On Location Education Program

Take Advantage of the Opportunity of Bringing High-Quality, Practical Tutorials in PVD Processing and Vacuum Technology to a Facility That You Select!

The SVC On Location Program provides:

• Instructors who are recognized professionals in vacuum technology and PVD processing

• Practical information that will assist your staff in the R&D and manufacturing environment

• Convenient scheduling

• Cost-effective education by eliminating time-away-from-work, travel expenses, and individual tutorial attendee fees.

Program Objectives
The SVC Charter states that education shall be disseminated both to members and non-members alike in order to attain an expanded and more efficient use of the methods, processes, and technologies of vacuum coating. The SVC makes available On Location Tutorials to any interested organization. Subject to instructor-availability and certain other conditions, organizations can request any of the following SVC tutorials be brought to their location.

Interested in Further Information? Costs, Arrangements, etc. Contact SVC!
E-Mail: svcinfo@svc.org
FAX: 505/856-6716
Telephone: 505/856-7188

Tutorials that are available for On Location presentation are listed below. For a detailed tutorial description, and biographical sketch of the instructor, you may click on the tutorial title.

Tutorial Titles

V-201 High Vacuum System Operation

This tutorial is intended for those who wish to learn how mechanical pumps and high vacuum pumps form a high vacuum system and how three such systems are operated. At the end of this tutorial, using all available materials, a participant should be able to explain the operation of diffusion, cryo, and turbo pumped systems; understand the differences between a viscous gas and a rarefied gas; and show how these differences govern the operation of the systems.

Introduction to vacuum systems

• Rotary mechanical pumps
• Diffusion pumps and systems
• Cryogenic pumps and systems
• Turbomolecular pumps and systems

Attendees in this tutorial receive the text, A User’s Guide to Vacuum Technology, 3rd edition, John O’Hanlon (John Wiley & Sons, 2003).

For additional information on this course, view the Detailed Syllabus.

V-202 Vacuum System Gas Analysis

This tutorial is intended for those who wish to understand how to analyze the performance of a vacuum system. Basic vacuum gauges that measure pressure in the low vacuum and in the high vacuum region will be described. Residual gas analyzers provide a useful method of analyzing the performance of a system and how various components are operating by looking at the partial pressures of individual gases. The class concludes with a discussion of leak detection: when it should be attempted and how to detect leaks with a pressure gauge, an RGA, and a mass spectrometer leak detector.

Gas laws

• Gas flow
• Vacuum gauges
• Residual gas analyzers
• Leak detection

Attendees in this tutorial receive the text, A User’s Guide to Vacuum Technology, 3rd edition, John O’Hanlon (John Wiley & Sons, 2003).

For additional information on this course, view the Detailed Syllabus.

V-203 Vacuum Materials and Large System Performance

This tutorial is intended for those who wish to learn the basics of vacuum materials and large system performance. Materials used for sealing and constructing high vacuum systems, as well as fluids for pumping and lubricating will be reviewed. The performance of large systems used for coating rigid and flexible substrates forms the backbone of work done by members of the SVC. Here we will describe the performance of systems used for coating rigid substrates (batch coaters) and flexible substrates (roll coaters). We will characterize when, why, and how to cross-over properly from roughing pumping to high vacuum pumping for all types high vacuum system types. We will illustrate the effects of outgassing, permeation and gas loading on system operation.

• Materials in vacuum
• Seals, joints, and valves
• Rough pumping large systems
• System performance
• Multichamber systems

Attendees in this tutorial receive the text, A User’s Guide to Vacuum Technology, 3rd edition, John O’Hanlon (John Wiley & Sons, 2003).

For additional information on this course, view the Detailed Syllabus.

V-204 Vacuum Systems, Materials and Operation

This tutorial course is intended for those who wish to learn how diffusion and cryo pump systems operate, how to choose materials for vacuum use, and how to pump water vapor properly during the rough pumping cycle. At the end of this tutorial, a participant should be able to explain the operation of diffusion, and cryo pumped systems; understand how materials are chosen for use in vacuum, and how to rough pump water vapor without producing condensation.

• Introduction
• Rotary mechanical pumps
• Diffusion pumps and systems
• Cryogenic pumps and systems
• Materials suitable for vacuum use
• Methods for rough pumping water vapor.

Attendees in this tutorial receive the text, A User’s Guide to Vacuum Technology, 3rd edition, John O’Hanlon (John Wiley & Sons, 2003).

For additional information on this course, view the Detailed Syllabus.

V-206 Practical Helium Leak Detection Workshop

This one-day program is designed for anyone who has a need to find small leaks in components or systems but has a limited background in helium leak detection—this covers operators of production equipment, as well as maintenance and engineering personnel who require a practical, hands-on, helium mass spectrometry leak detection (HMSLD) program.

The objectives of this tutorial are to explain (1) the theory and reasons for using helium leak detection, (2) the principal techniques of leak detection, and (3) the practical operation of finding leaks. This introductory program provides a review of the history and terminology of HMSLD and is followed by a hands-on discussion of the theory of process. A review is provided of different styles of machines plus the components within such a unit. Each technique of leak detection will be discussed, and then attendees will have the opportunity to operate a working leak detector and sort areas of leaks from nonleaks using these techniques. Near the end of the program there will be a complete review of required maintenance procedures and possible field service.

• Overview of some methods of leak detection and the smallest leak that can be found
• Review of HMSLD history
• General theory and terminology of HMSLD
• Styles of commercial equipment available and pros/cons of each
• Components and operation of a typical helium leak detector
• Various techniques of HMSLD that can be used
• Calibration or adjustment for maximum sensitivity and leak finding
• Machine cycle and technique operation by attendees
• Vacuum inside method in three different forms:
  Bagging or hooding procedure
  Bombing techniques
  Sniffing method in two forms
• Review of necessary maintenance on any leak detector:
  Fluids
  Filters
  Filaments
• Possible field service for HMSLD machines

For additional information on this course, view the Detailed Syllabus.

V-207 Practical Aspects of Vacuum Technology: Operation and Maintenance of Production Vacuum Systems

This tutorial is designed to teach the basic fundamentals of vacuum technology to technicians, equipment operators, line process operators, and maintenance personnel. This tutorial will address how to use and maintain an existing vacuum effectively, not how to design a system. The introduction will consist of a very basic explanation of what a vacuum is and how it is attained and proceeds to an explanation of the three gas flow regimes (i.e., viscous, transition, and molecular flow). This is followed by a description of the types of pumps used in the viscous flow region (e.g., mechanical displacement pumps, venturi/suction pumps, and sorption pumps). Types of high vacuum pumps are next discussed; these include diffusion pumps, turbopumps, and cryopumps.

The next section deals with the care and maintenance of pumps and vacuum systems, including both compressible “rubber” gasket and metal gasket systems. The unique role that water plays in both pumpdown from atmosphere and in outgassing will be addressed, and techniques to ameliorate its harmful effects will be presented. The effects of other unique “bad actors” will be discussed also. Many useful charts and tables will be presented and explained.

Participants are requested to present any problems or difficulty that they may be experiencing with their vacuum systems for discussion. This makes for very interesting examples, and the problem might actually be solved.

