SVC Student/Young Professional Travel Sponsorship Program

SVC Student/Young Professional Sponsorship Program

Full-Time Students and Young Members Are Eligible

The SVC Travel Sponsorship Program provides travel support and complimentary conference registration to selected full-time students and young professionals (under the age of 35 working in industry) to make an oral technical presentation at the SVC Annual Technical Conference. A limited number of sponsorships will be awarded to the best applicants. Applicants from academic, research, and technical institutions from the United States and around the world are encouraged to apply. The Travel Sponsorship Committee evaluates applications and makes selections based on the quality and relevance of the applicant's project to the interests and mission of the SVC. It will also consider the quality of the application itself (completeness, quality, etc.), potential quality of the oral presentation, its relevance to the specific session, as well as the need for funding.

Requirements for Participation:

The applicant must have a sponsor. The sponsor can be a faculty member or supervisor at the applicant's institution/place of employment or another academic, technical, or research institution. The sponsor must indicate that he or she understands the nature of the conference and what SVC technical programs are about. The applicant must commit to providing a manuscript based on the content of the oral presentation at the TechCon or the PowerPoint presentation delivered at the TechCon for subsequent publication by the SVC before any financial support is provided.

During the selection process, preference will be given to those applicants who have not already received sponsorship from SVC and the SVC Foundation. The successful candidates should also preferably come from different institutions.

SVC Travel Sponsorship Program Abstract and Application Deadline: October 4, 2025

The following items must be provided to qualify as a completed application packet:

Electronic Abstract Submission:

  • Submit a 200-word abstract via the electronic abstract submission page on the 2026 SVC TechCon Conference portal. Applications for the 2026 TechCon will be considered starting July 15, 2025.

  • Confirmation of a commitment to prepare a manuscript or submit a copy of the PowerPoint presentation s included in the electronic abstract submission form.

Note! SVC offers two different manuscript publication options for TechCon presenters:

  • Non-peer review publication in the SVC Technical Conference Proceedings

  • Peer review publication in Elsevier's Surface and Coatings Technology -- and -- SVC Technical Conference Proceedings

Other Required Documentation:

  • A letter of recommendation from the sponsor that confirms the applicant is a full-time registered student in a university or a full-time employee of an industrial company.

  • A one-page description of the applicant’s project.

  • A completed SVC Travel Sponsorship Acknowledgement.


Please send complete application packet via e-mail to: [email protected].


Sponsored Student Committee:

Chair: Hana Baránková, Uppsala University, Sweden (46/184 713 118, [email protected])
Assistant Chairs: Jolanta Klemberg-Sapieha, École Polytechnique, Canada (514/340-5747, [email protected]) and James Hilfiker, J.A. Woollam representing the SVC Foundation (402/477-7501, [email protected]).