Process Modeling & Control
2008 51st SVC Annual Technical Conference
April 19-24, 2008
Hyatt Regency Chicago on the River Walk, Chicago IL
Technical Program
April 19–24, 2008
Wednesday Afternoon, April 23
Process Modeling & Control
Moderators: Colin Quinn, General Plasma, Inc. and Dan Carter, Advanced Energy Industries, Inc.
1:30 p.m. A-1 Gas Flow and Plasma Simulation for Parallel Plate PACVD Reactors
A. Pflug, M. Siemers, and B. Szyszka, Fraunhofer Institute for Surface Engineering and Thin Films (IST), Braunschweig, Germany
1:50 p.m. A-2 Multi-Physics Simulation of Plasma Reactor
K. Shah, ESI US Group, Santa Clara, CA
2:10 p.m. A-3 In Situ Broadband Monitoring and Characterization of Thin Films
A. Voronov and F. Placido, University of Paisley, Paisley, United Kingdom; and K. Karstad, Scalar Technologies, Ltd., Livingston, United Kingdom
2:30 p.m. A-4 A Novel EIES Sensor For Real-Time Control of CIGS Processes with Improved Accuracy
C. Lu, Lu Laboratory, Mountain View, CA; and C.D. Blissett and G. Diehl, Sigma Instruments, Fort Collins, CO
2:50 p.m. A-5 In Situ Investigation of Surface Oxidation of Ni Metal Film Using Single Wavelength Optical Monitoring
S. Song and F. Placido, University of Paisley, Paisley, United Kingdom
3:30 p.m. A-6 Substrate-Level Diagnostics for Process Modeling and Control
Invited 40 min. Talk
G. Roche and P. MacDonald, KLA-Tencor, Santa Clara, CA
4:10 p.m. A-7 Deposition of Ultra-Thin Oxides on Silicon: Real-Time Film Thickness and Wafer Temperature Measurement
S. Uredat, LayTec GmbH, Berlin, Germany; L. Geelhaar, NaMLab GmbH, Dresden, Germany; and J.T. Zettler, LayTec GmbH, Berlin, Germany
4:30 p.m. A-8 Critical Measurement and Control Issues in Selecting a Quartz Crystal Monitor
D. Radgowski and G. Reimann, Cyber Materials, LLC, Boston, MA; and M. Gevelber, Boston University, Boston, MA
4:50 p.m. A-9 Predicting Functional Reliability in Powered Plasma Processes
R. Heckman, D. Carter and V. Brouk, Advanced Energy Industries, Inc., Fort Collins, CO
5:10 p.m. A-10 Three Dimensional Simulation of Low Pressure/Low Temperature Plasma Discharges
M. Siemers, A. Pflug, and B. Szyszka, Fraunhofer Institute for Surface Engineering and Thin Films (IST), Braunschweig, Germany