• Introduction to vacuum
• Explanation of the three gas flow regimes
• Viscous flow pumps
• High vacuum pumps
• Care and maintenance of pumps and vacuum systems, including both compressible “rubber” gasket and metal gasket systems
• Evaluating system performance: pumpdown rate and leak-up rate
• Leak detection and correction
• Cleaning and conditioning of vacuum components and system
• Operation of vacuum systems: crossover pressure, interlocks,
  and safety
• Applications of vacuum systems for vacuum coating
• Pumpdown and outgassing
• Descriptions of other vacuum related tutorials presented by SVC

For additional information on this course, view the Detailed Syllabus.

V-301 Care & Feeding of Mechanical Pumping Systems (half-day)

This tutorial provides the attendee with an overview of the various pumps that are used in the roughing pump regime. These include mechanical pumps (direct drive, rotary piston, vane), Roots blowers, dry pumps, and cryogenic pumps for pumping water vapor. The design of each type of pump will be described. In addition, the recommended use for each pump, proper operation, and maintenance will be discussed. A major part of the tutorial is a detailed discussion on the pumping of water vapor, preventing mechanical pump oil backstreaming, and sizing of the pumping system for particular applications.

• Overview of mechanical pumps
• Overview of blowers
• Dry pump applications
• Recommended use of each pump
• Proper operating parameters
• Maintenance
• How to minimize water vapor problems
• How to eliminate oil backstreaming

V-304 Cryogenic High Vacuum Pumps

Cryogenic high vacuum pumps are used on a wide variety of vacuum deposition and process equipment (evaporation, sputtering, ion implant), space simulation systems, and on analytical instruments. They produce high pumping speeds for all gases and work over a wide range of pressures. To use these pumps effectively, it is helpful to understand their advantages as well as their limitations. The focus will be on cryopumps using closed-loop helium gas refrigerators, but other types of liquid cryogen and sorption pumps will be discussed.

The tutorial is designed for users and operators of vacuum systems, process engineers, equipment designers, and maintenance staff.

• General properties and uses for cryopumps
• Refrigerators and compressors
• Review of vacuum theory basics
• Pumping speeds and capacities for different gases
• Dealing with heat and gas loads
• Selecting the right size pump
• Methods of regeneration
• Maintenance procedures
• Safety issues
• Troubleshooting

M-101 Basic Principles of Color Measurement

Color is measured in many ways, both visually and instrumentally. This tutorial is a primer on color and color measurement for designers, engineers, and technicians who need to understand basics of color and color measurement. Discussion will include how color arises, the tristimulus and opponent color methods that have evolved to quantify color, effects that change color, setting color tolerances, and devices used for visual and instrumental color measurement and evaluation. Thin film and non-thin film color measurement and considerations will be compared. At the end of the tutorial, you will have a working knowledge of the most commonly us ed color measurement systems, factors that affect color perception, and an understanding of color measuring instruments and geometries.

• Light sources and their effects
• Spectral reflectance/transmittance
• Observer effects
• Tristimulus color theory
• Color coordinate systems
• Color in thin film products
• Surface finish (specular versus diffuse) effects
• Instrumentation vs visual color evaluation
• Color control standards
• Color tolerancing methods

The tutorial fee includes the text, Billmeyer and Saltzman’s Principles of Color Technology, 3rd Edition, Roy S. Burns (John Wiley & Sons, 2000).

For additional information on this course, view the Detailed Syllabus.

C-101 A Primer on Thin Films and Vacuum Technology

Nathaniel Sugerman was a founding member, an avid supporter, and mentor of the Society of Vacuum Coaters. This tutorial was created in his memory for newcomers to the vacuum coating industry and for those nontechnical people associated with the industry who wish to gain a basic knowledge of thin film and vacuum technology. The tutorial is intended for people who are complete novices in the field.

This tutorial will provide an overview of vacuum and thin film technology associated with the manufacture of a variety of consumer products. These products are compact discs, food packaging barrier coatings (e.g.; potato chip bags), sunglasses and ophthalmic coatings, optical coatings, and integrated circuits.

The deposition techniques used to manufacture the above-listed products will be described at the introductory level, including sputtering, evaporation, and chemical vapor deposition. In addition, a survey of various methods to clean and prepare substrates will be discussed. The nature of what a vacuum is, how it is achieved, and the techniques required to maintain the necessary vacuum for the above deposition processes will be described in some detail. Vacuum measurement techniques and residual gas analysis will be given a brief overview. Students will be given a private preview of typical key exhibits prior to the opening of the Exhibit Hall.

• Some commercial products using vacuum technology
• What is a vacuum?
• How is a vacuum achieved?
• What is a thin film?
• How is a thin film produced?
• Uses for thin films

The tutorial fee includes the SVC Education Guides to Vacuum Coating Processing.

C-102 Introduction to Evaporation and Sputtering (half-day)

This is an introductory tutorial for people who would like to become familiar with the principles of evaporation and sputtering. The
basic physical and chemical processes that occur at the source and the factors that control the film properties will be described for both techniques. Typical applications will be discussed and used to contrast the advantages and disadvantages of the two methods.

• Evaporation
  Vapor pressures and deposition rates
  Evaporation sources
  The control of film composition, structure, and uniformity
  Typical applications and scale-up issues
• Sputtering
  Basic description of plasmas
  Physical sputtering and target effects
  Magnetron sputtering
  rf sputtering and reactive sputtering of insulators
  The control of film properties
  Typical applications and scale-up issues

For additional information on this course, view the Detailed Syllabus.

C-103 An Introduction to Physical Vapor Deposition (PVD) Processes

Physical vapor deposition (PVD) processes are atomistic deposition processes in which material vaporized from a source is transported in the form of a vapor through a vacuum or low-pressure gaseous environment to the substrate, where it condenses and film growth takes place. PVD processes can be used to deposit films of compound materials by the reaction of depositing material with the ambient gas environment or with a codeposited material. This tutorial will discuss and compare the four basic PVD techniques: vacuum evaporation, sputter deposition, arc vapor deposition, and ion plating. Vacuum evaporation uses thermal vaporization as a source of depositing atoms; sputter deposition uses physical sputtering as the vaporizing source; arc vapor deposition uses a high-current, low-voltage arc for vaporization; and ion plating uses concurrent or periodic energetic particle bombardment to modify the film growth. The parameters used for each technique will be discussed along with their advantages, disadvantages, and applications. This is an entry-level tutorial to acquaint the students with various PVD processes used for “surface engineering.”

• Introduction: deposition environments (vacuum and plasma), film formation, film structures, reactive deposition, factors affecting film properties
• Vacuum evaporation and vaporization, evaporation and sublimation, deposition chambers, vaporization sources (resistive and e-beam), evaporation materials, fixture design, process parameters, monitoring and control, advantages and disadvantages, applications
• Sputter deposition and physical sputtering, plasmas (dc, rf, magnetron, and pulsed dc), sputtering target configurations, reactive sputter deposition, sputtering materials, process parameters, monitoring and control, advantages and disadvantages, applications
• Arc vapor deposition and vacuum and plasma arcs, properties of arcs, generation and “steering” of arcs, arc sources, reactive arc deposition, process parameters, monitoring and control, advantages and disadvantages, applications
• Ion plating and bombardment effects, bombardment configurations, reactive ion plating, ion plating vaporization sources and evaporation, sputtering and arc process parameters, monitoring and control, advantages and disadvantages, applications
• PVD deposition systems and configurations (batch, load-lock, and in-line), pumping options

The tutorial fee includes the text, Handbook of Physical Vapor Deposition (PVD) Processing, Donald M. Mattox (William Andrew Publishing/Noyes Publications, 1998).

