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Tutorial Course Descriptions

Detailed Syllabus

C-102 Introduction to Evaporation and Sputtering (half-day or full-day)

This is an introductory tutorial for people who would like to become familiar with the principles of evaporation and sputtering. The
basic physical and chemical processes that occur at the source and the factors that control the film properties will be described for both techniques. Typical applications will be discussed and used to contrast the advantages and disadvantages of the two methods.

 

Topical Outline:
  • Evaporation
    Vapor pressures and deposition rates
    Evaporation sources
    The control of film composition, structure, and uniformity
    Typical applications and scale-up issues
  • Sputtering
    Basic description of plasmas
    Physical sputtering and target effects
    Magnetron sputtering
    rf sputtering and reactive sputtering of insulators
    The control of film properties
    Typical applications and scale-up issues
Course Details:

Thin film nucleation and growth

  • Nucleation and the critical radius
  • Effect of temperature on nucleation and growth
  • Effect of surface mobility on nucleation and growth
  • Coating parameters that affect nucleation and growth

Thermal evaporation

  • Vapor pressures of the elements
  • Generic evaporation systems
  • Resistive evaporation
  • Electron beam evaporation
  • Cosine distribution of evaporated material
  • Masking and substrate motion to achieve coating uniformity
  • Ion plating
  • Cathodic arc evaporation

Glow discharge sputtering

  • Plasmas and plasma generation
  • Target bombardment by ions
  • Collision cascade
  • Sputter yields
  • Secondary electron emission
  • Structure zone models
  • Coating stress
  • Coating distribution from round and rectangular cathodes
  • Rf sputtering of thick insulating targets
  • Reactive sputtering

Ion beam sputtering

  • Kaufman ion sources
  • Dual ion beam sputtering

Instructor: David Glocker, Isoflux
David Glocker

founded Isoflux Incorporated, a manufacturer of magnetron equipment, in 1993. He has more than 30 years’ experience in thin film research, development, and manufacturing and has taken a number of new processes from laboratory-scale feasibility studies through successful production. He is an inventor or co-inventor of 31 U.S. patents and an author of more than 30 research papers in the areas of sputter source design, plasmas and plasma characteristics, sources of substrate heating in sputtering, and the control of sputtering processes and sputtered film properties. He also is the co-editor of The Handbook of Thin Film Process Technology, a major reference work in the field.


This course is currently available via:
On Location Education Program

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