multi-point monitoring
      3. Crystal changing due to dynamic calibration changes
      4. Understanding of vapor plume through multiple crystal monitors

1. Thin-film Uniformity
   1. Simple rotation
      1. Uniformity calculations
      2. Optimal source placement
      3. Mask design for improved film distribution
   2. Domed, or pyramidal, rotation
      1. Improved system capacity
      2. Uniformity and source determination
      3. Masking
   3. Planetary Rotation
      1. Influence of gearing on achieved film uniformity, and optimal selection of gears
      2. Optimal source placement
      3. Characterization of uniformity using laser photometry (single wavelength)
      4. Calculation of film distribution in a uniformity model
      5. Design and modeling of a corrective mask
      6. Advanced planetary motion (tilted planets, domed planets)
   4. Impact of errors
      1. Changes in substrate height
      2. Influence of tilt in a planet

1. Thin-film stress
   1. Theoretical basis of stress
      1. Calculation of stress from Stoney’s equation
      2. Thermal stresses
      3. Intrinsic stresses
      4. Structure zone models (Movchan & Demchishin, Thorton)
   2. Measurements of optics for determination of film stress
      1. Choice of substrate
      2. Influence of interferometer wavelength and coating phase
      3. Impact of humidity on thin-film stress
      4. Aging of film stress
   3. Modifications to film stress by process changes
      1. Thermal
      2. Pressure
      3. Substrate material
      4. Coating material
      5. Densification (ion sources, plasma sources)

Instructor: Jim Oliver, Vacuum Innovations, LLC

Understanding the factors that control friction and wear are of vital industrial and economic importance. The function, reliability, and lifetime of many mechanical, electromechanical and even biological systems are impacted by the complex relationships between materials, surfaces, design, and the environments that they are exposed to. Increasing complexity and performance requirements that are driven by economics, and a heightened awareness of health and safety issues with traditional chemical plating processes offers new opportunities and challenges for novel coatings and advanced surface engineering techniques. This tutorial is intended for engineers, designers, managers and purchasing professionals who have a need to specify, develop and procure coatings for tribological applications (i.e., those applications in which wear must be reduced or prevented and/or friction minimized). These coatings will likely require corrosion-resistant properties to operate in arduous conditions and must also exhibit functional characteristics (color, adhesion scratch resistance, etc.) that span the complete range from industrial to consumer products. The tutorial begins with a description of the mechanics of wear and discusses the criteria for selecting coatings for optimal tribological performance. An overview of the main processes for producing tribological coatings is provided with emphasis on vacuum deposition methods. Tribological test methods also are reviewed, including tests for adhesion and mechanical properties. Finally, coatings developed for enhanced tribological and decorative properties are described and examples of applications are presented.

Topical Outline:

• Wear mechanisms and theories (adhesion, abrasion, erosion, fatigue, corrosion, etc.)
• Tribological and mechanical test methods (e.g., pin on disc, abrasive wheel, scratch adhesion, microhardness, etc.)
• Coating processes and selection
• Benefits of ceramic coatings by PVD methods
• Information on tribological coatings (e.g., metal nitrides, carbides, oxides, superlattices, multilayers, nanocomposites, DLC, etc., plus hybrid and duplex processes)
• Applications information (e.g., metal cutting and forming, molding, bearings, pumps, auto parts, etc.)

Understanding the effect of the deposition process is very important for producing high quality tribological films, and this understanding starts with how vacuum plasma processes work. Plasma process fundamentals are presented to give the student a better understanding of the effects of the process parameters on the generation of the sputtered or evaporated species and how the energy of these vaporized species plays an important role in the nucleation and growth of the deposited films. Important vacuum tribological coating processes such as triode electron beam evaporation, sputtering, reactive sputtering, and cathodic arc deposition are reviewed, and similarities and differences in the processes are discussed with the goal of giving the student a better understanding of where to use one process over another. All successful tribological coating processes today use ion- or plasma-assisted deposition, so the basics of plasma effects are  reviewed.

Once a tribological coating is deposited, it is important to be able to determine that a good coating has been produced. Common characterization tests for hardness and adhesion are presented, and the advantages and disadvantages are discussed. For example, the scratch adhesion test is routinely used to test the adhesion of a hard coating on a hard substrate. However one must be aware that the results from this test depend on many factors such as coating thickness and hardness, substrate hardness, and the condition of the test instrument. There are many tests for measuring the wear resistance of the coatings such as the pin-on-disc or abrasive wheel tests, and the pros and cons of these different tests are reviewed.