C-203 Sputter Deposition (two – day course)

This tutorial covers fundamental mechanisms associated with generation of glow discharges, sputtering, and energetics of target and substrate processes. Operation and system design will be discussed for dc, rf, magnetron (both magnetically balanced and unbalanced), pulsed dc, and ion beam sputtering. The advantages and disadvantages of these different modes of operation will be examined from the point of view of controlling film properties. Emphasis is placed on developing a sufficient understanding of sputter deposition to provide direction in designing new processes. Present and future trends in sputter deposition also will be addressed.

• Processes controlling film growth and properties
• The role of energetic particles in controllably modifying these processes
• Target sputtering effects
• Nature and energy of sputtered atoms
• Diode, triode, magnetron, and ion beam systems
• dc, HIPIMS, pulsed dc, mid-frequency ac, and rf power for targets and substrates
• Reactive sputtering of conducting and dielectric layers
• Alloy sputtering

For additional information on this course, view the Detailed Syllabus.

C-204 Basics of Vacuum Web Coating

This tutorial is intended for roll coater machine operators, maintenance personnel, technicians, engineers, scientists, supervisors, and others who would benefit from an introduction to issues related to roll-to-roll vacuum coating onto polymer substrates. This tutorial will emphasize practical aspects of the topics, and the treatment will be descriptive with little mathematics used. The tutorial focuses strongly on coatings made by resistance evaporation but touches on e-beam and induction evaporation and sputter coating. If your primary interest is sputtering onto webs, please see our other offering, “Sputter Deposition onto Flexible Substrates” (C-211).

• Markets for coated web products
• Vacuum technology for web coating
• Substrate characteristics
• Web handling and web winding systems
• Coating techniques and web cooling issues
• Process and product monitoring methods
• System maintenance issues
• Sources of information about web coating

For additional information on this course, view the Detailed Syllabus.

C-207 Evaporation as a Deposition Process

Evaporation is a technology used widely to produce thin films in vacuum. The tutorial describes the basics of evaporation and its utilization in various technological processes. The tutorial provides the conceptional basis for a wide range of evaporation techniques. It is designed to meet the needs of both a newcomer to the field and the experienced professional. Experienced scientists and engineers will have an opportunity to broaden their view of this field and deepen their understanding of evaporation processes.

• Thin film deposition in vacuum
• Evaporation mechanism—Thermodynamic of evaporation, evaporation rate, vapor pressure of elements, evaporation of compounds, evaporation of alloys
• Film thickness uniformity and purity—Deposition geometry, film thickness uniformity, conformal coverage, film purity, deposition rate monitoring and process control
• Evaporation sources—General considerations, resistance heated sources, sublimation sources, induction heated sources, electron beam heated sources, arc evaporation, laser ablation
• Reactive evaporation—Reactive and activated reactive evaporation
• Ion-assisted evaporation—Ion plating, enhanced ion plating, plasma-assisted deposition, ion-beam-assisted deposition
• Microstructure of evaporated thin films—Film growth mechanisms, structural zones, ion-assisted growth
• Deposition systems for thin film deposition by evaporation—Major parts of the system, web coatings systems, vacuum batch systems
• When should we use evaporation as a deposition process

For additional information on this course, view the Detailed Syllabus.

C-208 Sputter Deposition in Manufacturing

This tutorial emphasizes issues of practical importance to those using sputtering as a manufacturing process. It is intended for engineers, scientists, and technicians who would like an understanding of the factors that influence product throughput, coating quality, and process robustness and reliability. The primary focus will be on the use of planar magnetrons of various shapes, but other sources will be covered as well. The relationships between the sputtering conditions and important film properties—such as microstructure, composition, stress, adhesion and the resulting mechanical, electrical, and optical characteristics—will be discussed. New developments that are finding their way into practical applications also will be highlighted. No prior formal training in sputtering is required to appreciate the tutorial content.

• Sputtering plasmas and the nature of the sputtering process
• Estimating deposition rates and rate limiting factors
• Cathode geometries and associated film thickness profiles
• Film composition and compositional uniformity
• Biased sputtering and the use of unbalanced magnetrons
• Sources of substrate heating
• rf sputtering of dielectrics from insulating targets
• The dc, pulsed dc, and ac reactive sputtering of dielectrics
• Process control methods for reactive sputtering
• Arcing, disappearing anodes, and other process stability issues
• Ion beam sputtering

For additional information on this course, view the Detailed Syllabus.

C-209 Material Science Aspects of Plasma Processing (half-day)

Numerous plasma processes are used to either produce or modify inorganic and organic thin film coatings. Among the more commonly used approaches are physical and reactive sputtering, plasma chemical vapor deposition, ion plating, and surface modification. Within these process categories there exist several plasma modes operating in different power, frequency, and gas throughput regimes and in a variety of plasma apparatus configurations. It is the intent of this tutorial to introduce the student to the basic plasma features that all the above-mentioned process variations have in common, and only then bring out the ways in which they differ in kind or degree. Special attention will be given to the importance and methods of control of key unique plasma species and their energetic state, their subsequent impact on the coating growth processes, and ultimate film composition and microstructure, as well as the consequences on a variety of functional properties.

• General Plasma Basics—Description of collision processes in the gas phase as well as at various plasma/surface interfaces and their impact on coating composition and microstructure and functional properties.
• Prototype examples:

   

  • Sputtering of metals, alloys, and compounds in inert gases and reactive gases
  • Plasma polymerization leading to a variety of polymer coatings, including a discussion of the role of reactive ion etching (RIE) and sputtering at various plasma/surface interfaces
  • Role of polymer deposition in semiconductor micro-feature processing
  • Plasma synthesis and physical properties of inorganic/organic polymer composite thin films made up of granular nanoparticle dispersions and examples of applications
  • Surface structure modification of pre-existing organic coatings, depending on type and energetics of incident plasma particles

For additional information on this course, view the Detailed Syllabus.

C-210 Introduction to Plasma Processing Technology (half day)

The goal of the tutorial is to show the link and provide understanding of relations between coating application, coating (or modified surface) properties, selection criteria on process characteristics, selection criteria on plasma parameters, and method design. It is possible to predict how the process parameters will be reflected in the coating and in the opposite direction, requirements on the coating properties can imply how the process should be designed.

• Plasma-assisted technologies, general attributes
• Useful criteria, basic relations and limits for plasma, classification of plasmas
• Generation of gas discharge plasma, plasma diagnostics
• Generation of vapor species, transport through medium, diffusion, condensation at the surface
• Consequences of the deposition process on film properties
• Fundamentals of radical and ion-assisted plasma chemistry
• Homogeneous and heterogeneous plasma-assisted reaction in deposition of films
• Examples of novel plasma processes
• Limits and new trends
• Hybrid plasma processes

C-211 Sputter Deposition onto Flexible Substrates

This tutorial is intended for engineers, scientists, and others who are interested in sputter deposition onto polymer substrates in a roll-to-roll format. This tutorial will emphasize practical aspects of the topics, and the treatment will be descriptive with little mathematics used. Some of the material presented overlaps with material presented in our other offering, “Basics of Vacuum Web Coating” (C-204). Feel free to contact the instructor if you feel uncertain about which tutorial is most appropriate for your needs. There will be time dedicated to problem solving; bring your questions and problems and leave with new solutions and/or new directions.

