Important Passport and Visa Information for International SVC TechCon Attendees

49th Annual SVC Technical Conference
April 22–27, 2006
Marriott Wardman Park Hotel
Washington DC

Recently the U.S., like many other countries, has updated passport and visa policies to increase security for citizens and visitors. Plan Ahead!

International TechCon attendees need to apply for their visas no later than THREE (3) months in advance, due to increasing delays in securing visas to the U.S. Visit www.UnitedStatesVisas.gov for information on applying for a U.S. visa. Make an appointment with the U.S. Embassy or Consulate.

Documentation Required for Visa Application

  1. A valid passport
  2. Appropriate application
  3. Documents to support the application and reason for travel
  4. Proof of payment of fees

Attendees who require a Letter of Invitation

Please provide us with the following information:

  1. Your full name as it appears on your passport
  2. Your complete mailing address with telephone and fax number
  3. If you are presenting a paper include the title and the session in which that paper will be presented. If you are exhibiting or attending the conference, please indicate that in your request.
  4. Attendees from China should include the passport number, date of birth, and gender of each person requesting a Letter of Invitation.

Please send the above information to the Society of Vacuum Coaters:

E-mail svcinfo@svc.org or Fax 505/856-6716

Society of Vacuum Coaters
71 Pinon Hill Place NE, Albuquerque, NM 87122 USA