Common tribological coatings in use today are metal nitrides, carbides, oxides, and diamond like carbon (DLC) films. These different coatings can be deposited as single layer films, or they can be deposited as multi-layer  coatings. DLC films cover a wide variety of coatings that are carbon based, but which may include the incorporation of hydrogen or nitrogen to enhance their properties. Coatings can also be produced as nanocomposite compound films. These can be carbon-based or may (for example) contain ceramic/ceramic, ceramic/metal or metal/metal combinations. The use of nano-layered and nanocomposite coatings allows the mechanical properties to be tailored to optimize both hardness (H) and elastic modulus (E)- to obtain a high H/E ratio, and thereby ensure that the coating can accommodate substrate deformations without yielding.

Depositing a coating is thus only part of the solution for a well performing tribological coating. How the coating interacts with the substrate is an important part of the equation, and how the substrate supports the coating is equally important. Surface engineering where both the coating and the substrate are designed to work together to provide an enhanced performance that neither is capable of producing by itself is the basic building block for a successful tribological coating.

Many tribological coatings applications are discussed to give the student an awareness of the many successful applications for the different coatings. Coatings for metal cutting and forming, molding, bearings, pumps, and automotive parts are but a few of the successful applications in production today.

Instructor: Allan Matthews, University of Manchester - Manchester, United Kingdom

Instructor: Gary Doll, University of Akron - Akron, OH

This course focuses on PV thin film technologies like Cu(In,Ga)(Se,S)₂, CdTe an the amorphous and microcrystalline silicon solar cells which are nowadays mainly introduced. Starting point is a market overview followed by the basic designs of these solar cell types and their efficiency potentials. Especially the different manufacturing technologies are introduced focusing the different production and process steps of each solar cell type.

Topical Outline:

• Market situation
• Cell design of thin film solar cells
• Research activities
• Production and process technologies for thin film solar cells

Market overview of thin film PV

Research activities

• Sputtering
• CVD
• LPCV
   

• Evaporation
• PECVD, CVD
• Electro deposition
• Sputtering (RTP)

  - Puffer:

• CBD
• CSS
• Evaporation
• ALD

  - Back contact:

• Sputtering
• LPCVD

Instructor: Volker Sittinger, Fraunhofer Institute – Germany

Indium tin oxide, ITO, is the most common of Transparent Conductive Oxides (TCO). However, there are concerns about ITO cost, availability and in some cases, performance. This tutorial covers zinc oxide-based alternatives with various dopants including, aluminum (AZO) and gallium (GZO), as well as other TCO alternatives to ITO. The tutorial is intended for scientists, engineers, technicians and others, interested in understanding the materials, deposition, properties and applications of TCO. The effects of dopant material choice and concentration on TCO properties are explored. TCO deposition by common methods, e.g., evaporation and CVD/pyrolysis, are described, although magnetron sputter deposition is emphasized. The influence of the deposition method on the TCO properties is shown including reported performance with Pulsed Laser Deposition (PLD). Engineering of TCO film properties by controlling deposition process parameters is explained. TCO properties with high temperature processes, e.g., on glass substrates, and low temperature processes, e.g., on plastic substrates, are compared. The instability of ZnO-based and other TCO in high temperature and high humidity environments is discussed, progress reported and future directions suggested. Designing and engineering TCO properties for specific applications is explained and examples presented. (This full-day tutorial is much more in-depth than the previously offered one-half day course (C-321) which surveyed alternative TCO types and achieved performance).

Topical Outline:

• Conductivity in transparent metal oxides
• Performance expectations; Theory and ITO baseline
• ZnO-based materials and dopants
• Performance of TCO grown by major deposition methods
• Control of TCO film properties
• Other TCO hosts and dopants
• Advanced doping techniques
• Environmental performance of ZnO-based and other TCO
• Designing and engineering TCO properties for applications
• Applications examples of TCO

Instructor: Clark Bright, Bright Thin Film Solutions, LLC (retired 3M)

This tutorial is intended for decision makers, engineers, technician and students interested in equipment availability, applications and process requirements of HIPIMS. Basic understanding or experience with plasma and materials is desirable but not required.

HIPIMS is a highly ionized pulsed sputtering process that produces significant ionization of the sputtered materials that, in turn, enables effective surface modification by ion etching and energetic deposition. Energetic deposition allows the formation of coatings with unique or superior properties compared to other deposition processes. Presently HIPIMS is undergoing the transition from academic research to being a major industrial process. 