• Markets for sputter-coated web products
• Vacuum technology for sputter web coating
• Substrate characteristics
• Web handling, web winding, and web cooling issues
• The sputter coating process
• Process and product monitoring methods
• Current topics in sputter web coating

Additionally, the notes provide extensive information and references to sputtering (written at several levels) and a comprehensive bibliography on sputter web coating.

For additional information on this course, view the Detailed Syllabus.

C-212 Troubleshooting for Thin Film Deposition Processes

Vacuum deposited thin films are used for optical coatings, electrically-conductive coatings, semiconductor wafer fabrication, and a wide variety of other uses. They may be deposited on glass, plastic, semiconductors, and other materials. Usually, a vacuum deposition process produces durable, adherant films of good quality. But what do you do when things go wrong? Not all films can be deposited on all substrate materials. Sometimes films peel off or crack. Other times they are cloudy, absorbing, scattering, or have other unacceptable properties.

This tutorial will teach you about techniques and tools that can be used to identify the source of the problems, correct the process, and get back into production. It will also help in learning how to develop new processes and products. The tutorial is designed for process engineers and technicians, quality control personnel, thin film designers, and maintenance staff.

• Mechanical, electrical, and optical properties of thin films
• Process parameters that affect film properties
• Gauge and instrument calibration
• Properties of substrate surfaces
• Measurement of film stress
• Detection of contamination
• Introduction to surface analysis techniques (Auger, ESCA, SIMS, FTIR)
• Substrate preparation and cleaning

For additional information on this course, view the Detailed Syllabus.

C-213 Introduction to Smart Materials

This tutorial will focus on the basic principles and mechanisms of smart materials and structures, and provide a spring board for further study. Smart materials and systems are now being used in virtually all areas of technology, and in many high and low-tech applications and products, and have thousands of applications in today’s world. In the context of this tutorial "smart material" is a general term for a broad category of multifunctional materials having a specific property (optical, mechanical, electronic, etc.) that can sense the environment and be controllably modified. They are used to color and control the transmission of windows, precisely position moving parts in machinery and aircraft, sense motion and changes in locations of structures, change the shape of structures (including aircraft wings and nose cones), monitor corrosion and stress in materials and structures, and control many biological functions. Appliances as simple as toasters use smart materials to control the darkness of toast. Many of these materials and structures emulate biological systems that can adapt to changes in their environment, and development of these materials involves combining several technological disciplines, including materials science, chemistry, solid state physics, biotechnology, nanotechnology, and robotics. The tutorial will also address how smart materials rely on molecular and atomic engineering of materials in such a way that the functionality of the material in an integral part of the microstructure itself.

• Definition of smart materials
• Brief history of smart materials
• Smart materials versus smart structures
• Range of applications
• Types of materials
• Mechanisms
• How functionality of materials is increased
• Smart optical materials
• Piezoelectric materials, actuators, transducers
• Smart magnetic materials
• Shape memory materials
• Introduction of smart biological materials
• Engineering smart materials
• Looking into the crystal ball: organics and biological systems rule

For additional information on this course, view the Detailed Syllabus.

C-214 Pulsed Plasma Processing

This tutorial is intended for engineers, technicians, and others interested in using pulsed plasma equipment. Basic understanding or experience with plasmas is desirable but not required. The tutorial has some emphasis on pulsed sputtering equipment but the scope is much wider. The tutorial starts with a brief introduction to plasma and sheath physics in general, as it is relevant for coatings and films. A central part is the physics and engineering aspects of pulses plasmas, pulsed sheaths, and pulsed substrate bias. We move on to see what kind of effects one can obtain by using pulsed plasma systems. Such effects include the increase of the degree of ionization, suppression of arcing on targets and substrates, interface tailoring, and control of film stress and adhesion. Examples of applications are given, including when using the most extreme systems such as high power pulsed sputtering and pulsed arcs.

• Plasmas - An Introduction
• Sheaths
• Discharges
• Pulsed Discharges
• Dimensionless Parameters
• Pulsed Sheaths: Collisionless Model
• Pulsed Sheaths: Improvements to the Collisionless Model
• Pulsed Power Supplies
• Pulsed High-Voltage Substrate Bias
• Pulsed Arcs and Plasma Immersion Processing
• Pulsed Sputtering
• High-Power Pulsed Sputtering
• Pulsed Energetic Condensation and Control of Film Stress

For additional information on this course, view the Detailed Syllabus.

C-301 Optical Coating Design and Monitoring

This tutorial covers optical coating design principles and techniques from both classical approaches and other different viewpoints. Methods for the design and execution of monitoring strategies to produce desired coating results are described. The sensitivities, possibilities, and limitations of most control techniques are described.

• Fundamentals of thin film optics from various points of view
• The use of graphical methods for understanding and designing optical coatings
• A Fourier viewpoint of optical coatings
• Practical monitoring and control of thin film growth
• Error compensation and degree of control
• Sensitivity to errors and monitoring strategies

The tutorial fee includes two textbooks: Practical Design of Optical Thin Films, Ronald R. Willey, 2007; and Practical Monitoring and Control of Optical Thin Films, Ronald R. Willey, 2007 (both published by Willey Optical Consultants).

For additional information on this course, view the Detailed Syllabus.

C-302 Practical Aspects of Optical Coatings

This tutorial covers methods for depositing optical thin film materials and the parameters to control to achieve desired properties. Various deposition source types will be presented with strong emphasis on physical vapor deposition (sputtering and evaporation). Both qualitative and quantitative methods for characterizing thin films will be presented.

• Methods for depositing thin films and for calculating performance
• Measuring optical thin films and calculating optical properties (n and k)
• Dispersion models for optical thin films
• Comparison of characterization techniques
• Effect of deposition parameters on optical properties
• Ion-assisted deposition
• Thin film material properties for dielectric and metal films
• Review of optical properties for other selected materials

For additional information on this course, view the Detailed Syllabus.

C-303 Numerical Methods for Optical Coatings

After a brief general introduction, the performance of classical optical coatings, such as antireflection coatings, reflectors, cutoff filters, band pass filters, polarizers, and beam splitters, is reviewed and compared to that of filters based on different physical principles.  In the next part of the course, various numerical methods are outlined that can be used for the design of multilayer coatings for various challenging applications. Refinement techniques are discussed that can be used to enhance the performance of reasonable starting designs. Various synthesis methods are described that do not require a starting design. These latter techniques include the comprehensive search, gradual evolution, minus filter, the flip-flop, needle, refractive index step, and the inverse Fourier transform methods. All are illustrated by examples.  Solutions to some interesting problems found with these design methods are presented.  Numerical methods are also very useful at various stages of the actual manufacture of multilayer systems.  Results obtained with completely automatic deposition systems are described in which the computer software not only controls the deposition, but also evaluates at various stages the performance of the partial multilayer.  On this basis it then makes run-time adjustments to the remaining layers of the thin film system to reduce the effect of errors that have been made thus far.  The present state of the art of design and manufacture is illustrated with the results submitted to the Manufacturing Problems held at the last few meetings of the OSA’s Optical Interference Coatings conferences.  Finally, non-optical requirements for coating systems are discussed to show how they impact on the design of the optical multilayers.  A more detailed list of topics discussed in the course than the one given below will be found in the Detailed Course Syllabus.

