Plasma Processing
2008 51st SVC Annual Technical Conference
April 19-24, 2008
Hyatt Regency Chicago on the River Walk, Chicago IL
Technical Program
April 19–24, 2008
Tuesday Morning, April 22
Plasma Processing
Moderator: James Bradley, University of Liverpool, United Kingdom
8:30 a.m. P-1 Optical Emission and Langmuir Probe Studies in a Deep Reactive Ion Etching (DRIE) System
S.P. Koirala, I.U. Abhulimen, M.H. Gordon, H.H. Abu-Safe, and S.L. Burkett, University of Arkansas, Fayetteville, AR
8:50 a.m. P-2 Measurement of Absolute Argon Excited State Populations and EEDFs in an Ar - a-Si Plasma
K.A. Herring, S.L. Mensah, S.K. Koirala, H.H. Abu-Safe, and M.H. Gordon, University of Arkansas, Fayetteville, AR
9:10 a.m. P-3 Feedback Control of the Energy Distribution of Bombarding Ions During Plasma Processing
Invited 40 min. Talk
A. Wendt, University of Wisconsin-Madison, Madison, WI
9:50 a.m. P-4 Atmospheric Pressure Glow Discharge for the Deposition of Silica-Like Films on Polymeric Webs
S. Starostin and M. Creatore, Eindhoven University of Technology, Eindhoven, The Netherlands; H. de Vries, Fujifilm TRL, Tilburg, The Netherlands; and M.C.M. van de Sanden, Eindhoven University of Technology, Eindhoven, The Netherlands
Tuesday Afternoon, April 22
Plasma Processing
Moderator: Dave Christie, Advanced Energy Industries, Inc.
1:30 p.m. P-5 Controlling the Incident Ion Energy at Substrate Surfaces
S.G. Walton, E.H. Lock and R.F. Fernsler, U.S. Naval Research Laboratory, Washington, DC
1:50 p.m. P-6 Ion Flux Measurements in a Remote Depositing Plasma using a Pulse Shaped Capacitive Probe
M.C. Petcu, A.C. Bronneberg, M. Creatore, and M.C.M. van de Sanden, Eindhoven University of Technology, Eindhoven, The Netherlands
2:10 p.m. P-7 An Investigation into the Properties of a Dual Source Pulsed Magnetron Sputtering System
G.C.B. Clarke and J.W. Bradley, University of Liverpool, Liverpool, United Kingdom; and G.T. West and P.J. Kelly, Manchester University, Manchester, United Kingdom
2:30 p.m. P-8 Langmuir Probe Investigation of the Effect of Pressure and Hydrogen Concentration in an Ar-H-Si Plasma
S.L. Mensah, H.H. Abu-Safe, D.G. Bhat, and M.H. Gordon, University of Arkansas, Fayetteville, AR
2:50 p.m. P-9 Characterisation of Nano-Coatings Deposited using an Aerosol Assisted Atmospheric Pressure Plasma Jet Technology
C. O’Sullivan, Dow Corning Plasma Solutions, Cork, Ireland; J. Albaugh, Dow Corning Corporation, Midland, MI; and L. O’Neill, Dow Corning Plasma Solutions, Cork, Ireland
Wednesday Morning, April 23
Plasma Processing
Moderator: Mariadriana Creatore, Eindhoven University of Technology, The Netherlands
10:30 a.m. P-10 Improving the Emptying Behaviour of Packaging via Coating their Surfaces with Plasma-Polymerized Nanoscale Layers
F. Loibl, C. Holtz, and H.C. Langowski, Technical University of Munich, Freising-Weihenstephan, Germany
10:50 a.m. P-11 ta-C:X - Depositing Doped Superhard Amorphous Carbon Films using the LaserArco PVD Platform
L. Haubold, M. Becker, D. Packer, and T. Schuelke, Fraunhofer USA Center for Coatings and Laser Applications, East Lansing, MI
11:10 a.m. P-12 RF Plasma Enhanced Cylindrical Magnetron Sputter Deposition
R. Wei, Southwest Research Institute, San Antonio, TX; and S.L. Lee, US Army Armament Research and Development Engineering Center, Watervliet, NY
Thursday Morning, April 24
Plasma Processing
Moderator: Scott Walton, US Naval Research Laboratory
8:30 a.m. P-13 Characterization of the Parameter Space in Expanding Thermal Plasma Systems with Organosilane and Oxygen Reagents
M.A. Gilliam and S.M. Gasworth, Exatec LLC, Wixom, MI
8:50 a.m. P-14 Advances in PECVD Barrier Coating Development for ISBM PP Containers
C. Weikart, The Dow Chemical Company, Midland, MI; T. Glass, H. Pham, and A. Taha, The Dow Chemical Company, Freeport, TX; M. Larive, and T. Fisk, The Dow Chemical Company, Midland, MI; and J. Felts, Nano Scale Surface Systems, Inc., Alameda, CA
9:10 a.m. P-15 Effect on Adhesion of Gas Release from Polymer Surfaces
S. Song and F. Placido, University of Paisley, Paisley, United Kingdom
9:30 a.m. P-16 Investigation of Corrosion Resistance of Mg Alloy Sheets by Glow Discharge Plasma Treatment
J.H. Yang and J.I. Jeong, Research Institute of Industrial Science and Technology, Pohang, Gyoungbuk, Korea; and Y.H. Park and K.H. Lee, Research Institute of Industrial Science and Technology, Bukgu, Ulsan, Korea
9:50 a.m. P-17 Low-Power Remote Plasma Cleaning
C.G. Morgan, XEI Scientific, Inc., Redwood City, CA; J.E. Boulter, University of Wisconsin-Eau Claire, Eau Claire, WI; and R. Vane, XEI Scientific, Inc., Redwood City, CA
10:30 a.m. P-18 Microcavity Plasmas: Physics and Applications
Invited 40 min. Talk
K.H. Schoenbach, Old Dominion University, Frank Reidy Research Center for Bioelectrics, Norfolk, VA
11:10 a.m. P-19 A Novel Plasma Source for Microscopic Plasma Surface Processing
F. Duemmer, S. Wicklein, M. Becker, N. Xi and T. Grotjohn, Fraunhofer USA Center for Coatings and Laser Applications, East Lansing, MI
11:30 a.m. P-20 Plasma Decontamination at Atmospheric Pressure - Basics and Applications
Invited 40 min. Talk
K.D. Weltmann, R. Brandenburg, J. Ehlbeck, U. Krohmann, M. Stieber, and T. v. Woedtke, INP Greifswald, Greifswald, Germany