The tutorial starts with a short introduction in the basics of HIPIMS technology. An extended treatment of HIPIMS is provided by the tutorial C-323 “High Power Impulse Magnetron Sputtering. The main focus of this tutorial is on commercially available equipment and its specifications as well as the general processing principles. Finally industrial (or close to industrial) applications will be presented.

Topical Outline:

1. Introduction to HIPIMS Technology

2. Industrial Equipment
   a. HIPIMS pulse generation
   b. Process control (reactive HIPIMS)
   c. HIPIMS diagnostics
   d. HIPIMS Coating systems

3. HIPIMS Applications
   a. HIPIMS etching
   b. Trench filling, Through via connection
   c. TCOs
   d. Hard coatings
     - nitrides
     - carbides
e. Optical coatings

This tutorial is intended for engineers, technicians, students, and others interested in using pulsed plasmas for deposition in general, and high power impulse magnetron sputtering (HIPIMS) in particular. Some basic understanding or experience with plasmas and materials is desirable but not required. The tutorial starts with an introduction to high power impulse magnetron sputtering (HIPIMS). We will explain the idea behind HIPIMS and the potential for industrial applications, especially the chance to improve adhesion and coating properties, as well as to create new coatings, not possible with other techniques. This course will only cover be a brief introduction to HIPIMS (for extended information and physical background please refer to C 323). Equipped with these basics, we move on to the central topic of this tutorial, the commercially available components for pulse generation and process control, as well as plasma characterization. We will look at the basic principle of a HIPIMS power supply. The different commercially available power supplies will be presented with their corresponding key features. Especially for industrial size processes and reactive sputtering a suited process control is essential. Available systems for active feedback control for reactive HIPIMS will be presented. For the characterization several methods and systems are available. We will focus on the specifics of HIPIMS and on diagnostic tools taking the process characteristics into account. The section will be closed by an overview on HIPIMS machines actually offered by different plant manufacturers. The tutorial is concluded by considering different applications, already industrialized, or close to industrialization. The potential of the different processes used and the general pulse sequences reported in literature will be summarizes and presented. This final section will show the published state of the art of industrialization of HIPIMS technology and provide visions for future applications with new or superior coatings prepared by HIPIMS.

Instructor: Ralf Bandorf, Fraunhofer IST - Braunschweig, Germany

Instructor: Arutiun P. Ehiasarian, Sheffield Hallam University - United Kingdom

This tutorial provides detailed information on how to establish and improve evaporative coating processes for precision optical coatings. Design considerations for coating chambers, such as source placement, substrate fixturing, control of film thickness uniformity, and thickness monitors will be discussed. Trade-offs in the selection of source materials, means of controlling film structure, and the influence on the performance of the coated component will be considered. Process details will be approached with a focus on practicality; film properties must be measurable and system designs must be practical and cost-effective. Measurement techniques will be discussed to identify the influence of the coating process, understanding film performance as well as characterizing shortcomings of process methods. These process concepts are readily implemented in standard evaporation systems, providing significant improvements in existing coating facilities.

Topical Outline:

1) Chamber Components
    a) Pumping
        i) Types of pumps and gauges
        ii) Cleanliness
        iii) Mean-free path
   b) Heating
        i) Influence on film structure
        ii) Types of heaters and output spectra
        iii) Risks in heating/cooling profiles (breakage)
   c) Gas Control
        i) Pressure control
        ii) Flow control
   d) Evaporant Sources
        i) Electron-beam guns (sweeps, material form, comparisons of different configurations)
        ii) Resistance sources (boats, filaments, material form)

2) Thin-film Monitoring
   a) Optical monitoring
        i) Single-wavelength (reflection, transmission, addressing limitations of each)
        ii) Broad-spectrum (data fitting, understanding of complexity in implementation)
   b) Quartz crystal monitoring
        i) Stability and control with a single monitor
        ii) Multi-point monitoring
        iii) Crystal changing due to dynamic calibration changes
        iv) Understanding of vapor plume through multiple crystal monitors

