
SVC Education Program
Detailed SVC Course Syllabus
C-203 Sputter Deposition (2-day course)
1. Introduction and review
a. gas kinetics: mean free path (mfp)
b. gas adsorption, desorption, and film contamination
c. surface energy: effect on film agglomeration
d. surface structure
e. film growth kinetics: pathways and limits, Ehrlich barrier
2. Nucleation and the early stages of film growth
a. thermodynamics (a simple stability problem): examples
b. film growth modes
c. nucleation kinetics: examples
d. film growth models: examples
3. 3D (polycrystalline) film growth and microstructure evolution
a. 3D nucleation and island growth: examples
b. growth mechanisms (adatom diffusion, coalescence, coarsening): examples
c. microstructure evolution (structure-zone models): examples
d. densification and grain growth
4. Mechanisms of sputtering
a. sputter deposition: definition, advantages/disadvantages
b. ion/surface interactions: elastic and inelastic
c. ion trajectories and sputtering mechanisms: examples
d. sputtering yields: examples
e. energy distributions of sputtered atoms and backscattered ions: examples
f. angular dependencies of incident ions and sputtered atoms: examples
g. nature of sputtered species from elemental and alloy targets
5. Glow discharges
a. glow discharge characteristics
b. cathode fall distance (sheath width): examples
c. mfp for charge exchange collisions and incident ion energies: examples
d. secondary electron emission mechanisms and yields: examples
e. optical emission: examples
6. dc sputtering
a. typical operating conditions and system design: examples
b. characteristics (sheath width, I vs V, deposition rates, etc): examples
c. process control: examples
7. rf sputtering
a. mechanism of operation: examples
b. intrinsic substrate bias: examples
c. system design and equivalent circuits: examples
d. typical operating conditions: examples
8. Magnetron sputtering
a. typical operating conditions and common target configurations: examples
b. operational mechanisms and characteristics: examples
c. system design (diode, cluster tools, in-line, etc) and applications: examples
d. problem areas (target utilization, magnetic targets, etc): examples
e. newer designs (rotating cylindrical, unbalanced, closed-field, ionized metal, high pulse density): examples
9. Ion-beam sputtering
a. operation mechanisms and characteristics of common sources (cold cathode, rf, microwave/ECR, gridless, single grid): examples
b. design and operation of "hot cathode" Kaufman sources: examples
c. linear ion source
10. Reactive sputter deposition
a. reactive sputtering definition, applications, and problems: examples
b. origins and mechanisms of observed effects
c. process control strategies (flow, partial pressure, target voltage): examples
d. hysteresis effects: examples
e. negative ions and mediation strategies: examples
f. modeling
11. Pulsed dc/mid-frequency ac sputtering
a. the issues: reactive sputtering of insulators, arcs (examples)
b. advantages/disadvantages of pulsed-dc/mid-frequency ac vs rf: examples
c. pulsed modes (asymmetric dc, mid-frequency ac, symmetric dc) and their operation: examples
d. advantages/disadvantages of the three pulsed modes: examples
e. redundant anodes and dual magnetron operation: examples.
12. Particle irradiation effects during film growth: heating, densification, stress, texture, and composition
a. substrate heating, origins and solutions: examples
b. film densification, mechanisms and strategies: examples
c. stress evolution, origin and control: examples
d. development of film texture: examples
e. nanotechnology: examples
f. real-time control of film composition: examples
Instructor: Joseph E. Greene, D.B. Willett Professor of Materials Science and Physics, University of Illinois-Urbana