The SVC Topical Conference includes four of SVC’s most popular Tutorial courses and an Introduction to Aqueous Corrosion course developed by ASM International.
Schedule of Tutorials at the TopCon
Tuesday, November 3, 2009
SVC V-207
Practical Aspects of Vacuum Technology: Operation & Maintenance of Production Vacuum Systems
(Bob Langley)
SVC C-208
Sputter Deposition in Manufacturing
(Dave Glocker)
ASM Tutorial
An Introduction to Aqueous Corrosion
(Thomas Glasgow)
Wednesday, November 4, 2009
SVC C-317
The Practice of Reactive Sputtering
(Bill Sproul)
SVC Tutorial Fees
SVC Tutorial fees are $490 for full-day tutorial (8:30 a.m. - 4:30 p.m.) and $95 for students (ID required)
How to Register for Tutorials
On-line Registration is now available for TopCon Tutorials.
After October 12, 2009, SVC and ASM reserve the right to cancel any Tutorial. If a Tutorial is cancelled, registrants will be notified and a full refund of tuition will be made.
SVC V-207 - Practical Aspects of Vacuum Technology: Operation and Maintenance of Production Vacuum Systems
Tuesday, November 3
8:30 a.m. – 4:30 p.m.
This tutorial is designed to teach the basic fundamentals of vacuum technology to technicians, equipment operators, line process operators, and maintenance personnel. This tutorial will address how to use and maintain an existing vacuum system effectively, not how to design a system. The introduction will consist of a very basic explanation of what a vacuum is and how it is attained and proceeds to an explanation of the three gas flow regimes (i.e., viscous, transition, and molecular flow). This is followed by a description of the types of pumps used in the viscous flow region (e.g., mechanical displacement pumps, venturi/suction pumps, and sorption pumps). Types of high vacuum pumps are next discussed; these include diffusion pumps, turbopumps, and cryopumps. The next section deals with the care and maintenance of pumps and vacuum systems, including both compressible “rubber” gasket and metal gasket systems. The unique role that water plays in both pumpdown from atmosphere and in outgassing will be addressed, and techniques to ameliorate its harmful effects will be presented. The effects of other unique “bad actors” will be discussed also. Many useful charts and tables will be presented and explained.
Participants are requested to present any problems or difficulty that they may be experiencing with their vacuum systems for discussion. This makes for very interesting examples, and the problem might actually be solved.
Topical Outline:
* Introduction to vacuum
* Explanation of the three gas flow regimes
* Viscous flow pumps
* High vacuum pumps
* Care and maintenance of pumps and vacuum systems, including both compressible “rubber” gasket and metal gasket systems
* Evaluating system performance: pumpdown rate and leak-up rate
* Leak detection and correction
* Cleaning and conditioning of vacuum components and system
* Operation of vacuum systems: crossover pressure, interlocks,
and safety
* Applications of vacuum systems for vacuum coating
* Pumpdown and outgassing
* Descriptions of other vacuum related tutorials presented by SVC
Instructor: Robert (Bob) A. Langley, Oak Ridge Scientific Consultants (retired)
Robert (Bob) A. Langley retired from Oak Ridge National Laboratory in 1994 and Sandia National Laboratories in 1999. He has performed research in the fields of atomic and molecular physics, solid state physics, material science, vacuum science and technology, upper atmospheric phenomena, fusion power research, and high-energy accelerators, published over 130 scientific papers and is a Fellow of the American Vacuum Society. He obtained his BS, MS and PhD in physics at Georgia Tech and accepted visiting academic positions at Princeton University and University of New Castle, Australia. He is associate editor of Vacuum Technology and Coating magazine, teaches vacuum related courses for the American Vacuum Society and the Society of Vacuum Coaters, served on the Board of Directors of the AVS, and at present consults on vacuum science and technology, and microwave material processing.
SVC C-208 - Sputter Deposition in Manufacturing
Tuesday, November 3
8:30 a.m. – 4:30 p.m.
This tutorial emphasizes issues of practical importance to those using sputtering as a manufacturing process. It is intended for engineers, scientists, and technicians who would like an understanding of the factors that influence product throughput, coating quality, and process robustness and reliability. The primary focus will be on the use of planar magnetrons of various shapes, but other sources will be covered as well. The relationships between the sputtering conditions and important film properties—such as microstructure, composition, stress, adhesion and the resulting mechanical, electrical, and optical characteristics—will be discussed. New developments that are finding their way into practical applications also will be highlighted. No prior formal training in sputtering is required to appreciate the tutorial content.
Topical Outline:
* Sputtering plasmas and the nature of the sputtering process
* Estimating deposition rates and rate limiting factors
* Cathode geometries and associated film thickness profiles
* Film composition and compositional uniformity
* Biased sputtering and the use of unbalanced magnetrons
* Sources of substrate heating
* rf sputtering of dielectrics from insulating targets
* The dc, pulsed dc, and ac reactive sputtering of dielectrics
* Process control methods for reactive sputtering
* Arcing, disappearing anodes, and other process stability issues
* Ion beam sputtering
Instructor: David Glocker, Isoflux Incorporated
David Glocker is President of Isoflux Incorporated, a manufacturer of magnetron equipment, which he founded in 1993. He has more than 20 years’ experience in thin film research, development, and manufacturing and has taken a number of new processes from laboratory-scale feasibility studies through successful production. He is an inventor or co-inventor of 25 U.S. patents and an author of more than 25 research papers in the areas of sputter source design, plasmas and plasma characteristics, sources of substrate heating in sputtering, and the control of sputtering processes and sputtered film properties. He also is the co-editor of The Handbook of Thin Film Process Technology, a major reference work in the field.