• General introduction
• Review of basic optical filters
• Materials used in multilayer systems
• Specifications of multilayer systems
• Numerical design of multilayer systems
  
  • Refinement methods
  • Synthesis methods
  • Commercial thin film design programs

• Some interesting problems solved with numerical methods
• Computer assisted manufacture of multilayers
• Manufacture with real-time re-optimization
• OIC Manufacturing problems
• Real time optimization with etching
• Meeting non-optical requirements for optical coatings

For additional information on this course, view the Detailed Syllabus.

C-304 ITO and Other Transparent Conductive Coatings: Fundamentals, Deposition, Properties, and Applications

This tutorial is intended for scientists, engineers, technicians, and others, interested in understanding the deposition and properties of transparent conductive coatings (TCCs). The major topic of the tutorial is indium tin oxide, ITO. Deposition by dc magnetron sputtering is emphasized although all common deposition processes are described. Specific examples of the ITO properties achieved with evaporation, reactive and ceramic target sputtering deposition processes are shown. Post-deposition processing also is discussed. A methodology is described for developing an ITO (or any TCC) deposition process in your own equipment. Typical ITO properties are compared with those achieved by optically enhanced metals TCC (alternative TCO to ITO are mentioned but not discussed in detail – see C-321). The selection and design of a TCC to meet the requirements of a particular application are presented. Some knowledge of basic thin film coatings and interference optics is assumed, although key basics will be reviewed. The tutorial will briefly cover the basic physics and fundamentals of conductivity. A prior introductory solid state physics tutorial would be helpful but is not required. Time will be available for questions concerning your process problems.

• Basic physics of transparent conductive coatings (TCCs)
• Major deposition methods for TCCs
• Control of TCC Film Properties
• Selection of deposition method and process conditions
• TCC performance in applications
• Manufacturing issues
• Optional topics
  

   

  — Thin film optics
  
  — Metal Nitride TCC

For additional information on this course, view the Detailed Syllabus.

C-306 Non-Conventional Plasma Sources and Methods in Processing Technology

This tutorial is a new edition of a well-established annual tutorial started in 1997. It is intended for anyone using or planning to use plasma processing technology, including cold atmospheric plasma sources and applications. Extensive applications of plasma processing are accompanied by an intense development of different new plasma sources and methods (e.g., afterglow and downstream plasmas, pulsed plasmas, inductively coupled plasmas and helicons, dc and rf hollow cathode plasmas, atmospheric plasmas, etc.). The tutorial covers both the explanation of basic physical and technical principles of conventional and non-conventional systems and typical examples of their applications. This is very important not only for adopting new plasma technologies and easier orientation in a new market, but also for better understanding of conventional commercialized systems.

• Gas discharge plasma - definition, characterization and generation principles.
• Fundamentals of plasma processing, conventional plasma sources and systems.
• Decaying plasmas and afterglows, time and space resolved afterglows, pulsed plasmas, hybrid plasma systems and processing.
• Microwave plasmas, ECR plasma, surfatron and surfaguide afterglows for PCVD of films.
• Novel radio frequency (rf) plasma systems, inductively coupled plasma (ICP) and helicons.
• Hollow cathode plasma sources (principles and basic applications), dc- and rf-generated hollow cathodes, linear hollow cathodes for large area processing.
• Classification of arcs, arc evaporation of films from rf hollow cathodes, vacuum arcs, metastable-assisted regimes in hollow cathodes.
• High density plasma sputtering.
• Magnets-in-motion concept in plasma sources, linear magnetized hollow cathodes.
• Cold atmospheric and subatmospheric plasma sources, corona and dielectric barrier discharges (DBD), microwave atmospheric plasma, fused hollow cathode discharge.
• Advantages and limits of the atmospheric plasma sources and applications.

C-307 Cathodic Arc Plasma Deposition

This tutorial is intended for engineers, technicians, and others interested in understanding deposition equipment, the deposition process, and film properties of cathodic arc deposition. The tutorial covers the basic physics and fundamental science of cathodic vacuum arc discharges, proper equipment design, and the particulars of arc coatings applications. Cathodic arc plasma parameters and their consequences for film properties are discussed. Cathodic arc deposition equipment is described and compared to other coatings equipment such as sputter and evaporation systems. The properties of cathodic arc-deposited coatings are reviewed and compared to coatings obtained by other deposition methods. Industrial aspects are discussed with emphasis on industrial applications and production processing. New fields of application and emerging cathodic arc applications are mentioned. Time will be available for questions concerning the applicability of cathodic arc films to specific problems such as the design and operation of cathodic arc deposition systems.

• The cathodic arc discharge
  — Physics of cathodic arc discharge
  — Explosive emission and fractal nature of cathode spot
  — triggering
  — macroparticle generation
  — steered arcs
  — plasma guiding in filters
• Vacuum arc deposition equipment
  — Historical overview
  — Arc source integration
  — Macroparticle filters
  — System design
• Deposition of films
  — Film growth mechanisms
  — energetic condensation
  — Nitrides, Oxides, ta-C (DLC)
• Industrial aspects
  — Substrate cleaning, fixturing, inspection
  — Emerging applications

C-308 Tribological Coatings

This tutorial is intended for design engineers, materials scientists, and coatings developers who have a need to specify and develop coatings for tribological applications (i.e., those in which wear must be reduced or prevented and/or friction minimized). The coatings also may need to have corrosion-resistant properties to operate in arduous conditions. The tutorial begins with a description of the mechanics of wear and discusses the problems of selecting coatings for optimal tribological performance. An overview of the main processes for producing tribological coatings is given, emphasizing vacuum deposition methods. Tribological test methods also are over-viewed, including tests for adhesion and mechanical properties. Coatings developed for enhanced tribological properties are described, and information is provided on some applications for these coatings.

• Wear mechanisms and theories (adhesion, abrasion, erosion, fatigue, corrosion, etc.)
• Tribological and mechanical test methods (e.g., pin on disc, abrasive wheel, scratch adhesion, microhardness, etc.)
• Coating processes and selection
• Benefits of ceramic coatings by PVD methods
• Information on tribological coatings (e.g., metal nitrides, carbides, oxides, superlattices, multilayers, nanocomposites, DLC, etc., plus hybrid and duplex processes)
• Applications information (e.g., metal cutting and forming, molding, bearings, pumps, auto parts, etc.)

For additional information on this course, view the Detailed Syllabus.

C-310 Plasma Immersion Techniques for Surface Engineering

Plasma immersion techniques are characterized by immersing the substrate in a plasma and applying (usually pulsed) bias voltage to the substrate or substrate holder such as to modify the surface prior to deposition and tuning film properties during deposition. Ion Plating, introduced decades ago by Mattox, can be considered as one of the immersion techniques. Energetic deposition of thin films and coatings commonly leads to well-adherent and dense films. Film properties can be quite different compared to properties of films obtained by evaporation or sputtering. Film stress is of concern and methods to handle it are also discussed. This tutorial is intended for engineers, technicians and others interested in understanding, using, and applying plasma immersion deposition techniques. Only basic knowledge of physics and materials science is required. The tutorial is structured in three parts: Fundamentals, Technology, and Applications, and thus intended to be useful for participants at different levels.

