SVC Student Sponsorship Program
Full-Time Students Are Eligible
The SVC Student Sponsorship Program provides travel support and complimentary conference registration to selected full-time students to make an oral technical presentation at the SVC Annual Technical Conference. A limited number of sponsorships will be awarded to the best applicants. Applicants from academic, research, and technical institutions from the United States and around the world are encouraged to apply. The Student Sponsorship Committee evaluates applications from students and makes selections based on the quality and relevance of the student's project to the interests and mission of the SVC. It will also consider the quality of the application itself (completeness, quality, etc.), potential quality of the oral presentation, its relevance to the specific session, as well as the need for funding.
Requirements for Participation:
The student applicant must have a sponsor. The sponsor can be a faculty member at the student's institution or another academic, technical, or research institution. The sponsor must indicate that he or she understands the nature of the conference and what SVC technical programs are about.
During the selection process, preference will be given to those applicants who have not already received sponsorship from SVC. The successful candidates should also preferably come from different institutions.
SVC Student Sponsorship Program Abstract and Application Deadline: October 10, 2016
The following items must be provided to qualify as a completed application packet:
Electronic Abstract Submission:
Submit a 200-word abstract via the electronic abstract submission page on the SVC Web Site.
Confirmation of a commitment to prepare a manuscript is included in the electronic abstract submission form.
Non-peer review publication in the SVC Technical Conference Proceedings
Peer review publication in Elsevier's Surface and Coatings Technology -- and - SVC Technical Conference Proceedings
Other Required Documentation:
A letter of recommendation from the sponsor that confirms the student is a full-time registered student in a university.
A one-page description of the student’s project.
A 200-word abstract submitted via the electronic abstract submission page for the 2017 TechCon.
A completed travel support estimate form.
Please send complete application packet via e-mail to: Jeanelle.Harden@asminternational.org.
Sponsored Student Committee:
Chair: Hana Baránková, Uppsala University, Sweden (46/184 713 118, email@example.com)
Assistant Chairs: Jolanta Klemberg-Sapieha, École Polytechnique, Canada (514/340-5747, firstname.lastname@example.org) and James Hilfiker, J.A. Woollam Co. Inc., representing the SVC Foundation (402/477-7501, email@example.com).