ASM Tutorial - An Introduction to Aqueous Corrosion
Tuesday, November 3
8:30 a.m. – 4:30 p.m.
Corrosion occurs in all industries from automotive and aerospace to infrastructure, construction, petroleum, power, paper making, food processing, bioengineering, and pharmaceuticals. Corrosion is costly, dangerous, wasteful, and unsightly. It can be predicted, controlled, and even avoided. This tutorial course presents an overview of the eight major corrosion processes and related corrosion monitoring, prediction and control mechanisms. The principles discussed are applicable to all metals. Emphasis is on practical applications of corrosion technology to industrial corrosion problems.
This is an introductory tutorial presented in the descriptive mode for people who would like to become familiar with the principles of
corrosion. Emphasis is first placed on the electrochemical processes underlying most corrosion phenomena and then on the variety of different forms of corrosion. Special attention will be given to the one form most frequently observed in thin films. Finally test methods for evaluating corrosion resistance will be reviewed.
Topical Outline
• The electrochemical basis for corrosion
- The special characteristics of water with respect to corrosion
- Separation of anodic and cathodic behaviors
- The influence of dissolved ions
- The conflicting influence of dissolved oxygen
- A touch of thermodynamics, the Nernst equation
- The contribution of Marcel Pourbaix, the unifying summary of the roles of pH, voltage, and natural films in corrosion
• 13 common forms of corrosion: description and cause
- General or uniform corrosion
- Galvanic corrosion
- Pitting corrosion
- Concentration cell corrosion
- Crevice corrosion
- Intergranular corrosion, sensitization
- Exfoliation
- Stress corrosion cracking
- Corrosion fatigue
- Erosion corrosion
- Fretting
- Filiform corrosion
- Hot corrosion and oxidation
- Microbiologically induced corrosion
• Test methods for evaluating/avoiding corrosion
- Atmospheric exposure
- Salt spray or fog chambers
- Stressed exposure
- Electrochemical acceleration
Instructor: Thomas K. Glasgow, FASM, NASA Glenn Research Center, Cleveland, OH (retired)
As an employee of NASA's John Glenn Research Center, Thomas Glasgow was author of more than 40 technical papers, editor of one book and recognized in three patents(two for coatings). His prime areas of specialization were high temperature aerospace materials and materials science experiments carried out in space. He now teaches several materials science courses for ASM International, including Corrosion for both ASMI and North Carolina State University.
SVC C-317 - The Practice of Reactive Sputtering
Wednesday, November 4
8:30 a.m. – 4:30 p.m.
This tutorial is intended for engineers, technicians, materials scientists, and coating developers, who have a desire and need to understand how the reactive sputter deposition process really works. The goal of the tutorial is to give the student a thorough understanding of all of the factors that affect the reactive sputtering process in order that the student can apply this knowledge to improve their reactive deposition process and achieve both high deposition rates and excellent film properties.
This tutorial covers the basics of reactive sputtering followed by a comparison of the use of flow control versus partial pressure control of the reactive gas. The latter allows operation in the transition region between the metallic and poisoned states of the target, and films can be deposited at much higher rates with excellent properties using partial pressure control compared to flow control of the reactive gas. Along with using partial pressure control, it is important to use the right type of power to assure that there is no arcing during the deposition. Which type of power to use and along with which partial pressure sensor are reviewed. Large area coating presents special challenges for the control of the reactive gas, and the need for multiple gas inlets along the length of a long cathode and sensing in each gas inlet zone are discussed. The requirements for a partial pressure control system along with commercially available controllers are presented. Multiple gas reactive sputtering and reactive high power pulsed magnetron sputtering (HPPMS) are emerging areas that are advancing the state of the art for reactive sputtering. How they work and what factors are important for controlling these two processes are discussed.
Topical Outline:
* Basics of reactive sputtering
* Flow control versus partial pressure control of the reactive gas
* Power supplies for reactive sputtering
* Reactive gas sensors
* Large area reactive sputtering
* Control systems for reactive sputtering
* Multiple gas reactive sputtering
* Reactive high power pulsed magnetron sputtering
Instructor: Bill Sproul, Reactive Sputtering, Inc.
Bill Sproul is the founder and owner of Reactive Sputtering, Inc. Prior to starting his own company, he worked at Advanced Energy Industries, the Borg-Warner Corporation, Northwestern University, and Sputtered Films, Inc. Throughout his career he has been involved with the sputter deposition of hard materials for wear and corrosion applications. He is the author or co-author of more than 149 technical papers. He has 11 patents to his credit, and he is the inventor of the high rate reactive sputtering process. He is a past president of the American Vacuum Society, and he chaired the International Conference on Metallurgical Coating and Thin Films (ICMCTF) three times. He is an AVS Fellow, and in 2003 he received the SVC Mentor Award and the AVS Thornton Award. He is currently serves on the SVC Board of Directors, and he is the ICMCTF treasurer.