Part I: Fundamentals

•  Introduction to Plasma Immersion Ion Implantation & Deposition (PIII&D)

• What is PIII&D?
• Historic roots and development
• Comparison with related techniques

•  Plasmas and Plasma Sheaths

• What is Plasma?
• What is a plasma sheath?
• Driven and undriven sheaths

•  Fundamentals of Surface Treatment by Ion Beams and Plasmas

• Ion Implantation
• Thin Film Deposition

•  The “Family” of PIII&D techniques

• Principles of PIII&D
• Making sense of the “alphabet soup”:

• PSII
• PIII,
• PIID,
• PIIP,
• MePIIID,…

•  Analyzing and Testing PIII&D Modified Surfaces

• Retained Ion Dose, Implantation Profile
• Precipitation, Phase Formation
• Films: Composition, Thickness, Texture
• Tests: Corrosion, Wear, Adhesion, Stress

Part II: Technology

•  Building a PIII&D System

• Process Chamber
• Fixtures, Shields
• Controls

•  Plasma Production

• Gas Discharges:

• DC: glow discharge, thermionic arc, hollow-cathode
• RF,
• m-wave, ECR, DECR

• Metal Plasmas:

• ionized sputtering,
• laser ablation
• cathodic arc

•  Pulse Modulators

• Why should the substrate bias be pulsed?
• Pulser concepts

• “hard” tubes,
• thyratrons with PFNs,
• solid state switches

• Pulse transformers

•  Health and Safety Issues

• Electrical Safety
• Radiation and Shielding
• Chemical Safety

Part III Applications

•  Non-Semiconductor Applications

• diamond-like carbon coatings
• protective nitride and oxide coatings
• Management of film stress and adhesion
• modification of surfaces of plastics
• Nitriding of steel, aluminum, and Al-alloys

•  Semiconductor Applications

• Shallow junction formation
• Silicon-on-insulator fabrication

• SPIMOX (Separation by Plasma Implantation of Oxygen)
• Micro-cavity engineering

• Trench doping

• Metallization and barrier layers

 
Attendees in this couse receive the text, Handbook of Plasma Immersion Ion Implantation and Deposition, Andre Anders (Editor), (John Wiley & Sons, 2000)

C-311 Thin Film Growth and Microstructure Evolution

This tutorial is intended for engineers, technicians, and others involved with the vapor deposition of thin films by sputtering, evaporation, MBE, CVD, GS-MBE, etc., and who need to obtain a better understanding of the effects of operating parameters on the properties of metal, semiconductor, and dielectric films and alloys. The tutorial is concentrated on the development of a detailed atomic-scale understanding of the primary experimental variables and surface reaction paths controlling nucleation/growth kinetics and microstructural evolution during vapor-phase deposition of thin films. The goal is to develop an appreciation of the advantages and disadvantages of competing growth techniques and to learn how to design better and more efficient film growth processes to achieve required properties.

Thin-film technology is pervasive in many advanced fields of modern technology including microelectronics, optics, magnetics, hard and corrosion-resistant coatings, micromechanics, etc. Progress in each of these areas depends upon the ability to selectively and controllably deposit thin films (thickness ranging from tens of Ångstroms to micrometers) with specified physical properties. This, in turn, requires control—often at the atomic level—of film microstructure and microchemistry.

Essential fundamental aspects, as well as the technology of thin-film nucleation and growth from the vapor phase (evaporation, MBE, sputtering, and CVD) are discussed in detail and highlighted with “real” examples. The tutorial begins with an introduction on substrate surfaces: structure, reconstruction, and adsorption/desorption kinetics. Nucleation processes are treated in detail using insights obtained from both in situ (RHEED, LEED, STM, AES, EELS, etc.) and post-deposition (TEM and AFM) analyses. The primary modes of nucleation include two-dimensional (step flow, layer-by-layer, and two-dimensional multilayer), three-dimensional, and Stranski-Krastanov. The fundamental limits of epitaxy will be discussed.

Experimental results and simulations will be used to illustrate processes controlling three-dimensional nucleation kinetics, island coalescence, clustering, secondary nucleation, column formation, preferred orientation, and microstructure evolution. The effects of low-energy ion-irradiation during deposition, as used in sputtering and plasma-CVD, will be discussed with examples.  The Tutorial course concludes with a detailed discussion of the origins, mechanisms, and control strategies, of intrinsic and extrinsic stresses in thin films.

• The role of the substrate in mediating growth kinetics
• The nucleation process
• Film growth modes
• Epitaxy
• The development and control of film stress (strain engineering)
• Nucleation and growth of strain-mediated self-organized structures
• Polycrystalline film growth, texture, and microstructure evolution
• Structure-zone models of film microstructure
• The role of low-energy ion/surface interactions during film growth
• The relationship between film growth parameters and film properties

For additional information on this course, view the Detailed Syllabus.

C-312 Process Control for Applications in Large Area Sputtering (half day)

This short tutorial is recommended for R&D staff members, engineers, and technicians who develop and operate reactive magnetron sputtering processes with both planar and rotatable cathodes. This technique is important for deposition of oxides, nitrides, and other compound films. The industrial application of such processes in production lines is mainly related to large area glass and web coatings. The requirements for high productivity demand fast feedback control loops to overcome hysteresis effects. Besides long-term stable deposition rates, the process control features also have to consider the film uniformity and stoichiometry to ensure customized film properties.

• Operation principles for reactive sputtering in DC and AC mode
• Hysteresis effects for different oxides and nitrides
• Limitations of mass flow controlled reactive gas inlet
• Optical emission spectroscopy for characterization of reactive sputter processes
• Interaction of reactive gas flow, partial pressure, and sputter rate
• Process control features provided by

   

  • Plasma emission monitor
  • Acoustic optical spectrometer
  • Mass spectrometer
  • Gas sensors
• Voltage-current characteristics of different oxide materials
• Film thickness uniformity control for long magnetron sputter sources
• Reliable technical solutions in glass and web coaters like magnetron setup, power supplies, and gas distribution
• Results with regard to properties of oxide films

For additional information on this course, view the Detailed Syllabus.

C-314 Plasma Modification of Polymer Materials and Plasma Web Treatment

Plasma treatments are used in the web coating and roll conversion industries to tailor polymer surfaces while preserving their bulk properties. This tutorial is intended for engineers, scientists, and technicians who would like to gain a better understanding of the influence of plasma process factors on treatment performance, as well as the practical issues related to process robustness, process speed, and ease of scale-up. While much of the tutorial deals with treatment of polymer webs, the key concepts presented are applicable to polymer surfaces in general and plasma treatment of materials in general.

• A basic introduction to plasmas including discussion of species distributions, the structure of glow-discharge plasmas, electrical breakdown of gases, and mechanisms of sustaining a plasma.
• Discussion of industrial applications of plasmas for polymer surface modification including wettability control & printing, bonding & adhesion, nucleation of films, control of biointeraction with surfaces, and control of gas-film interactions.
• Description of a variety of plasma treatment technologies and the importance of controlling the industrial treatment environment.
• The interaction of plasmas with polymer surfaces.
• The basics of polymer surface analysis along with examples of surface analytical techniques applied to plasma treated polymers including X-ray photoelectron spectroscopy, static secondary ion mass spectrometry, and high-resolution electron energy loss spectroscopy. Also included is discussion of adhesion, wetability, etc.
• Practical aspects of plasma web treatment including treatment dose, process factors and their roles, practical treatment efficiency, process verification, and process stability issues.
• Mechanisms of surface modification in the context of a site balance model.

For additional information on this course, view the Detailed Syllabus.

