Ion beam sputtering has been used for smoothing of silicon and quartz glass substrates and for deposition of nanometer multilayers for high-end optical applications in extreme ultraviolet (EUV) and in X-ray. The tool used is equipped with two linear ion beam sources, a rotatable drum of targets, movable substrate and shaper with pre-calculated velocity maps. Two ion beam sources, one directed to the target and the second to the substrate, provide reproducible and precise application of ion beam sputtering technology to etch, smoothen, or figure substrates, or to deposit high quality nanometer multilayers. Smoothing of a silicon substrate to a microroughness of 0.11 nm rms (AFM scan length 5 μm) is presented. Examples of high precision ion beam sputter deposition are shown on Mo/Si, DLC/Si, and Ni/C multilayers. The results of the x-ray reflectometry on deposited multilayers are presented.
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