3) Thin-film Uniformity
   a) Simple rotation
        i) Uniformity calculations
        ii) Optimal source placement
        iii) Mask design for improved film distribution
   b) Domed, or pyramidal, rotation
        i) Improved system capacity
        ii) Uniformity and source determination
        iii) Masking
   c) Planetary Rotation
        i) Influence of gearing on achieved film uniformity, and optimal selection of gears
        ii) Optimal source placement
        iii) Characterization of uniformity using laser photometry (single wavelength)
        iv) Calculation of film distribution in a uniformity model
        v) Design and modeling of a corrective mask
        vi) Advanced planetary motion (tilted planets, domed planets)
   d) Impact of errors
        i) Changes in substrate height
        ii) Influence of tilt in a planet
   e) Uniformity measurement
        i) Spacing of measurements
        ii) Spectral versus laser-based

4) Thin-film stress
   a) Theoretical basis of stress
        i) Calculation of stress from Stoney’s equation
        ii) Thermal stresses
        iii) Intrinsic stresses
        iv) Structure zone models (Movchan & Demchishin, Thorton)
   b) Measurements of optics for determination of film stress
        i) Choice of substrate
        ii) Influence of interferometer wavelength and coating phase
        iii) Impact of humidity on thin-film stress
        iv) Aging of film stress
   c) Modifications to film stress by process changes
        i) Thermal
        ii) Pressure
        iii) Substrate material
        iv) Coating material
        v) Densification (ion sources, plasma sources)

5) Properties of Thin Films
   a) Optical constants of thin films
   b) Measurement of thin film performance
        i) Selection of substrate
        ii) Spectral measurements
        iii) Ellipsometric measurements
        iv) Laser-based measurements
        v) Scatter measurements
        vi) Defect counts
        vii) Laser damage thresholds
        viii) Surface roughness (AFM versus white light interferometry)
        ix) Film thickness (optical versus step-height measurements, and the problems with each)
        x) Interferometry and the influence of coating phase
        xi) Other evaluation techniques - XRD, XPS, ToF-SIMS, Auger, SEM/EDAX, TEM/Electron-Diffraction
   c) Modeling of film properties
   d) Influence of film properties on the design of optical thin films
   e) Process dependence on coating performance

Instructor: Jim Oliver, Vacuum Innovations, LLC

This tutorial course will be of special value and interest to scientists, engineers, senior technical staff, and graduate students and anyone who want to learn the latest advances and applications in the specific field.

Thin transparent layers on polymer films are being used to drastically enhance the permeation barrier properties of polymer films while at the same time maintaining the flexibility and optical transparency of the polymer film. Applications range from food packaging films to encapsulation films for solar cells or flexible electronics.

This tutorial gives a comprehensive overview about the state-of-the-art in the field of transparent thin film permeation barriers. It covers a short overview about the scientific and technological fundamentals and their consequences for applications. Different permeation measurement principles and methods will be compared briefly. Single and multi-layer materials and technologies for the fabrication of thin film permeation barriers will be reviewed and evaluated regarding their suitability for different applications. Not only gas permeability but also optical properties, mechanical robustness and processing aspects will be discussed. Products and application examples will be discussed and an outlook about the current hot-topics in the field will be given.

Topical Outline:

• The need for barriers – products and requirements
• How to apply a barrier to your product - types of encapsulation
• Thin-film permeation physics and consequences for application
   - Permeation in polymers and solids
   - Models and mechanisms for permeation in thin films – the role of layer defects
   - Influence of measurement conditions (temperature, gas concentration, time)
   - Permeation in multi-layer stacks
• Overview about measurement-methods for barrier properties
   - Measurement concepts and methods
   - Typical measurement conditions
• Materials and Technologies for thin film barriers
   - Single and graded layer technologies
• Evaporation techniques
• Sputtering
• Plasma-enhanced chemical vapor deposition (PECVD)
• Atomic layer deposition (ALD)
• Short note on other methods
   - Influence of substrate quality and processing on barrier performance
   - Multilayer technologies
   - Techniques for interlayer deposition
• Properties of multi-layer stacks compared to single layers
• Application examples and outlook
   - Devices and their performance
   - Functional films and substrates for flexible electronics
   - Direct encapsulation versus barrier film lamination
   - Economic aspects

This course was developed by John Fahlteich, Steffen Günther, Nicolas Schiller, and Matthias Fahland, Fraunhofer Institute for Electron Beam and Plasma Technology FEP, Dresden, Germany

Instructor: John Fahlteich, Fraunhofer FEP - Dresden, Germany

This tutorial course is intended for scientists, engineers, technicians, and others, interested in understanding the fundamentals, materials, deposition, manufacturing, properties and applications of TCO.