C-315 Reactive Sputter Deposition

This tutorial covers the fundamental mechanisms and technology of high rate reactive sputter deposition of conducting and insulating thin films. Following a brief introduction to reactive sputtering, including discussion of basic issues, target choices, and system configurations, we examine the effects of reactive gas addition on target surface and glow discharge processes which control film growth rates. Deposition approaches used in reactive sputtering – dc, rf, magnetron, pulsed dc, and ion beam – are discussed and compared. Process control strategies (e.g.: flow, partial pressure, and target voltage, and multi-loop control) and their implementation are described in detail using numerous examples. The advantages and disadvantages of these different modes of operation are examined from the point of view of controlling film properties. Emphasis is placed on developing a sufficient understanding of reactive sputter deposition to provide direction in designing new processes. The effects of energetic particle irradiation (positive and negative ions and fast neutrals) on film properties are also discussed. Present and future trends in reactive sputter deposition are addressed.

• Introduction to reactive sputter deposition of conducting and insulating thin films
• Target processes during reactive sputtering
• Glow discharge volume processes during reactive sputtering
• Deposition technologies used in reactive sputtering (dc, rf, magnetron, pulsed dc, ion beam)
• Process control strategies
• Particle irradiation effects during film growth
• Film properties
• Computer-based modeling

For additional information on this course, view the Detailed Syllabus.

C-316 Introduction to Atomic Layer Deposition (ALD) Processes and Reactors

Atomic Layer Deposition (ALD) is a recent variation on the older technology referred to as Chemical Vapor Deposition (CVD). In CVD, a mixture of chemically reactive gases flows over a heated substrate causing a thin solid film to grow on the surface. The substrate has to be hot enough to allow the surface reaction to proceed rapidly. However, since the gases approaching the heated surface will be heated by gas phase conduction, gas phase reactions can make it difficult to control film chemistry and uniformity. These problems become particularly acute when very thin films of carefully controlled composition are required over large area substrates. The present tutorial is an introductory tutorial, which will review the newer process of ALD. In this technique, the presentation of the two reactants to the heated surface are separated into two steps. In step one, the substrate is exposed to a first reactant. During this exposure a monolayer of the first reactant adsorbs onto the substrate, and remains there. In the next step, any excess of this first reactant remaining in the chamber is removed. Then a second reactant is introduced into the chamber, and it reacts with the monolayer of the first reactant. This then forms one layer (generally less than one complete monolayer) of the solid film being sought. After this, any remaining second reactant and reaction products are removed from the chamber. This process is repeated as many times as necessary to grow a film of the desired thickness. Clearly with this new process, gas phase reactions are irrelevant, so that one is free to choose the most reactive reactants available and film deposition temperatures can be lower. Unfortunately, the one disadvantage is that the film deposition rate is low. For those applications where very thin films are of interest, this becomes less of a limitation.

• Introduction: Basic concepts governing the Atomic Layer Deposition Process
• Review of the growth of epitaxial films – in particular silicon, germanium, and gallium arsenide
• Processes for the formation of dielectric oxide films, including mixed oxides, and nanolaminate oxide films.
• Discussion of techniques for the growth of electrically conducting films such as metals, and conducting nitrides and oxides.
• Radical enhanced ALD: Review of this new technique that enables even lower temperature film growth, and growth of improved quality materials.
• ALD reactor systems

For additional information on this course, view the Detailed Syllabus.

C-317 The Practice of Reactive Sputtering

This tutorial is intended for engineers, technicians, materials scientists, and coating developers, who have a desire and need to understand how the reactive sputter deposition process really works. The goal of the tutorial is to give the student a thorough understanding of all of the factors that affect the reactive sputtering process in order that the student can apply this knowledge to improve their reactive deposition process and achieve both high deposition rates and excellent film properties.

This tutorial covers the basics of reactive sputtering followed by a comparison of the use of flow control versus partial pressure control of the reactive gas. The latter allows operation in the transition region between the metallic and poisoned states of the target, and films can be deposited at much higher rates with excellent properties using partial pressure control compared to flow control of the reactive gas. Along with using partial pressure control, it is important to use the right type of power to assure that there is no arcing during the deposition. Which type of power to use and along with which partial pressure sensor are reviewed. Large area coating presents special challenges for the control of the reactive gas, and the need for multiple gas inlets along the length of a long cathode and sensing in each gas inlet zone are discussed. The requirements for a partial pressure control system along with commercially available controllers are presented. Multiple gas reactive sputtering and reactive high power pulsed magnetron sputtering (HPPMS) are emerging areas that are advancing the state of the art for reactive sputtering. How they work and what factors are important for controlling these two processes are discussed.

• Basics of reactive sputtering
• Flow control versus partial pressure control of the reactive gas
• Power supplies for reactive sputtering
• Reactive gas sensors
• Large area reactive sputtering
• Control systems for reactive sputtering
• Multiple gas reactive sputtering
• Reactive high power pulsed magnetron sputtering

For additional information on this course, view the Detailed Syllabus.

C-318 Nucleation and Growth of Nanostructures

Tutorial Objectives

• Understand the primary experimental variables and surface reaction paths controlling nucleation/growth kinetics and microstructural evolution during vapor-phase deposition.
• Learn about the primary classical and quantum effects which controllably alter the properties of increasingly small nanostructures.
• Understand the mechanisms controlling self-assembly and self-organization during nanostructure growth.
• Learn how to better design nanostructure growth processes.

Tutorial Description

The study of nanotechnology is pervasive across widespread areas including microelectronics, optics, magnetics, hard and corrosion resistant coatings, mechanics, etc. Progress in each of these fields depends upon the ability to selectively and controllably deposit nanoscale structures with specified physical properties. This, in turn, requires control – often at the atomic level – of nanostructure, nanochemistry, and cluster nano-organization.

Decreasing the size of solid clusters can result in dramatic property changes due to both “classical” effects associated with changes in average bond coordination and, as cluster sizes become of the order of the spatial extent of electron wavefunctions, quantum mechanical effects. The tutorial will start with examples including reduced melting points, higher vapor pressures, increased optical bandgaps, decreased magnetic hysteresis, and enhanced mechanical hardness. Essential fundamental aspects, as well as the technology, of nanostructure formation and growth from the vapor phase will be discussed and highlighted with “real” examples using insights obtained from both in situ and post-deposition analyses.

Nanostructure case studies include:

• Examples of template, size, and coarsening effects: self-assembled Si/Si(001), Cu/Cu(001),TiN/TiN(001), TiN/TiN(111) nano-clusters,
• Examples of controlled template plus strain effects: self-organized Ge wires on Si(111), Ge wires on Si(187 72 81), Au chains on Si(553), InAs metal wires on GaAs(001), insulated metal wires on Si(111),
• Quantum dot engineering: formation, shape transformations, and ordering in self-organized SiGe/Si(001); InAs/GaAs(001), CdSe/ZnSe(001), PbSe/PbEuSe(111), Ag/Pt(111), and MnN/Cu(001) quantum dots,
• Nano-catalysis: Au/TiO2, and
• Examples of 3D nanostructures: (Ti,Ce)N/SiO2, TiBx/SiO2, and d-TaN/g-Ta2N/SiO2.

• The classical and quantum effects controlling the dramatic property changes observed in nanostructures as a function of cluster size and dimension (3D -> 2D -> 1D)
• Self-assembly and self-organization during film growth
• Nucleation and growth modes
• The role of the substrate template in mediating growth kinetics
• The development, and control, of film stress (strain engineering)
• The use of film stress to controllably manipulate nanostructure
• Other mechanisms (including surface segregation, surfactant effects, low-energy ion bombardment, cluster coarsening, etc) for controlling nanostructures
• The design of nanostructures with specified properties.

