Detailed Syllabus
C-102 Introduction to Evaporation and Sputtering (half-day)
This is an introductory tutorial for people who would like to become familiar with the principles of evaporation and sputtering. The
basic physical and chemical processes that occur at the source and the factors that control the film properties will be described for both techniques. Typical applications will be discussed and used to contrast the advantages and disadvantages of the two methods.
Topical Outline:
- Evaporation
Vapor pressures and deposition rates
Evaporation sources
The control of film composition, structure, and uniformity
Typical applications and scale-up issues - Sputtering
Basic description of plasmas
Physical sputtering and target effects
Magnetron sputtering
rf sputtering and reactive sputtering of insulators
The control of film properties
Typical applications and scale-up issues
Thin film nucleation and growth
- Nucleation and the critical radius
- Effect of temperature on nucleation and growth
- Effect of surface mobility on nucleation and growth
- Coating parameters that affect nucleation and growth
Thermal evaporation
- Vapor pressures of the elements
- Generic evaporation systems
- Resistive evaporation
- Electron beam evaporation
- Cosine distribution of evaporated material
- Masking and substrate motion to achieve coating uniformity
- Ion plating
- Cathodic arc evaporation
Glow discharge sputtering
- Plasmas and plasma generation
- Target bombardment by ions
- Collision cascade
- Sputter yields
- Secondary electron emission
- Structure zone models
- Coating stress
- Coating distribution from round and rectangular cathodes
- Rf sputtering of thick insulating targets
- Reactive sputtering
Ion beam sputtering
- Kaufman ion sources
- Dual ion beam sputtering
is CEO of Isoflux Incorporated, a manufacturer of magnetron equipment, which he founded in 1993. He has more than 20 years’ experience in thin film research, development, and manufacturing and has taken a number of new processes from laboratory-scale feasibility studies through successful production. He is an inventor or co-inventor of 25 U.S. patents and an author of more than 25 research papers in the areas of sputter source design, plasmas and plasma characteristics, sources of substrate heating in sputtering, and the control of sputtering processes and sputtered film properties. He also is the co-editor of
This course is currently available via:
On Location Education Program