The tutorial explains doping and conductivity in Transparent Conductive Oxides (TCO) including, indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide with various dopants, particularly aluminum (AZO) and gallium (GZO). Other alternative TCO, e.g., SnO₂:F, are included in examples. TCO deposition by magnetron sputtering is emphasized, although other methods, e.g., evaporation, CVD/pyrolysis and Pulsed Laser Deposition (PLD) are briefly described, but can be expanded based upon class interest. Specific examples of the TCO Optical/Electrical (O/E) properties achieved with various processes are shown. Developing a robust deposition process for TCO is explained. The importance of substrate temperature and the effect of post-deposition processing also are discussed. TCO properties achieved with high temperature processes, e.g., on glass substrates, and low temperature processes, e.g., roll-to-roll on flexible plastic substrates, are compared and the large differences explained. Designing and engineering of TCO O/E properties for specific applications by controlling deposition process parameters are explained. Many application examples are presented.

Topical Outline:

• Introduction (History and Review)
• Conductivity and Transparency in Metal Oxides
• Optical Properties Related to Conductivity
• TCO Performance Expectations, Theory and ITO Baseline
• Control of TCO Film Properties
• Developing a Robust Deposition Process: The “Resistivity Well”
• TCO Host (ZnO, In₂O₃, SnO₂) Materials and Dopants
• Designing and Engineering TCO Properties for Applications (Examples)
• Appendix I, Thin Film Optics
• Appendix II, Performance of TCO Grown by Energetic Deposition Methods
• Appendix III, Advanced Doping Techniques
• Appendix IV, Transition Metal Doping, e.g., Mo, Ti, W, Zr, …

Instructor: Clark Bright, Bright Thin Film Solutions, LLC (retired 3M)

This tutorial covers the fundamentals of reactive sputtering for applications. A short introduction in reactive sputtering is given, dealing with the occurrence of hysteresis and ways to control the process. A theoretical description using the Berg model will motivate the understanding of the reactions involved in the coating chamber. Following the basics, different options for process control will be discussed. Especially for processes that drift towards compound mode the risk of arcing is increasing. Ways to control and avoid arcing will be discussed. Different sensors for the process control will be presented and discussed with respect to benefits and limitations of each one. Reactive process control for industrial processes will be addressed. The course will conclude with recent developments.

Instructor: Holger Gerdes, Fraunhofer IST - Braunschweig, Germany

Instructor: Ralf Bandorf, Fraunhofer IST - Braunschweig, Germany

The course is addressed to: biotechnologists, medical professionals, biomedical engineers, physicists, surface engineers, mechanical engineers, thin film specialists, electronics engineers, and sensor developers. Participants should possess a basic minimum knowledge of the functions of the human heart and lungs. This is a comprehensive course on mechanical heart valves.

Over the past fifty years, more than 100 different mechanical heart valves have been designed and implanted. A large number of mechanical heart valves are being implanted worldwide; a large number of them are failing after implant. There are many challenges in the materials, design and surface engineering of mechanical heart valves. The primary aim of the course is to introduce the basic functions of heart valves; the course also aims at a review of the present status of the mechanical valves. The opportunities (in terms of design) and challenges of mechanical heart valves will be summarized.

Topical Outline:

- Introduction to Heart valves and valve functions
- Basics of Haemodynamics
- Basic understanding of thrombosis and embolism (coagulation cascade is beyond the course content)
- Basics of prosthetic heart valves : problems and management
- Mechanical heart valves: designs and evolution
- Mechanical heart valves: basic working principles
- Mechanical heart valves: problems and management
- Comparison of performance of contemporary mechanical heart valves
- Mechanical versus prosthetic valves: advantages and disadvantages
- Criteria for mechanical valve replacement
- Valve dysfunctions: Obstructive thrombosis, Pannus (over growth of fibrous tissue and impairment in leaflet movement) and diagnostic techniques
- Engineers’ perspective of surface and surface engineering of mechanical valves
- Thin film coatings for next generation mechanical heart valves : management of thrombosis and incorporation of sensor technology
- Diagnostic techniques for heart valve monitoring: existing and emerging sensors and techniques
- Concept of early warning (eWAR) of mechanical heart valve failure

Instructor: Aryasomayajula (Manu) Subrahmanyam , Indian Institute of Technology Madras - Chennai, India

Modern optical applications need solutions for the antireflective equipment of polymer surfaces. The problems for coating comprise thermal limitations, incompatible mechanical properties of coating and substrate materials and the interaction between polymers and plasma. This course provides attendees with a basic knowledge of transparent polymer materials for optical applications. The course concentrates on polymer material properties, coating processes suitable for polymers, interactions between polymers and plasma, adhesion, stress, interference layers for polymers, hard coatings, top-layers to control the wettability and evaluation and testing procedures.