For additional information on this course, view the Detailed Syllabus.

C-319 Introduction to Energy Conversion Materials and Technology

With the high price of fossil fuels, there is a renewed emphasis on energy conservation and development of alternative energy resources and systems. As a result, there is renewed emphasis on low cost energy conversion materials. Many of these systems were initially developed for space power sources. Fuel cells (including PEM, solid oxide and thin film) convert hydrogen and hydrocarbon fuels to electrical power and are being developed as an alternate power source for automobile engines. Thermoelectric power generation systems are being developed to recover energy from industrial and vehicle waste heat sources. Semiconductor photovoltaics have been around with us for a long time and harvests light from the sun and thermophotovoltaics converts photons from heat sources to useable energy. Organic photovoltaics are just starting to achieve respectable efficiencies and can be made over large areas. Thermionics converts electrons from a hot body into electricity. Nuclear reactions (beta decay) are used as the heat source for thermoelectric power generation. Thin film batteries convert chemical energy into electrical energy. Most of these energy conversion systems are utilized by the space program but have experienced recent significant improvements in performance. They are extremely useful in powering remote sensors and surveillance systems.

This tutorial will review several energy conversion technologies and how thin film materials are helping to advance these technologies. These new materials are helping to improve conversion efficiencies. Recent development in organic materials will also be presented.

• Semiconductor solar cells
• Thin film solar cells
• Graztel cells
• Organic solar cells
• Transparent solar cells
• Thermophotovoltaics
• Solar thermal energy
• Photocatalytic materials
• Thermoelectric power generation
• Thermionic power generation
• PEM fuel cells
• Solid oxide fuel cells
• Thin film fuel cells
• Thin film Li batteries
• How MEMS is advancing energy systems
• Space power systems
• Remote power systems

For additional information on this course, view the Detailed Syllabus.

C-321 Alternative Transparent Conductive Oxides (TCOs) to ITO (half-day)

This tutorial is intended for scientists, engineers, technicians, and others, interested in understanding the options and issues in selecting an alternative n-type TCO to indium tin oxide, ITO. Potential alternatives other than TCO such as organic conductors and nanomaterials are not discussed. Emerging TCO alternatives for cost sensitivity applications, performance driven applications and the many cases in which a compromise between cost and performance must be made, are discussed Typical ITO properties are summarized and compared with those achieved by emerging TCO coatings. A methodology is developed for selecting the alternative TCO coating to meet the requirements of a particular application.

It is strongly recommended that SVC tutorial, C-304 “ITO and Other Transparent Conductive Coatings: Fundamentals, Deposition, Properties and Applications” be taken prior to this tutorial. Some knowledge of introductory solid state physics, the fundamentals of conductivity, thin film optical interference coatings and common vacuum deposition methods also is assumed.

• Introduction
• Performance expectations – ITO baseline
• TCO replacement candidates
• Cost OR performance driven application?
• Cost AND performance application – Compromise
• E/O Summary of Some Alternative TCO Materials
• Alternative TCO performance

For additional information on this course, view the Detailed Syllabus.

C-322 Characterization of Thin Films

This tutorial examines the broad range of techniques available to characterize thin film materials. We examine the range of properties of interest and how thin film properties may differ from bulk properties. Generic differences between counting and spectroscopic techniques are presented. Available “probes” are identified.

The main emphasis of the tutorial is an overview of a wide range of characterization techniques. We examine imaging techniques such as Optical microscopy, Scanning electron microscopy (SEM), Transmission electron microscopy (TEM), and Scanning probe microscopies (STM, AFM …). We also explore techniques, which provide information about structural properties including X-ray diffraction (XRD), Stylus profilometry, Quartz crystal monitors (QCM) and density measurements.

The tutorial examines techniques, which explore chemical properties such as Auger electron spectroscopy (AES), Energy Dispersive Analysis of X-rays (EDAX), X-ray Photoelectron Spectroscopy (XPS, ESCA), Secondary Ion Mass Spectrometry (SIMS), and Rutherford Backscattering (RBS). AES is used as a prototype to examine quantitative analysis of spectroscopic data. Characterization techniques for optical properties such as ellipsometry and optical scattering are also considered. Many of these chemical and optical techniques can also provide information about structural properties.

Techniques for determining electrical and magnetic properties are also discussed. These include resistance / four point probe, Hall effect, magneto-optical Kerr effect and ferromagnetic resonance. The emphasis here is on materials characterization as opposed to device characterization.

The tutorial concludes with an examination of techniques used to explore mechanical properties such as stress-curvature measurements, friction testing, micro/nano indentation and adhesion tests.

Overview of wide range of characterization techniques for thin films including:

• Mechanical properties (stress, friction, micro/nano indentation, adhesion…)
• Imaging (microscopies: optical, SEM, TEM, AFM …)
• Structural properties (XRD, profilometry, QCM …)
• Chemical properties (AES, EDAX, XPS, SIMS, …)
• Electrical/magnetic properties (resistance, Hall effect, Kerr effect …)

For additional information on this course, view the Detailed Syllabus.

C-323 High Power Impulse Magnetron Sputtering

This tutorial is intended for engineers, technicians, students, and others interested in high power impulse magnetron sputtering (HIPIMS). With HIPIMS we mean a pulsed sputtering process where the power density on the sputtering target is greatly enhanced (about two orders of magnitude) over the average power density. Hence, the word “impulse” is adopted to signify a low duty cycle of operation.

Some basic understanding or experience with plasmas and materials is desirable but not required. The tutorial starts with a brief introduction to basic plasma and sheath physics. The operation of dc magnetrons is explained to provide the foundation for the understanding of the time-dependent processes in pulsed systems, and especially those of HIPIMS discharges.

High power density leads to significant ionization of the sputtered material, enabling effective surface modification via ion etching and ion assistance to film growth. The interface to the substrate can be engineered and the film texture can be influenced using the HIPIMS plasma in combination with an appropriate bias.

• HIPIMS - An Introduction
• Stationary plasmas, sheaths, discharge
• The dc magnetron processes
• Ion surface modification: etching and film growth, energetic condensation
• Pulsed plasmas and sheaths
• High Power Impulse Magnetron Sputtering: the discharge
• Plasma characterization and plasma diagnostics
• Substrate biasing: etching / growth assist
• Interface engineering by using HIPIMS plasmas
• Deposition and coatings by HIPIMS
• Hardware
• Applications

For additional information on this course, view the Detailed Syllabus.

C-324 Atmospheric Plasma Technologies

Atmospheric plasma technologies is a rapidly growing area in plasma-assisted technologies. However, the atmospheric plasma requires a special design of plasma sources to ensure non-equilibrium, i.e. non-thermal plasma in a number of applications in coating and surface treatment. Technologies using the atmospheric pressure plasma sources bring about fast processes, but it is important to be aware of limits given by atmospheric plasma properties and plasma chemical reactions. This introduction tutorial course addresses the most important principles and applications of non-thermal atmospheric plasma.

• Cold atmospheric plasma sources - principles, problems to solve
• Corona and Dielectric Barrier Discharges (DBD)
• Atmospheric pressure plasma jets
• Fused Hollow cathodes
• Microwave atmospheric plasmas
• Atmospheric plasma with/in liquids
• Applications of the atmospheric plasma
• Advantages and limits of the atmospheric plasma sources