The course especially concentrates on antireflection coatings and antireflective sub-wavelength structures. The potential to produce antireflective interference coatings is shown for plasma-assisted vacuum deposition techniques as well as for sol-gel wet chemical processes. In addition, various procedures to obtain antireflective structures on polymers will be explained. Special solutions are discussed for acrylic, polycarbonate and cycloolefine polymers.

This course is of use for anyone who would like to get an overview about the problems connected with coating plastics. It is addressed to newcomers and experts on technical and high school level and to engineer and science students of higher terms.

Topical Outline:

 This course should enable you to:
• Specify the best suitable polymer materials for your application;
• Understand the special behavior of polymers during vacuum coating processes;
• Evaluate different techniques for antireflection of polymer surfaces; and
• Define suitable characterization tools and testing procedure for your plastic optics.

Instructor: Ulrike Schulz, Fraunhofer IOF - Jena, Germany

One of the most innovative and developed flexible transparent substrate materials in the last few years is flexible glass. This Tutorial course is intended for engineers, technicians, and others involved with vapor deposition of thin films by magnetron sputtering, and who is interested in a better understanding of challenges and opportunities of thin film processing on flexible glass.

With thicknesses below 200 μm glass is thin enough to be flexible and opens as a new substrate material a wide range of new application fields. For applications - e.g., displays, OLEDs, or sensors - flexible glass enables realization of thin, light, robust, curved, and conformable devices.

Besides the challenge of substrate handling, the functionalization of the surface by thin films using PVD deposition methods also has to be optimized for further processing of a device. The thermal and dimensional stability of the coated substrate influences device fabrication and processing in sheet-to-sheet and roll-to-roll.

Due to the low thickness of flexible glass, the handling generally presents challenges for manufacturers of thin-film coatings. Mechanical film stress is here one of the main influences of the bendability of flexible glass. The sputtering process parameters have to be adjusted for multiple processing procedures, to improve processing stability and manufacturing of high quality films. Experimental results will be used to illustrate the challenges during thin film processing on flexible glass. The influence of selected process parameter for high deposition rate sputtering on the film- and substrate-stress will be discussed. Several examples of functional layer stacks on flexible glass, such as transparent conductive coatings, anti-reflective coatings, and infrared-blocking coatings including their properties will be demonstrated. The properties of these functional layers and layer stacks will be compared with those on flexible polymer substrates.

Transparent conductive oxides (TCOs) are also key materials in optoelectronic applications; mainly indium tin oxide (ITO) and indium zinc-oxide (IZO) are the most popular materials. For highly conductive TCO films thermal pre and post- annealing process steps are standard in film processing. Recently, ultra-short time annealing methods like flash lamp annealing (FLA) in the millisecond time-range, are gaining more importance for improved performance of thin films and surfaces refinement and will be also discussed in this Tutorial. The ability of FLA enables new options for high quality TCO film fabrication, also on flexible glass.

The focus of the Tutorial is pointing out critical parameters of thin-film sputter deposition for an improved handling and performance of flexible glass, and will showing possible path ways forward for optimized thin film processing on flexible glass. The Tutorial course concludes with a detailed discussion of the challenges, chances and solutions of flexible glass processing.

Topical Outline:

- Introduction
- Application fields for flexible glass
- Properties of flexible glass
   • Mechanical properties
- Advanced processing and handling of flexible glass
   • Sheet-to-sheet and roll-to-roll processes of inorganic and organic films
   • The role of film stress on the reliability
   • Large area coatings
   • Optimized magnetron sputtering processes for low film stress depositions
   • Substrate handling
   • Post treatment of thin films by flash lamp annealing (FLA)
- Examples for functional layer and layer stack processing on flexible glass
   • Infrared blockers (IR)
   • Anti-reflecting coatings (AR)
   • Transparent electrodes based on transparent conductive oxides (TCOs)
   • Organic emitting diodes (OLED)
- Summary
- Discussion

Instructor: Manuela Junghähnel, Fraunhofer IZM-ASSID - Dresden, Germany

This one-day course will provide a background of the present state of thin-film photovoltaic (PV) solar cell technologies, and markets within the context of expected national and global future energy requirements. The technologies discussed will be primarily those in present world-wide production, focusing on amorphous Silicon (a-Si), Copper Indium Gallium Diselenide (CIGS), and Cadmium Telluride (CdTe), although some discussion will be provided for emerging thin-film technologies, such as Kesterites.

For each technology, discussion will include historical development, present advantages and limitation, and possible future directions for improved devices and modules. A very condensed discussion of PV device physics will be provided to establish an appreciation of material parameters that are important to related device operation. The course will also discuss advancements in related technologies that may be critical for accelerating deployment of thin-film PV products. Examples of this include development of thin-film PV specific glass and device-specific transparent conducting oxides and buffer layers.

The course will conclude with a discussion of considerations for large-scale deployment of thin-film PV that are becoming much more important as these technologies mature. These considerations include: reliability and expected product lifetime, expectations of mineral resource abundance, perceived or real concerns material toxicity, and the important interrelationship between energy-pay-back time and production-doubling time.

Instructor: Timothy Gessert, Gessert Consulting, LLC

This course is intended for scientists, engineers, technicians, and students that are interested in the practical application and industrial use of high power impulse magnetron sputtering. This course will start with some fundamentals on magnetron sputtering and the transition to pulse sputtering, and especially HIPIMS. Besides the introduction of the technology, the focus will be on industrially relevant topics. This includes commercially available components like power supplies, plasma diagnostic, and process control. Finally, the course will conclude with an overview on industrially available products, i.e. coatings.

Topical Outline:

1. Introduction of sputtering
2. Introduction of high power impulse sputtering
3. Plasma and process characteristics
4. Operation modes in HIPIMS
5. Commercial equipment
   1. Power supplies
   2. Diagnostic tools
   3. Feedback / process control
6. Coating systems and applications
7. Industrial coatings

Instructor: Ralf Bandorf, Fraunhofer IST - Braunschweig, Germany

The vacuum coating business has produced many products around the world, many of which, the end-user has no idea that it was enabled by a coating or process derived from vacuum coating. These coatings, processes and equipment produce optical, chemical and other physical properties that are unique to the specific product or application. Many courses and conferences deal with the specific science and application of these processes, but there are few that present and discuss how to actually move from an idea, product or service to create a profitable business. This course will delve into how you can create a business from your idea, product or service, starting with a basic analysis of whether there is a true business opportunity. The simple “back of the envelope” calculation allows an inventor or entrepreneur (or existing business) to quickly determine if there is a reason to invest time and resources into creating a business entity. From this point, the course will discuss business models, how to protect the idea (process or product) as well as how to structure a business around the specific business model. All of the discussion will be centered about actually deriving a profit from the investment of time and money. This class is intended for individuals and existing companies.

The following is an outline of the subjects to be covered:

1. Is your Idea an Idea, Product, or Service:
   1. What is the potential market?
      1. What is the possible value?
   2. What is the rough cost to make or produce?
2. What Business Model Should you Select:
   1. Sell Product/Service yourself
   2. License the Product or Service
   3. Are there development cost(s)?
      1. How do you fund this?
3. Do you need to protect your idea/product/service?
   1. Patents
   2. Trademarks
   3. Trade secrets
4. What is the cost to get to market?
   1. Return on Investment (ROI)
      1. Using the estimates of sales price, cost to produce, and investment to get to market to determine if there is a positive ROI
   2. Is there a profit to be made?
      1. How long will it take to make a profit?
      2. Have you included all of the cost(s)?
5. Possible Business Structure(s) to consider:
   1. Incorporate
   2. LLC
   3. Sole proprietorship
6. How do you want to work with Customers?
   1. Joint Development Agreements
   2. Licensing
   3. Simple sales
7. Building a Business Plan:
   1. What is a business plan and why do I need it
      1. Business description
      2. Key milestones and timing
      3. Proforma financials
8. Financing:
   1. Shoestring
   2. Investors
9. Question and Answer session.

Instructor: John T. Felts

This course is a crash course on Marketing for business leaders and their teams. If you are not sure you have the best, most effective and efficient Marketing you can have, this course is for you.This course is also for those who participate in Marketing without ever having received training for it (Engineers, Sales professionals…) and for those who want to broaden their knowledge of Marketing.

Following a philosophy of doing less better, this course teaches what elements of Marketing to use and how to use them for different purposes. This course challenges the notion that best practices are universal and that followed, they deliver universal benefits. It will demystify Marketing terminology such as branding, value proposition, segmentation, Marketing automation, SEO, SEM, content Marketing, Inbound Marketing, social listening….By the end of the class, you will be able to determine based on your situation, which Marketing activities to focus on, which to ignore, and why. Knowing why you make your choices will allow you to adjust your Marketing focus when your situation changes. This course will also include generally applicable principles and practical tips for getting more impact out of limited resources.

Selling internationally can be a challenge, especially without Fortune 500 level resources. The course will provide guidelines on how to approach selling outside of the U.S. and practical tips and resources for providing “essential to success” Marketing overseas. This section of the course is specifically geared to small and medium size businesses with limited resources.

This course will pay for itself through elimination of ineffective Marketing activities you identify during the day. The consistent application of principles you learn here will drive higher top and bottom line, as good Marketing has a positive impact on every aspect of a business: revenue growth, profitability, return on R&D investment, capital efficiency, product line, closing rate, margin, and employee recruitment and retention.

Instructor: Jocelyne O. McGeever

This course provides an overview of patents and their place in developing an intellectual property portfolio. It will cover the basics of what a patent is, how a patent compares to other forms of intellectual property, when a patent is useful, and the process required to obtain a patent. It will highlight what is required to write high quality patent, with a good chance of success. This course is intended for those with minimal to no experience with patents or for those who would like to refresh their knowledge. It is designed to provide an overview of the subject and help understand the costs and work involved in developing patents in order to make informed decisions about when they are useful.

Topical Outline:

1. What is a patent?
   1. Definition of a patent
   2. History of patent law
   3. Types of patents
      1. Utility patents
      2. Design patents
2. When is a patent useful? Patents vs. trademarks, copyright and trade secrets
   1. What is a trademark and when is it useful?
   2. What does copyright protect?
   3. What is a trade secret?
   4. Comparison of the different types of IP
3. What qualifies as a patentable idea? What is required for an idea to be patentable?
   1. Things that cannot be patented: Laws of Nature, Physical Phenomena, Abstract Ideas
   2. Utility – Is the invention useful?
   3. Novelty – Is the invention something not previously known to the public?
   4. Nonobviousness – Is the invention an obvious variation of something already known?
   5. Statutory bars to patenting
4. So, you have a patentable idea. Where should you file?
   1. Filing in the United States
   2. Filing in Europe – EU Patent office vs. individual countries
   3. Filing in China, Japan and India
5. You have a patentable idea and have decided where to file. What constitutes a good application?
   1. Provisional or no provisional?
   2. Prior art search
   3. What to do if you find problematic prior art
   4. The individual parts of an application.
   5. How to write good claims
6. You filed an application. What now?
   1. The patent office rejected the application
      1. How to respond to an office action
      2. Final vs. non final rejections
      3. Appealing a final rejection
7. Your patent was granted.
   1. Maintenance fees
   2. Enforcement
   3. Licensing
8. Trademarks
   1. Purpose of a trademark
   2. Distinctiveness – Does the proposed trademark stand out? Is it generic?
   3. Functionality – Trademark cannot be a functional feature of a product
   4. Use – Must use the trademark in commerce.
9. Registering a Trademark
   1. Registered vs. unregistered trademarks
   2. Process to federally register a trademark
10. Enforcing a trademark
    1. Geographic limits on trademark rights
    2. How to determine if a trademark is infringing on another mark.
    3. Permissible uses of another’s trademarks.

Instructor: Pamela Boling, Grauling Research, Inc. - California

The U.S. economy is a big market. A small win in the U.S. could be as impactful as a big one in the country of origin. But a big market also means more competition. Success requires conquering the double challenge of creating a new business and doing so in a foreign culture.

This course is intended for business leaders who are considering doing business in the U.S. or desire to improve the results of their existing approach. The course is organized into the stages encountered in chronological order and addresses the critical decisions and factors for success of each stage.

1. Critical Initial Decisions
   • Deciding whether to do business in the U.S.
   • How to structure the U.S. presence: full organization including Manufacturing, Sales Representatives, and many other unusual options
   • What impact the location has on the business and how to choose the location to facilitate success
2. Setting up
   • What preparation is needed to make the right decisions in setting up the business
   • The critical minimum elements required to do business in the U.S.
3. Doing Business in the U.S.
   • Cultural aspects of the U.S. which impact business and how to cope
   • The personal experience of transplants: how to help them cope so they can do best by you
   • Competing with U.S. businesses
   • Practical ways to prevent the home culture from getting in the way of doing business

Instructor: Jocelyne O. McGeever